The subject matter presented herein relates generally to methods and systems for phase adjusting signals communicated within and between integrated-circuit components.
Computers commonly include memory modules, printed-circuit boards on which are mounted integrated-circuit (IC) memory devices or packages of memory devices. Memory modules support the memory devices physically and provide interconnectivity for signals used to read from and write to the memory devices. These signals include the data to be stored in (written) or retrieved from (read) the memory devices, data strobes that serve as timing references for accompanying data signals, read and write commands, addresses specifying storage locations in the memory devices, and one or more clock signals that serve as timing references for command and address signals.
Synchronizing communication between a memory controller and a collection of memory devices can be difficult. In a write transaction, for example, the memory controller issues write-data signals to the memory devices with a strobe signal timed to the data signals. The memory devices time receipt of the data to the strobe. The command and address signals take different paths to the memory devices than do the data signals and are timed to a different reference, the clock signal. Data and clock signals thus arrive at the memory devices with a timing offset.
Some memory modules distribute a clock signal to the memory devices in a “fly-by” topology in which the clock signal reaches each memory device in succession along a fly-by path so that the memory devices experience different clock timing. Each memory device thus requires bespoke timing calibration to synchronize the arriving clock signal with the associated data or data-strobe signal. At higher data rates, timing may be so critical that each data signal requires precise timing calibration. Memory modules can have hundreds of data nodes and calibrating each data signal can be power and area intensive. There is therefore a demand for more efficient means for timing calibration across large numbers of signals and nodes.
The illustrations are by way of example, and not by way of limitation. Like reference numerals similar elements.
Clock filter 105 includes a phase-locked loop (PLL) 120, a phase interpolator 125, a delay-setting register 130, a control register 135, and a feedback path 140 with a series of delay elements 145 and 147. Clock filter 105 removes phase noise from clock signal Ck to deliver the filtered reference clock signal RefCk. Phase interpolator 125, when an enable signal Plen is asserted, interpolates between phases of clock signal RefCk to issue an interpolated clock signal IntCk that can vary over a range of phases. Feedback path 140 to an input of PLL 120 simulates a load, and therefore the delay, associated with the destinations of delayed clock signals CK[N:0]. PLL 120 adjusts the phase of reference clock signal RefCk to minimize the phase error between (i.e., to “lock”) clock signal Ck and feedback signal FbCk.
Fractional delay circuit 110 includes N+1 independently adjustable passive delay elements 145, one for each clock signal CKfd[N:0]. These elements 145 are structurally identical to the one in feedback path 140; however, the element 145 in feedback path 140 has a control input (not shown) tied to a value corresponding to a minimum delay setting, whereas the control inputs to the elements 145 within fractional delay circuit 110 are available to a tuning circuit 155. Tuning circuit 155 is thus able to adjust the delays through fractional delay circuit 110. Feedback paths 140 mimics the forward clock path to track supply-voltage and temperature fluctuations.
A multiplexer 150 selectively directs each clock signal CKfd[N:0] to a tuning circuit 155 that controls the delays through passive delay elements 145. Delay elements 145 are passive in that they do not rely on an external power source, in contrast to the active, powered phase interpolator 125. In one embodiment, for example, each delay element 145 exhibits a programable RC (for resistive and capacitive) time constant that can be changed by selecting more or fewer resisters in series, capacitors in parallel, or both. Delay elements 145 are “fractional” in that they impose delays on reference clock signal RefClk that are fractions of the period of clock signal RefClk. In one embodiment, for example, each delay element 145 selectively imposes a delay that is an integer multiple of period of clock signal RefClk divided by a power of two (e.g. 2{circumflex over ( )}6=64). Each delay element 145 can thus be controlled to introduce from zero to 63/64th of one clock cycle.
Tuning circuit 155 includes a zero-phase detector 160 and a finite state machine 165. Zero-phase detector 160 asserts a zero-phase output signal ZP when the phase of interpolated clock signal IntClk is phase aligned with a clock signal CKfd[x] selected from one of delay elements 145. State machine 165 issues control signals DCb on a like-named bus to all N+1 delay elements 145. Each delay element 145 includes a storage element (not shown) that can latch the value expressed on bus DCb. Enable lines En[N:0], one to each delay element 145, allow state machine 165 to enable and calibrate each delay element 145 one at a time. Fixed delay circuit 115 includes N+1 delay elements 147 and a control circuit 175 that can independently control the delay through elements 147. Delay circuit 115 can be included to make gross delay adjustments to account for signal-propagation delays for lower-frequency operation.
In general, phase interpolators are substantially larger and less energy efficient than passive delay elements but advantageously tend to produce less phase noise, or “jitter.” Timing-calibration circuit 100 benefits from the quality of clock signal IntClk during calibration while limiting both the number and usage of this power-hungry circuit. This fractional-delay calibration scheme is especially efficient for systems that include large numbers of signals that benefit from fractional-delay calibration.
The phase adjustment of step 215 can be carried out in the manner detailed at the right side of
Module 300 includes e.g. eighteen DRAM components 305 on one or both sides of a printed-circuit board. Each component 305 may include multiple DRAM die, or multiple DRAM stacked packages. Each DRAM component 305 communicates four-bit-wide (×4, or a “nibble”), though different data widths and different numbers of components and dies can be used in other embodiments. Module 300 also includes nine data-buffer components 310, or “data buffers.” Each data-buffer component 310 directs data between two DRAM components 305 and two data ports DQu and DQv of a module connector 312. Each DRAM component 305 communicates ×4 data, and each data-buffer component 310 communicates ×8 data from two simultaneously active DRAM components 305. Though not shown here, each DRAM component 305 also communicates a complementary pair of timing reference signals (e.g. strobe signals) that time the transmission and receipt of data signals.
A memory controller (not shown) directs command, address, control, and clock signals on primary ports DCA and DCNTL to control the flow of data to and from module 300 via eighteen groups of data links DQu and DQv to module data connections 314. An address-buffer component 315, alternatively called a “Registering Clock Driver” (RCD), selectively interprets and retransmits the control signals on a module control interface 316 (signals DCA and DCNTL) from module control connections 318 and communicates appropriate command, address, control, and clock signals to a first set of memory components 305 via a first memory-component control interface 320A and to a second set of memory components via a second memory-component control interface 320B. Addresses associated with the commands on primary port DCA identify target collections of memory cells (not shown) in components 305, and chip-select signals on primary port DCNTL and associated with the commands allow address-buffer component 315 to select individual integrated-circuit DRAM dies, or “chips,” for both access and power-state management. Data-buffer components 310 and address-buffer component 315 each acts as a signal buffer to reduce loading on module connector 312. This reduced loading is in large part because each buffer component presents a single load to module connector 312 in lieu of the multiple DRAM dies each buffer component serves.
Each of the nine data-buffer components 310 communicates eight-wide data for a total of 72 data bits. In general, N*64 data bits are encoded into N*72 signals, where N is an integer larger than zero (in modern systems, N is usually 1 or 2), where the additional N*8 data bits allow for error detection and correction.
Each component on module 300 can include one or more instance of a timing-calibration circuit 350 like circuit 100 of
While the present invention has been described in connection with specific embodiments, variations of these embodiments will be obvious to those of ordinary skill in the art. For example, the timing-calibration circuitry can be used to advantage outside of memory systems. Moreover, some components are shown directly connected to one another while others are shown connected via intermediate components. In each instance the method of interconnection establishes some desired electrical communication between two or more circuit nodes, or terminals. Such interconnection may often be accomplished using a number of circuit configurations, as will be understood by those of skill in the art. Therefore, the spirit and scope of the appended claims should not be limited to the foregoing description. Only those claims specifically reciting “means for” or “step for” should be construed in the manner required under the sixth paragraph of 35 U.S.C. § 112.
Number | Date | Country | |
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63277314 | Nov 2021 | US |