Power semiconductor module

Information

  • Patent Grant
  • D1037187
  • Patent Number
    D1,037,187
  • Date Filed
    Thursday, May 12, 2022
    2 years ago
  • Date Issued
    Tuesday, July 30, 2024
    3 months ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/02
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L224/08054
    • H01L23/58
    • H05B41/14
    • G02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/428
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a right, front, top perspective view of a power semiconductor module showing our new design;



FIG. 2 is a front elevation view thereof;



FIG. 3 is a left side elevation view thereof;



FIG. 4 is a top plan view thereof; and,



FIG. 5 is a bottom plan view thereof.


The broken lines are shown for environmental purposes only and form no part of the claimed design.


All surfaces not shown form no part of the claimed design.


Claims
  • The ornamental design for a power semiconductor module, as shown and as described.
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Non-Patent Literature Citations (2)
Entry
IGBT Module PIM,https://www.fujielectric.com/products/semiconductor/model/igbt/pim.html,2023. (Year: 2023).
FS820R08A6P2BBPSA1,https://www.mouser.com/ProductDetail/Infineon-Technologies/FS820R08A6P2BBPSA1?qs=%252BbzPfv9VPAH4B6v94SM3qg%3D%3D&mgh=1&gclid=EAlalQobChMIrO3dl8iOgAMVDi3UAR2mgQMbEAkYAiABEgKdZfD_BwE,Copyright © 2023 Mouser Electronics, Inc. (Year: 2023).