The present invention relates to power modules having current sensing capabilities, such as but not limited to power modules operable within a vehicle.
A power module may be configured to filter, rectify, invert, or otherwise manipulate electrical energy. The components comprising the power module may be selected according to the manipulation provided by the power module and the attendant power demands. Greater power demands are typically required of power modules used to manipulate electrical energy at higher voltage levels due to increased current requirements. This can be problematic, for example, in fully or partially, electrically-driven vehicles, such as but not limited to electric vehicles (EV) and hybrid electric vehicles (HEVs), where a high voltage source may be used to electrically power a motor used to drive the vehicle since the higher voltage can increase current carrying demands and electrical interferences.
The present invention is pointed out with particularity in the appended claims. However, other features of the present invention will become more apparent and the present invention will be best understood by referring to the following detailed description in conjunction with the accompany drawings in which:
A fifth terminal 44, or shunt terminal, is used to support connection of a shunt 46 between one or the output terminals 38 and at least one of the switches. The terminals 20, 22, 24, 36, 38, 44, each may include a conducting insert 50 positioned relative to a fastener opening.
A resin or other material 78 may be poured within the recess to be cured over the circuit 12. Optionally, the entire circuit 12 may be covered by the resin 78. The housing 54 is preferably, but not necessarily, comprised of a relative rigid and non-conducting material, such as but not limited to plastic, ceramic or the like, so that the housing 54 can act as an insulator/heat conductor and to provide structural support. A bottom of the housing may include or be connected to a coldplate 80 that extends widthwise and lengthwise thereacross to further facilitate heat dissipation. Optionally, the housing 54 may be a conductor and/or include conducting potions. Apertures 82, with threaded or non-threaded channels, may be included on a perimeter, and if necessary elsewhere, to facilitate mechanically connecting the housing 54 to a vehicle, such as with the use of a corresponding fastener.
The placement of the shunt 46 can be seen to be generally above the circuit 12 on a plane shared by the first, second, and third input terminals 20, 22, 24 and the first and second output terminal 36, 38. The second busbar 42 may be positioned above the shunt 46 and above the shared plane so that the shunt 46 and second busbar 42 can be fastened to the housing 54 with the same fastener 66. While the second busbar 42 is shown to be above the shared plane, the shunt 46 may be lowered, such as by including a corresponding relief within the housing 54, so that the second busbar 42 connects to the housing 54 at the same shared plane. The busbars 28, 30, 32, 40, 42 may be helpful in supporting the relatively high current demands of a traction motor, a high voltage battery, or other higher current demanding elements. The busbars 28, 30, 32, 40, 42 may be desired over wires or other conductors because they are rigid elements that can be electrically connected to the circuit 12 and shunt 46 with the illustrated fasteners 60, 62, 64, 66, 68, and optionally, without having to weld, solder, or otherwise adhered thereto.
Once the circuit 12 is positioned within the housing 54 and the busbars 28, 30, 32, 40, 42 are a secured to the terminals 20, 22, 24, 36, 38, 44 and the shunt 46 may be disposed above the circuit 12 and shunt 46. The PCB 16 may include control electronics 88 operable to control opening and closing of each of the switches or other elements of the circuit 12 and measurement electronics 90 operable to measure a voltage drop between first and second shunt pins 72, 74 adhered to the shunt 46. The PCB 16 includes first and second electrically conducting apertures 92, 94 above the first and second shunt pins 72, 74 to establish an electrical connection between each of the shunt pins 72, 74 and the measurement electronics 90. The shunt pins 72, 74 may be rigid, L-shape pins having a pad 96, 98 adhered to the shunt 46 and a leg 100, 102 projecting upwardly through the PCB. The shunt pad 96, 98 may be welded or otherwise adhered to the shunt 46 and the shunt leg 100, 102 may be soldered or otherwise adhered to the PCB 16.
The shunt 46 may be comprised of a first material 104, such as but not limited to copper, disposed on opposite first and second sides of a second material 106, such as but not limited to manganin. The second material 106 may be a measurement grade material having relatively known electrically resistivity in order to facilitate measuring the voltage drop therethrough. As shown, the shunt pins 72, 74 are positioned proximate to each boundary between the first 104 and second material 106 without covering the second material 106. The shunt 46 may also be sized and shaped to match the size and shape off the busbars 28, 30, 32, 40, 42, or the cross-sections thereof, such that the shunt 46 may have a cross-section, if not also a length, that matches or is the same as the busbars 28, 30, 32, 40, 42.
In the illustrated configuration, the shunt 46 extends over at least a portion of the circuit 12. An area between a bottom of the shunt 46 and a top of the circuit 12 may be insulated by the resin 78 optionally poured overtop of the circuit 12 and/or with another insulator, such as with a pad or other element adhered to the bottom of the shunt 46. The shunt 46 is positioned between the one of the switches of the circuit 12 and the second busbar 42 such that all current passing through the second busbar 42 must pass through the shunt 46, thereby allowing it to be measured with the measurement electronics 90. The circuit 12 may be controlled with the controller 14 by way of signals carried through one or more connection pins 70 included with the housing 54 to support electrical connect with the PCB 16 and the monitor of other measurement parameters, such as temperature.
The module 200 is shown to be configured to support rectifying single-phase AC to DC, such as to support vehicle charging from a domestic wall outlet having 110V, at 60 Hz. The power module 200 includes first and second input 220, 222 and output terminals 224, 226 to establish electrical connections to respective input and output busbars (not shown).
Planar portions 242, 244, 246, 248 of the conducting layer 230 may extend outwardly to align with input and output terminals. The planar portions 242, 244, 246, 248 may be defined as extensions having the same cross-sectional width and shapes to rest of the conducting layer 230. Fasteners (not shown) may extend through opening in the planar potions to mechanically and electrically connect to the terminals and corresponding input and output busbars or wires (not shown). The circuit 209 may be positioned below a top layer 250 of the PCB 204 having electronics 252 for controlling the circuit 209 and measuring a voltage drop across the shunt 202.
As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms. The figures are not necessarily to scale, some features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for the claims and/or as a representative basis for teaching one skilled in the art to variously employ the present invention. The features of various implementing embodiments may be combined to form further embodiments of the invention.
While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention. Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention.
Number | Name | Date | Kind |
---|---|---|---|
5196987 | Webber et al. | Mar 1993 | A |
5274528 | Noschese et al. | Dec 1993 | A |
5300917 | Maue et al. | Apr 1994 | A |
5351165 | Hancock | Sep 1994 | A |
5375954 | Eguchi | Dec 1994 | A |
5608595 | Gourab et al. | Mar 1997 | A |
5764487 | Natsume | Jun 1998 | A |
5831425 | Ochiai | Nov 1998 | A |
6079920 | Dispenza | Jun 2000 | A |
6181590 | Yamane et al. | Jan 2001 | B1 |
6327165 | Yamane et al. | Dec 2001 | B1 |
6434008 | Yamada et al. | Aug 2002 | B1 |
6843335 | Shirakawa et al. | Jan 2005 | B2 |
6866527 | Potega | Mar 2005 | B2 |
6900986 | Kimoto et al. | May 2005 | B2 |
6903457 | Nakajima et al. | Jun 2005 | B2 |
7046518 | Golightly et al. | May 2006 | B2 |
7149088 | Lin et al. | Dec 2006 | B2 |
7289329 | Chen et al. | Oct 2007 | B2 |
7301755 | Rodriguez et al. | Nov 2007 | B2 |
7436672 | Ushijima et al. | Oct 2008 | B2 |
20020034088 | Parkhill et al. | Mar 2002 | A1 |
20050051874 | Ushijima | Mar 2005 | A1 |
20060086981 | Yamaguchi et al. | Apr 2006 | A1 |
20060092611 | Beihoff et al. | May 2006 | A1 |
20060202666 | Laig-Hoerstebrock et al. | Sep 2006 | A1 |
20070051974 | Azuma et al. | Mar 2007 | A1 |
20070052505 | Simpson | Mar 2007 | A1 |
20070246812 | Zhuang | Oct 2007 | A1 |
20080030208 | Aratani | Feb 2008 | A1 |
20080266803 | Golhardt et al. | Oct 2008 | A1 |
20080316710 | Seto et al. | Dec 2008 | A1 |
20090002956 | Suwa et al. | Jan 2009 | A1 |
20090058334 | Yamamoto | Mar 2009 | A1 |
20090294195 | Otsuka et al. | Dec 2009 | A1 |
20100148298 | Takano et al. | Jun 2010 | A1 |
Number | Date | Country |
---|---|---|
2925014 | Jul 2007 | CN |
Number | Date | Country | |
---|---|---|---|
20110292617 A1 | Dec 2011 | US |