Power semiconductor module

Information

  • Patent Grant
  • D1021831
  • Patent Number
    D1,021,831
  • Date Filed
    Monday, September 20, 2021
    2 years ago
  • Date Issued
    Tuesday, April 9, 2024
    26 days ago
  • US Classifications
    Field of Search
    • US
    • D13 123
    • D13 154
    • D13 173
    • D13 178
    • D13 182
    • D13 184
    • D13 199
    • D15 144
    • D15 1441
    • D15 199
    • CPC
    • H01L21/67303
    • H01L21/67306
    • H01L21/67309
    • H01L21/67126
    • H01L21/67757
    • H01L21/67748
    • H01L21/683
    • H01L21/68728
    • H01L21/6875
    • H01L51/56
    • H01L51/0001
    • H01L43/12
    • H01L43/22
    • H01L31/18
    • H01L35/34
    • H01L39/24
    • C23C16/44
    • C23C16/45
    • C30B25/10
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a first embodiment of a power semiconductor module showing our new design;



FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof; and,



FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5.


Claims
  • The ornamental design for a power semiconductor module, as shown and described.
Priority Claims (2)
Number Date Country Kind
2021-005998 D Mar 2021 JP national
2021-005999 D Mar 2021 JP national
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Foreign Referenced Citations (1)
Number Date Country
D1664282 Jul 2020 JP