The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.
Number | Date | Country | Kind |
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2021-006000 D | Mar 2021 | JP | national |
2021-006001 D | Mar 2021 | JP | national |
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D1664282 | Jul 2020 | JP |
Entry |
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First Office Action issued for Chinese Patent Application No. 202130628320.2, dated May 6, 2023, 2 pages including English machine translation. |