Portion of a matrix for surface mount package leadframe

Information

  • Patent Grant
  • D488136
  • Patent Number
    D488,136
  • Date Filed
    Friday, January 3, 2003
    21 years ago
  • Date Issued
    Tuesday, April 6, 2004
    20 years ago
Abstract
Description




FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;




FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,




FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.



Claims
  • The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
US Referenced Citations (21)
Number Name Date Kind
3698074 Helda et al. Oct 1972 A
4118859 Busler Oct 1978 A
4234666 Gursky Nov 1980 A
4298883 Komatsu et al. Nov 1981 A
4633582 Ching et al. Jan 1987 A
4809054 Waldner Feb 1989 A
4818960 Satoh et al. Apr 1989 A
4852250 Andrews Aug 1989 A
4865193 Shimamoto et al. Sep 1989 A
5115299 Wright May 1992 A
5554886 Song Sep 1996 A
5900582 Tomita et al. May 1999 A
6016918 Ziberna Jan 2000 A
6170151 Link et al. Jan 2001 B1
6265761 Ghai Jul 2001 B1
6329710 Corisis et al. Dec 2001 B1
6389672 Ishii et al. May 2002 B1
D465207 Williams et al. Nov 2002 S
6486538 Reiss et al. Nov 2002 B1
6543512 Hamren Apr 2003 B1
6566740 Yasunaga et al. May 2003 B2