This invention relates to potting compounds and more particularly to potting compounds containing a force attenuator. Still more particularly it relates to potting compounds for electronic elements such as ballasts for arc discharge lamps and, in particular, fluorescent lamps.
It is known to apply potting materials to electrical circuits; that is, to encase electrical elements within a container or housing with an enviromnent-impervious material in order to protect the elements, to enhance heat dissipation or to add safety features.
These materials have included epoxy resins and mixtures of asphalt and sand. This invention is concerned principally with the latter.
The asphalt/sand mixture is employed frequently for electronic ballasts for fluorescent lamps because of its low cost and good heat transfer properties. A major problem with this type of potting material is that, because it encapsulates the electrical elements, large forces can be applied to the elements during the typical heating and cooling cycles encountered during use. These large forces have been known to cause failure of the system by causing failure of the solder joints used, for example, in connecting elements to a circuit board.
It is, therefore, an object of the invention to obviate the disadvantages of the prior art.
It is another object of the invention to enhance potting materials.
It is yet another object of the invention to attenuate the forces applied to elements contained within a potting material.
These objects are achieved, in one aspect of the invention, by the provision of a potting compound that comprises a first composition which, when used alone, applies a given force to elements encased within it and a second composition which attenuates that force. Incorporation of the second composition results in a significant reduction in broken solder joints as a failure mode and greatly increases the life of the system with which it is employed.
For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in conjunction with the above-described drawings.
Referring now to the drawings with greater particularity, there is shown in
In a preferred embodiment of the invention the force attenuator comprises from about 0.1 to about 20 wt % of a solvent-refined heavy paraffinic petroleum oil. One suitable compound is Hydrolene® SP125 manufactured by Sunoco Inc. of Philadelphia, Pa. The plot of
The reduction in force achieved by the addition of the force attenuator will lead to fewer ballast failures caused by solder joint fracture.
While there have been shown and described what are at present considered to be the preferred embodiments of the invention, it will be apparent to those skilled in the art that various changes and modifications can be made herein without departing from the scope of the invention as defined by the appended claims.
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2083007 | Delaney | Jun 1937 | A |
4022635 | Earing | May 1977 | A |
4916363 | Burton et al. | Apr 1990 | A |
5386086 | Sayles | Jan 1995 | A |
5726386 | Calhoun | Mar 1998 | A |
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Number | Date | Country | |
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20040137173 A1 | Jul 2004 | US |