The present invention relates to alternating current (AC) and direction current (DC) electrical circuits, and more specifically, to power plugs and sockets.
Power plugs and sockets connect electric equipment to a power supply in buildings and at other sites. Business offices and commercial premises, in particular, often require a large number of power sockets at various locations along office walls to power computers, photocopiers, lighting, phone chargers, and other equipment. Even with a tangle of extension cords and power strips, a room may not have enough sockets to accommodate the number of appliances. Access to other sockets may be obstructed. For instance, office furniture and architectural room features (e.g., support columns, desks, and cabinets) may limit socket availability. Other accessibility problems can arise when an office is remodeled, and furniture and appliances are relocated.
According to one embodiment of the present invention, a method includes providing a socket module including a first conducting layer and a second conducting layer. An insulating layer may be positioned in between the first and second conducting layers. The method may also include providing a plug that includes a first prong having a first length and second prong having a second length, where the first length is longer than the second length. When the plug is plugged into the socket module, the first prong electrically couples to the second conducting layer, and the second prong electrically couples to the first conducting layer.
According to another embodiment, an apparatus includes a socket module including a first conducting layer and a second conducting layer. The apparatus further includes an insulating layer positioned in between the first and second conducting layers. A plug includes a first prong having a first length and second prong having a second length, where the first length is longer than the second length. When the plug is plugged into the socket module, the first prong electrically couples to the second conducting layer, and the second prong electrically couples to the first conducting layer.
According to another particular embodiment, an apparatus includes a first insulating layer and a first conducting layer positioned below the first insulating layer. A second insulating layer may be positioned below the first conducting layer, and a second conducting layer may be positioned below the first insulating layer. A third insulating layer may be positioned below the second conducting layer. At least the first and second conducting layers, and the first and second insulating layers may be penetrable by prongs of a plug.
An embodiment of a power outlet system includes a plug having pins of different lengths and a multilayered power socket module. The power socket module may include a substantially planar board having five layers. For instance, a first, a third, and a fifth layer of the power socket module, may include insulation material. A second and a fourth layer of the power socket module may include conductive material. The conductive material of the layers may be connected to either a positive or a negative pole.
The plug of an embodiment may include two pins of differing lengths. When being plugged into the power socket module, a longer pin of the plug may pierce (e.g., break or puncture) to a lower conducting layer (e.g., the fourth layer) of the power socket module. The piercing may function to couple the longer pin to the further layer. A shorter pin may connect to an upper layer (e.g., the second layer) of the power socket module. In this manner, the plug and power socket modules are electrically connected.
According to an embodiment, one or more power socket areas of a power socket module each have pin-to-conductor-conduction. The system may electrically link the conductive layers of the power socket module to pins of the electrical plug when inserted into the power socket area. The power socket areas may be selectively positioned at any and all locations along the power socket module. That is, when the pins of the electrical plug are inserted into the power socket module, an electrical connection may be made between the pins and the power source through the pin-to-conductor-conduction-mechanism and the elongated-electrical-conductor.
In certain embodiments, power socket modules may be cut to fit any shape and size. The power socket modules may further be connected to one another as needed to provide more plug-in area and connectivity. To this end, power socket modules may include power connectors to attach to one another, as well as hinges or other fasteners to provide a structural connection between power socket modules. A power socket module may be flexible. For instance, one or more power socket modules may wrap around a rounded column.
In one embodiment, the pins of the plug may penetrate, or plug into, the power socket module anywhere along a surface of the power socket module. Additionally, users may plug any number of appliance plugs into the power socket module. Moreover, users do not have to align plugs according to an orientation or plug design of conventional sockets. In some embodiments, power socket modules may be repositioned to accommodate the rearrangement of desks, computers and other office equipment according to a new office layout without requiring significant rewiring.
Turning particularly to the Drawings,
A second layer 108 of the power socket module 102 may include conductive material, such as conductive grid material. The second layer 108 may be electrically charged by a power source (not shown). As shown in
A third layer 110 may include insulation material that may be pierced by the prongs 118, 120 of the plug 104. Illustrative insulation material may include rubber, plastic, cotton, foam, fiberglass, and paper, among other known electrically insulating materials. The third layer 110 may be resilient and reform to substantially its original shape after being pierced by the longer prong 118.
A fourth layer 112 of the power socket module 102 may include conductive material, such as conductive grid material. The fourth layer 112 may be electrically charged by a power source (not shown). As shown in
A fifth layer 114 may include insulation material that may or may not be configured to be penetrable. The layers 106, 108, 110, 112, 114 of the power socket module 102 may be formed or otherwise fastened to one another, for instance, using heat treatment or adhesives. As shown in
The prongs 118, 120 of the plug 104 of an embodiment of the system 100 have different lengths. The prongs 118, 120 may be made of conductive material shaped and otherwise configured to pierce at least the first two layers 106, 108 of the power socket module 102. For instance, the prong 118, 120 may include pointed or conical tips to puncture the layers 106, 108, 110, 112, 114 of the power socket module 102.
As shown in the embodiment of the system 100 of
The shorter prong 120 of the plug 104 may pierce only the first two layers 106, 108. In this manner, the shorter prong 120 may be in electrical contact with only the second conducting layer 108 (e.g., and not the fourth conducting layer 112).
While the power socket module 102 of
As depicted in
A frame 308 may contain the insulated surface and other layers of the first power socket module 302. The frame 308 may be constructed from rigid or semi-rigid insulating material. As shown in
The second power socket module 304 may be similarly or identically constructed to the first power socket module 302. As such, the second power socket module 304 may include a top insulating surface 314 and a frame 316. Flexible hinge joints 318, 320 or other fasteners (e.g., screws, adhesives, clips) may physically connect the first and second power socket modules 302, 304 to provide more plug-in area and connectivity.
While the first and second power socket modules 302, 304 in the embodiment of
At 404, a first conducting layer may be positioned under the first insulating layer. The layers may be adhered or otherwise attached directly. The conducting layer may include conductive material, such as conductive grid material. The first conducting layer may be electrically charged by a power source.
A second insulating layer may be positioned under the first conducting layer at 406. Similarly, a second conducting layer may be positioned under the second insulating layer at 408. A third insulating layer may be positioned under the second conducting layer at 410, and a frame may be positioned around all of the layers at 412. A power connection and adjacent power socket module connection may be provided in the frame at 414.
A plug configured for use with the power socket module may be provided at 416. The plug may have at least two prongs, but may have more. The prongs may be different lengths. An insulating portion, such as the insulating portion 212 shown in
At 508, a plug may be plugged into the power socket module. The plug may include a first prong having a first length and second prong having a second length. The first length may be longer than the second length. When the plug is plugged into the power socket module, the first prong may electrically couple at 510 to the second conducting layer. The second prong may at 512 electrically couple to the first conducting layer. In terms of the embodiment of the system shown in
Power may be provided to an appliance at 514 from the source power socket module via the plug. Embodiments of the system may be used for both AC and direction current (DC) applications. In one embodiment, the pins of the plug may penetrate, or plug into, the power socket module anywhere along a surface of the power socket module. Additionally, users may plug any number of appliance plugs into the power socket module. Moreover, users do not have to align plugs according to an orientation or plug design of conventional sockets.
The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
In the following, reference is made to embodiments presented in this disclosure. However, the scope of the present disclosure is not limited to specific described embodiments. Instead, any combination of the following features and elements, whether related to different embodiments or not, is contemplated to implement and practice contemplated embodiments. Furthermore, although embodiments disclosed herein may achieve advantages over other possible solutions or over the prior art, whether or not a particular advantage is achieved by a given embodiment is not limiting of the scope of the present disclosure. Thus, the following aspects, features, embodiments and advantages are merely illustrative and are not considered elements or limitations of the appended claims except where explicitly recited in a claim(s). Likewise, reference to “the invention” shall not be construed as a generalization of any inventive subject matter disclosed herein and shall not be considered to be an element or limitation of the appended claims except where explicitly recited in a claim(s).
The present invention may be a system or a method. Aspects of the present invention are described herein with reference to flowchart illustrations and/or block diagrams of methods, and apparatus (systems or circuits) according to embodiments of the invention.
The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more instructions. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
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Number | Date | Country | |
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20210028574 A1 | Jan 2021 | US |