Patent Application
20110242766
1. Field of the Invention
The present invention generally relates to an electronic apparatus and a heat dissipation module thereof, and more particularly, to a power supply and a heat dissipation module thereof.
2. Description of Related Art
In the modern time where the electronic industry has fully developed, most of various electronic apparatuses employs a power supply for providing electric power. Generally, the major function of a power supply is to convert an alternating current (AC) into a stable direct current source (DC source) required by various electronic apparatuses.
The electronic components in a power supply would generate thermal energy during the operation. Therefore, a heatsink is employed and disposed in the power supply for dissipating heat to avoid the electronic components from getting excessively high temperature. The heatsink directly contacts the casing of the power supply so as to transfer the heat out of the casing. With such a disposition design however, the casing of the power supply would get a quite high temperature so that a user easily accidentally touches the casing to get scalded.
Accordingly, the present invention is directed to a power supply, which is able to reduce the excessively high temperature of the casing thereof.
The present invention is also directed to a heat dissipation module, which is able to reduce the excessively high temperature of the casing of a power supply.
The present invention provides a power supply, which includes a casing, a printed circuit board (PCB) and a heat dissipation module. The casing has a top cover. The PCB is disposed in the casing and has a heat-generating element. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.
In an embodiment of the present invention, the above-mentioned heat-generating element is a diode.
The present invention provides a heat dissipation module suitable for a power supply. The power supply includes a casing, a PCB. The casing has a top cover. The PCB is disposed in the casing and has a heat-generating element. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.
In an embodiment of the present invention, the power supply has a first interval between the above-mentioned heat dissipation plate and the PCB, the power supply further has a second interval between the top cover and the PCB and the second interval is greater than the first interval.
In an embodiment of the present invention, the above-mentioned heat dissipation module further includes a plurality of fixing pillars fixed between the heat dissipation plate and the casing.
In an embodiment of the present invention, the material of the above-mentioned fixing pillars is copper.
In an embodiment of the present invention, the above-mentioned heat dissipation module further includes a heat-conducting pad disposed on the surface of the heatsink and contacting the heat dissipation plate.
In an embodiment of the present invention, the above-mentioned heat dissipation plate has a plurality of through holes.
Based on the depiction above, the present invention disposes the heat dissipation plate on the heatsink and located between the top cover of the casing and the heatsink so that the heatsink transfers the thermal energy to the heat dissipation plate instead of transferring the thermal energy to the casing. In this way, the present invention can reduce the excessively high temperature of the casing and avoid a user from accidentally touching the top cover to get scalded.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
The heat dissipation module 130 is for conducting heat dissipation on the heat-generating element 122 of the PCB 120. The heat dissipation module 130 includes a heatsink 132 and a heat dissipation plate 134, wherein the heatsink 132 is disposed at the PCB 120 and contacts the heat-generating element 122, and the heatsink 132 has a surface 132a facing the top cover 112. The heat dissipation plate 134 is disposed between the heatsink 132 and the top cover 112 and contacts the surface 132a of the heatsink 132. The thermal energy generated by the heat-generating element 122 can be transferred to the heatsink 132 and the heat dissipation plate 134 so as to avoid an excessively high temperature of the heat-generating element 122 to downgrade the operation performance thereof.
In the embodiment, the thermal energy of the heatsink 132 is conducted to the heat dissipation plate 134 instead of being conducted to the casing 110. As a result, the temperature of the casing 110 is not excessively high, which is advantageous in avoiding a user from accidentally touching the top cover 112 of the casing 110 to get scalded. In more details, in the embodiment, there is a first interval D1 between the heat dissipation plate 134 and the PCB 120, there is a second interval D2 between the top cover 112 and the PCB 120, and the second interval D2 is greater than the first interval D1. In this way, neither the heat dissipation plate 134 nor the heatsink 132 would contact the top cover 112 of the casing 110, which is advantageous in avoiding the thermal energy of the heat dissipation plate 134 or the heatsink 132 is conducted to the top cover 112.
In addition, referring to
In summary, the present invention disposes the heat dissipation plate on the heatsink and located between the top cover of the casing and the heatsink so that the heatsink can transfer the thermal energy to the heat dissipation plate not to the casing. In this way, the present invention can reduce the excessively high temperature of the casing and avoid a user from accidentally touching the casing to get scalded. In addition, the heat dissipation plate has a plurality of through holes to enhance the air convection inside the power supply so as to further increase the heat dissipation efficiency.
It will be apparent to those skilled in the art that the descriptions above are several preferred embodiments of the present invention only, which does not limit the implementing range of the present invention. Various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention.
