Claims
- 1. A power cable comprising a conductor having thereon an insulating layer which comprises a composition comprising from 25 to 35% by weight based on the total amount of said composition of an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of from 25 to 33% by weight, and from 65 to 75% by weight based on the total amount of said composition of polyethylene, said polyethylene containing in the molecule thereof vinyltrimethoxysilane by copolymerization or graft polymerization, said composition containing an organotin compound as a cross-linking catalyst, said insulating layer is cross-linked by the cross-linking reaction of trimethoxysilane groups in said polyethylene in the presence of water.
- 2. A power cable as claimed in claim 1, wherein said polyethylene contains said vinyltrimethoxysilane in an amount of from 0.1 to 5% by weight based on the total amount of said polyethylene.
- 3. A power cable as claimed in claim 2, wherein said polyethylene contains said vinyltrimethoxysilane in an amount of from 0.5 to 3% by weight based on the total amount of said polyethylene.
- 4. A power cable as claimed in claim 1, wherein said ethylene-vinyl acetate copolymer has a melt flow rate of from 0.1 to 30, and said polyethylene has a melt flow rate of from 0.1 to 30.
- 5. A power cable as claimed in claim 4, wherein said ethylene-vinyl acetate copolymer has a melt flow rate of from 0.3 to 5, and said polyethylene has a melt flow rate of from 0.3 to 5.
- 6. A power cable as claimed in claim 1, wherein said ethylene-vinyl acetate copolymer has a vinyl acetate content of from 25 to 30% by weight.
- 7. A power cable as claimed in claim 1, wherein said organo heavy metal compound is selected from the group consisting of dibutyltin dilaurate, dibutyltin diacetate and dibutyltin dioctanate.
- 8. A power cable as claimed in claim 1, wherein said composition contains said organotin compound in an amount of from 0.005 to 1% by weight based on the total amount of said composition.
- 9. A power cable as claimed in claim 8, wherein said composition contains said organotin compound in an amount of from 0.02 to 0.2% by weight based on the total amount of said composition.
Parent Case Info
This is a continuation of application Ser. No. 08/326,346 filed Oct. 20, 1994, now abandoned, which is a file wrapper continuation of 07/628,878 filed Dec. 18, 1990 which is now abondoned.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
4092488 |
Hayami et al. |
May 1978 |
|
4117195 |
Swarbrick et al. |
Sep 1978 |
|
4413066 |
Isaka et al. |
Nov 1983 |
|
4514539 |
Hattrich et al. |
Apr 1985 |
|
Non-Patent Literature Citations (3)
Entry |
Chemical Abstracts, vol. 91, No. 10, abstract No. 75355g. |
WPIL, File Supplier, AN-89-282044/39. |
English Translation of JP-B-54-44109. |
Continuations (2)
|
Number |
Date |
Country |
Parent |
326346 |
Oct 1994 |
|
Parent |
628878 |
Dec 1990 |
|