Power semiconductor module

Information

  • Patent Grant
  • D1056861
  • Patent Number
    D1,056,861
  • Date Filed
    Monday, September 20, 2021
    3 years ago
  • Date Issued
    Tuesday, January 7, 2025
    3 months ago
  • US Classifications
    Field of Search
    • US
    • D13 123
    • D13 154
    • D13 173
    • D13 178
    • D13 182
    • D13 184
    • D13 199
    • D15 144
    • D15 1441
    • D15 199
    • CPC
    • H01L21/67303
    • H01L21/67306
    • H01L21/67309
    • H01L21/67126
    • H01L21/67757
    • H01L21/67748
    • H01L21/683
    • H01L21/68728
    • H01L21/6875
    • H01L51/56
    • H01L51/0001
    • H01L43/12
    • H01L43/22
    • H01L31/18
    • H01L35/34
    • H01L39/24
    • C23C16/44
    • C23C16/45
    • C30B25/10
  • International Classifications
    • 1302
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a second embodiment of a power semiconductor module showing our new design;



FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof; and,



FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5.


The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.


Claims
  • The ornamental design for a power semiconductor module, as shown and described.
Priority Claims (2)
Number Date Country Kind
2021-006000 D Mar 2021 JP national
2021-006001 D Mar 2021 JP national
US Referenced Citations (13)
Number Name Date Kind
3352726 Luce Nov 1967 A
D642996 Miyake Aug 2011 S
D664506 Kuzuoka Jul 2012 S
D692843 Masuda Nov 2013 S
D701843 Masuda Apr 2014 S
D832227 Chikamatsu Oct 2018 S
10262928 Kondo Apr 2019 B2
D934821 Taguchi Nov 2021 S
11522058 Kachi Dec 2022 B2
11538936 Shimizu Dec 2022 B2
20080197471 Suzuki Aug 2008 A1
20190115465 Konishi Apr 2019 A1
20210296226 Yokoyama Sep 2021 A1
Foreign Referenced Citations (1)
Number Date Country
D1664282 Jul 2020 JP
Non-Patent Literature Citations (1)
Entry
First Office Action issued for Chinese Patent Application No. 202130628320.2, dated May 6, 2023, 2 pages including English machine translation.