The present invention relates to a power conversion device formed by stacking stages on which power conversion units are mounted.
Power conversion devices have conventionally been known, each of which is formed by stacking stages on which power conversion units are mounted. For example, Japanese Patent Laying-Open No. 10-323015 (PTL 1) discloses a semiconductor power conversion device formed by stacking stages on which a high-speed switching element stack and a high-speed diode stack are mounted.
As the number of stacks of stages on which power conversion units are mounted increases, the center of gravity of the power conversion device increases, to thereby decrease the stability of the power conversion units. As a result, the quake resistance of the power conversion device may decrease.
For example, by fixing support members forming a brace structure between the stages, the quake resistance of the power conversion device can be improved. However, such support members forming a brace structure often need to be precisely designed, for example, in accordance with the distance between the stages of the power conversion device.
The present invention has been made in order to solve the above-described problems, and an object of the present invention is to improve the quake resistance of a power conversion device, which is formed by stacking stages on which power conversion units are mounted, while reducing the manufacturing cost and the assembly cost.
A power conversion device according to the present invention includes: a base; a first stage; a first support portion; a first panel; and a second panel. At least one first power conversion unit is mounted on the first stage. The first support portion extends in a normal direction of the base and is fixed to the base and the first stage. The first panel and the second panel are disposed on the base to support the first stage in the normal direction. The first panel and the second panel are integrally formed to intersect with each other.
According to the power conversion device of the present invention, the first panel and the second panel integrally formed to intersect with each other can improve the quake resistance while reducing the manufacturing cost and the assembly cost.
MMC 2 is connected to a power system 1 through a transformer 4. MMC 2 includes transformer 4 and AC lines UL, VL, WL of three phases (a U-phase, a V-phase, and a W-phase). Transformer 4 includes three primary windings and three secondary windings. These three primary windings each are connected to a corresponding one of power transmission lines 1u, 1v, and 1w of three phases in power system 1. These three secondary windings each are connected to one terminal of a corresponding one of AC lines UL, VL, and WL.
MMC 2 further includes arms A1 to A3. Arm A1 is connected between the other terminal of AC line UL and the other terminal of AC line VL. Arm A2 is connected between the other terminal of AC line VL and the other terminal of AC line WL. Arm A3 is connected between the other terminal of AC line WL and the other terminal of AC line UL. In other words, arms A1 to A3 are connected by delta connection.
Each of arms A1 to A3 has a plurality of power conversion units U connected in series. Each of the plurality of power conversion units U performs bidirectional power conversion according to a control signal from controller 3.
Each of base posts P11 to P25 extending in the normal direction of base BS1 (in a Z-axis direction) is fixed to base BS1 and stage ST1. Power conversion units U1 to U8 are mounted on stage ST1. Base posts P11 to P25 have outer peripheral portions including their respective insulators G11 to G25. Specifically, base posts P11 to P25 each have an outer peripheral surface formed of an insulating material. Thus, base posts P11 to P25 each having an outer peripheral surface formed of an insulating material can suppress electric shock due to contact with base posts P11 to P25 even when a potential difference arises between base BS1 and stage ST1 during the operation of power conversion device 100.
Each of support members S1a and S1b is disposed on base BS1 to support stage ST1 in the Z-axis direction. Since support members S1a and S1b suppress shaking of stage ST1, the quake resistance of power conversion device 100 can be improved.
As shown in
Since panels S11 and S12 are orthogonal to each other, stage ST1 is supported by panels S11 and S12 in a well-balanced manner against vibrations in any direction, so that the quake resistance of power conversion device 100 can be further improved. Furthermore, since each of panels S11 and S12 is formed of an insulating material, the potential difference between base BS1 and stage ST1 caused during the operation of power conversion device 100 is maintained, so that the influence on the operation of power conversion device 100 can be prevented.
Referring again to
Each of support members S2a and S2b is disposed on stage ST1 to support stage ST2 in the Z-axis direction. Since support members S2a and S2b suppress shaking of stage ST2, the quake resistance of power conversion device 100 can be improved.
As shown in
Panels S21 and S22 are orthogonal to each other while panels S21 and S23 are orthogonal to each other. Thereby, stage ST2 is supported by panels S21 to S23 in a well-balanced manner against vibrations in any direction, so that the quake resistance of power conversion device 100 can be further improved. Furthermore, each of panels S21 to S23 is formed of an insulating material. Thereby, the potential difference between stages ST1 and ST2 caused during the operation of power conversion device 100 is maintained, so that the influence on the operation of power conversion device 100 can be prevented.
As shown in
As to support members S9a to S9d in
As to support members S1a and S1b in
Support members S9a to S9d need to be designed more precisely than support members S1a, S1b, S2a, and S2b. Thus, the manufacturing cost for each of support members S9a to S9d may be higher than the manufacturing cost for each of support members S1a, S1b, S2a, and S2b. By using support members S1a, S1b, S2a, and S2b, the manufacturing cost for power conversion device 100 can be reduced below the manufacturing cost for power conversion device 900.
Furthermore, each of support members S9a to S9d needs to be fixed to base BS1 and stage ST1. Similarly, each of support members S9e to S9h needs to be fixed to stages ST1 and ST2. On the other hand, support members S1a and S1b do not need to be fixed to base BS1 and stage ST1, and also, support members S2a and S2b do not need to be fixed to stages ST1 and ST2. Thus, the assembly cost for power conversion device 900 in
As described above, according to the power conversion device in the embodiment, the quake resistance can be improved while reducing the manufacturing cost and the assembly cost.
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the meaning and scope equivalent to the terms of the claims.
1 power system, 1u to 1w power transmission line, 3 controller, 4 transformer, 100, 900 power conversion device, A1 to A3 arm, BS1 base, G1 to G9, G11 to G25 insulator, P1 to P9 stage post, P11 to P25 base post, S1, S1b, S1a, S2b, S2a, S2, S9a to S9h support member, S11, S12, S21 to S23 panel, ST1, ST2 stage, U, U1 to U16 power conversion unit, UL, VL, WL AC line.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2018/027311 | 7/20/2018 | WO |
Publishing Document | Publishing Date | Country | Kind |
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WO2020/017033 | 1/23/2020 | WO | A |
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Number | Date | Country | |
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20210273576 A1 | Sep 2021 | US |