Power supply contact for installation of printed circuit board

Information

  • Patent Grant
  • 9166313
  • Patent Number
    9,166,313
  • Date Filed
    Wednesday, March 4, 2015
    10 years ago
  • Date Issued
    Tuesday, October 20, 2015
    9 years ago
Abstract
A power supply contact is mountable on a base of a device having a geometry for receiving a power supply and for surface installation of a printed circuit board. The power supply contact includes a base plate mountable on the base of the device, a rail extends upwardly from the base plate, a power supply terminal and an adaptor connecting the rail to the power supply terminal. The rail is in electrical contact with the printed circuit board and the power supply terminal is in electrical contact with the power supply when the printed circuit board and the power supply are installed in the device.
Description
BACKGROUND OF THE INVENTION

The present invention, in some embodiments thereof, relates to a contact clip for a printed circuit board (hereafter referred to as “PCB”) and, more particularly, but not exclusively, to a contact for connection to a power supply for surface installation of a PCB with reduced stress on the PCB.


U.S. Pat. No. 6,722,916 to Buccinna et al. discloses an electronic component that includes a PCB having first and second battery contacts. A battery clip having a bottom portion is connected to the first battery contact. The battery clip also includes a top portion spaced from the PCB with a tab extending from the top portion in a downward direction toward PCB. A coin cell battery is arranged between the battery clip and the second battery contact. The present invention battery clip biases the battery into engagement with the second battery contacts with the tab. The second battery contacts may be provided by a solder bump or a printed circuit preferably arranged in a criss-cross waffle shaped pattern. The battery clip is secured to the first battery contacts preferably by applying a solder paste that is heated to electrically join the battery clip to the first battery contacts.


U.S. Pat. No. 7,501,587 to English discloses clips that may be compatible with surface mount technology. The clips may be surface mountable to a substrate for allowing repeated releasable attachment and detachment of a shielding structure thereto. In one exemplary embodiment, a clip generally includes a base member having generally opposed first and second side edge portions. Two or more arms extend generally upwardly in a first direction from the base member. The clip also includes a generally flat pick-up surface configured to enable the clip to be picked up by a head associated with pick-and-place equipment.


U.S. Pat. No. 7,488,181 to Van Haaster discloses contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.


U.S. Pat. No. 7,034,223 to Fan discloses a PCB mounting apparatus including a supporting plate defining a number of through holes, a number of standoffs engaging in the through holes, and a number of grounding members attached to the standoffs. The standoff each includes a head having a holding portion, a flange a post, and a base. The grounding member each includes a first ring supported on the flange, a second ring supported on the base, and a band connecting therebetween. The PCB defines a number of fixing apertures. The combined standoff and grounding member is disposed in the through hole. The PCB is placed upon the supporting plate with the fixing apertures engaging the holding portions of the standoffs and contacts the first rings of the grounding members. The standoffs and the grounding members are made of conductive materials.


BRIEF SUMMARY OF THE INVENTION

According to an aspect of some embodiments of the present invention there is provided method of mounting a PCB to a power supply including pushing the PCB into position on a mounting, and simultaneously engaging mechanically a PCB-to-power-contact connected to the PCB to a PCB contact connected to the mounting and electrically connecting the PCB-to-power-contact to the PCB contact.


According to some embodiments of the invention, the engaging includes forming a friction contact between the PCB-to-power-contact and the PCB contact.


According to some embodiments of the invention, the engaging includes clasping a rail from opposite sides.


According to some embodiments of the invention, the engaging includes sliding the rail between two fingers, wherein the two fingers are mounted parallel to a direction of the pushing.


According to some embodiments of the invention, the sliding includes elastically deforming the fingers to admit the rail between the fingers.


According to some embodiments of the invention, a first force between at least one of the fingers and the rail is at least partially balanced by a second of the forces between at least a second of the fingers and the rail.


According to some embodiments of the invention, the net force on the rail is less than a tenth of the sum of the magnitudes of individual forces on the rail.


According to some embodiments of the invention, the method may further include directing the PCB to the position with a guide.


According to some embodiments of the invention, the method may further include fixing a location of the PCB contact with respect to the mounting.


According to some embodiments of the invention, the method may further include locating a power supply terminal separate from the fixing of the PCB contact.


According to some embodiments of the invention, the method may further include joining the PCB contact to the power supply terminal with an adaptor element.


According to some embodiments of the invention, the pushing is in a direction substantially perpendicular to a plane of the PCB.


According to some embodiments of the invention, after the engaging, the PCB-to-power-contact resists disconnection from the PCB contact without requiring an external force.


According to some embodiments of the invention, after the engaging, the PCB-to-power-contact resists disconnection from the PCB contact.


According to some embodiments of the invention, after the engaging, the electrical connecting remains stable without stressing the PCB.


According to an aspect of some embodiments of the present invention there is provided a system for mounting a PCB to a power supply including: a PCB contact positioned on a mounting for the PCB, a PCB-to-power-contact positioned on the PCB, and a friction contact mechanically engaging and electrically connecting the PCB-to-power-contact to the PCB contact without requiring an external force from the PCB.


According to some embodiments of the invention, wherein the friction contact includes at least two fingers extending perpendicular to a plane of the PCB, the fingers configured for sliding onto opposite sides of a rail.


According to some embodiments of the invention, in an unstressed state the fingers are positioned on opposite sides of a gap and wherein the gap is configured for sliding a rail into the gap, elastically deforming the fingers to grasp opposite sides of the rail.


According to some embodiments of the invention, during the mechanical engaging, the at least two fingers are elastically stressed by the rail in opposing directions by forces from the rail that at least partially counter balance each other, the net force being less than the sum of the magnitudes individual forces.


According to some embodiments of the invention, the stresses on the fingers are in a direction substantially parallel to a plane of the PCB.


According to some embodiments of the invention, during the mechanical engaging, the at least two fingers are elastically stressed by the rail in opposing directions by forces from the rail that at least partially counter balance each other, the net force being less than a tenth of the sum of the magnitudes individual forces.


According to some embodiments of the invention, the system may further include: a guide positioned on the mounting, the guide configured to direct the positioning prior to the engaging of the friction contact.


According to some embodiments of the invention, a position of the PCB contact is fixed with respect to the mounting.


According to some embodiments of the invention, the system may further include: a power supply terminal and wherein a position of the power supply terminal is fixed separately from the fixing of the PCB.


According to some embodiments of the invention, the system may further include: an adaptor element joining the PCB contact to the power supply terminal.


According to some embodiments of the invention, the friction contact is configured for the engaging in response to pushing in a direction substantially perpendicular to a plane of the PCB.


According to some embodiments of the invention, after the engaging, the PCB-to-power-contact resists disconnection from the PCB contact without requiring an external force.


According to some embodiments of the invention a power supply contact is mountable on a base of a device having a geometry for receiving a power supply and for surface installation of a PCB. The power supply contact includes a base plate mountable on the base of the device, a rail extends upwardly from the base plate, a power supply terminal and an adaptor connecting the rail to the power supply terminal. The rail is in electrical contact with the PCB and the power supply terminal is in electrical contact with the power supply when the PCB and the power supply are installed in the device.


Unless otherwise defined, all technical and/or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention pertains. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of embodiments of the invention, exemplary methods and/or materials are described below. In case of conflict, the patent specification, including definitions, will control. In addition, the materials, methods, and examples are illustrative only and are not intended to be necessarily limiting.





BRIEF DESCRIPTION OF THE DRAWINGS

Some embodiments of the invention are herein described, by way of example only, with reference to the accompanying drawings. With specific reference now to the drawings in detail, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of embodiments of the invention. In this regard, the description taken with the drawings makes apparent to those skilled in the art how embodiments of the invention may be practiced.


In the drawings:



FIG. 1 is a flowchart showing a method of connecting a PCB to a power supply in accordance with an embodiment of the present invention;



FIG. 2 is a perspective view of two battery contacts being mounted to a base in accordance with an embodiment of the present invention;



FIGS. 3A-B are a perspective views of two battery contacts in accordance with an embodiment of the present invention;



FIGS. 4A-B are overhead schematic views of battery contacts mounted to a base in accordance with alternate exemplary embodiments of the present invention;



FIG. 5 is a perspective view of a PCB with PCB-to-power-contacts in accordance with an embodiment of the present invention;



FIGS. 6A-C are three views of a PCB-to-power-contact in accordance with an embodiment of the present invention;



FIG. 7 is schematic side view of mounting a PCB in accordance with an embodiment of the present invention;



FIG. 8 is perspective cut away view of a mounted PCB in accordance with an embodiment of the present invention;



FIGS. 9A-B are front cut away views of mounted PCBs in accordance with alternate exemplary embodiments of the present invention, and



FIGS. 10A-B are block diagrams of a PCB before and after mounting in accordance with an embodiment of the present invention.





DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION

The present invention, in some embodiments thereof, relates to a contact clip for a printed circuit board and, more particularly, but not exclusively, to a contact for connection to a power supply for surface installation of a printed circuit board with reduced stress on the PCB.


Overview
Quick Contact for Mounting a PCB to a Device Power Supply

An aspect of some embodiments of the current invention relates to a modular system for mounting a PCB to a device. Modularity may optionally allow replacement of one or more parts without changing the PCB. In this way, it may be possible to change for example the geometry of the device and/or the type of batteries keeping the same PCB and/or PCB contact structure. This may be useful for medical devices where any minor change may require extensive testing and approval of each part that has been changed.


In some embodiments an adaptor element, for example a battery contact, may interconnect between a PCB and an interchangeable part, for example a power supply. For example, a single PCB may be used in multiple models of medical infusers. Optionally different models may include different power supplies. In some embodiments of an infuser, a power supply may be exchanged for a power supply having a different geometry by changing the geometry of the infuser housing to fit the new power supply while keeping the mounting area for the PCB unchanged. Optionally the geometry of the battery contacts may be adjusted to connect between the changed power supply and the unchanged PCB. Optionally, mounting of the PCB may by simple surface mounting without requiring an extra step for connecting the power supply (for example soldering and/or insertion of a plug in a socket). This may optionally facilitate uniform automated assembly of a device containing the PCB.


In some embodiments, a PCB may be mounted by z-assembly. For example the PCB may be mounted from a disconnected state to a connected state by a single vertical push onto a mounting. Power contacts may be optionally be connected by simple z-mounting (for example by pushing the PCB linearly into place). Optionally once connected the power contacts may resist disengagement.


In some embodiments, of a modular system, the battery cavity may be separate from the PCB contacts. For example, the power supply may include a battery cavity and battery terminals. The battery terminals may be in electrical connection with PCB contacts. The location of the terminals may be controlled for example by the shape of the battery cavity while the location of the PCB contacts may be fixed by a PCB contact guide.


An aspect of some embodiments of the current invention relates to a quick power connector for mounting a printed circuit board to a device. The quick connector may simplify disconnection of the PCB for proper disposal and/or recycling.


Drop in Compression and/or Friction Contacts with Reduced Stress on the PCB

An aspect of some embodiments of the current invention relates to compression contacts and/or friction contacts that may connect between a PCB and a power supply when the PCB is dropped into place on a mount. For example, when a PCB is placed on a mounting metal clips may contact a mounting rail. When the PCB is pushed into place the clips may optionally slide onto the rail and/or clasp the rail from opposite sides. Optionally the contact in itself may supply an interface and/or a stable connection and/or an electrical interconnection between the PCB and a power supply. Grasping forces may optionally make a friction and/or pressure contact that remains in contact with the rail without requiring a constant force from the PCB. The grasping forces may optionally make a friction and/or pressure contact that once connected resists disconnection from the rail without requiring an external force, for example from the PCB. The forces of clasping may be balanced on opposite sides of the rail without requiring a constant counter force from the PCB or the rail. When the PCB is placed on the mounting it may be guided by guide members. For example in some embodiments the force needed to engage the clip to a rail may range between 0.01 and 10 N. The engagement force of each clip may be added to the force to push the PCB into place. For example in some embodiments once connected the clip may resist a disengagement force ranging between 0.05 and 1.0 N. The disengagement force of each clip may be added to the force required to disengage the PCB from its mount. Optionally the force to push the PCB into place and/or the disengagement force may be perpendicular to the plane and the PCB. Optionally the force to push the PCB into place and/or the disengagement force may be in the direction of insertion of the PCB. Optionally the force to push the PCB into place and/or the disengagement force may be perpendicular to a PCB mount.


For example in some embodiments as a PCB is lowered into place via z-assembly, the contacts may interconnect. For example, a clip may have fingers directed parallel to the direction of insertion of the PCB and/or perpendicular to the plane of the PCB. Optionally the fingers may have a gap into which a rail penetrates, as the PCB is pushed into place. The width of gap may range, for example, between 0.3 to 1.0 mm. For example in some embodiments the length of fingers may range between 1 and 4 mm. For example in some embodiments the length of the clip may range between 1 and 10 mm. For example in some embodiments the width of the clip may range between 0.5 and 2.0 mm. For example in some embodiments the thickness of the rail grasped by the clip may range between 0.05 and 0.5 mm.


In some embodiments, the contacts of the current invention may reduce stress on a PCB and/or on mounts used to hold a PCB. For example, the current invention may avoid use of a spring contact that pushes against a contact plate requiring a counter force from the PCB mountings. In some cases, such forces from spring mounts on the PCB may cause mounting pins and/or the PCB to deform over time. Such deformations may in some cases reduce reliability.


For example the PCB contacts may include a clip and a corresponding rail. The contact between the PCB and the power supply may be made by the clip grasping the rail from two sides without stressing the PCB. Alternatively or additionally, the contact between the PCB and the power supply may use a clip that grasps the PCB locally. In some embodiments, the clip may balance stresses locally without requiring counter forces from the PCB mountings. Suitable clip contacts may include for example S1711 and/or S1721 shielding clips available from Harwin Inc., 7B Raymond Avenue, Unit 11, Salem, N.H. 03079, USA. Specifications are published as the S1711 and/or S1721 Customer Information Sheet which are incorporated herein by reference.


In some embodiment power supply clips and/or respective contacts may extend between the base and the PCB. A PCB mount may be configured to extend between the base and the PCB while the PCB is adjacent to the base. Optionally, the guide may direct the PCB into position before the power supply clips reach the contacts.


Exemplary Detailed Embodiments

Before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not necessarily limited in its application to the details of construction and the arrangement of the components and/or methods set forth in the following description and/or illustrated in the drawings and/or the Examples. The invention is capable of other embodiments or of being practiced or carried out in various ways.


Method of Mounting PCB

Referring now to the drawings, FIG. 1 is a flow chart illustration of an exemplary embodiment of a method of mounting a PCB into a device with a power supply contacts. In the exemplary embodiment of FIG. 1, the power supply includes batteries, a battery cavity and battery contacts. Optionally, the battery contacts are installed into the device separately from the PCB. The battery contacts may optionally include a battery terminal in electrical connection with a PCB contact. Optionally the battery terminals are supported and/or located separately from the PCB contact. The PCB may optionally be lowered onto mounts that may serve also as guides for positioning the PCB and then onto the contacts without requiring an extra step of for example soldering and/or plugging in a power cord.


In some embodiment, a power supply terminal may be installed 101 into the base of the device. Optionally, guides for directing engagement of a PCB contact may be fixed 102 in a PCB mounting (for example the PCB mounting may include a section of the base having a PCB positioning guide and/or a PCB contact guide for directing 105 placement of the PCB and/or fixing 102 a location of a PCB contact). In some embodiments, the terminal supports and/or the PCB positioning guides and/or the PCB contact locators may optionally be separate and/or independent from each other. In some embodiments, the terminal supports and/or the PCB positioning guides and/or the PCB contact locator may optionally be located in a specified relative geometry. The PCB mounts may optionally be long enough that they direct 105 positioning of the PCB while it is adjacent to the mounting base before PCB-to-power-contacts on the PCB reach the PCB contacts on the mounting.


In some embodiments an adapter element may join 103 the PCB contacts to the power supply terminals. For example, the terminals may be installed 101 into the base with a terminals support (for example a battery cavity) and/or the PCB contacts may be precisely fixed 102 in their location (for example on the PCB mounting) by a PCB contact guide and/or the PCB contact may be joined 103 to the terminal by a flexible conductive metal ribbon.


In some embodiments installing 101 power terminals and/or fixing 102 PCB contacts and/or joining 103 the contacts to the terminals may be performed simultaneously. For example, a single piece battery contact (for example the contacts 220, 220′ of FIGS. 3A-B) may be a single piece including power terminals (for example the terminals 228, 228′ (for example see detailed view of FIGS. 3A-B)) and/or a joining element (for example the ribbon 225, 225′) and/or a PCB contact (for example the rail 226). Optionally lowering the contact 220, 220′ onto a base (for example by z-assembly) may simultaneously accomplish installing 101 power terminals and/or fixing 102 PCB contacts and/or joining 103 the contacts to the terminals.


In some embodiments, the PCB contact may be secured 111 to the PCB mounting. For example, the PCB locator includes a mounting pin; the battery contacts may be secured 111 by hot melting the mounting pins.


In some embodiments, after the PCB contacts are in place, the PCB may be installed simply by positioning 104 the PCB adjacent to the mounting. When the PCB is positioned 104 next to the mounting it may optionally engage a PCB guide. The PCB guide may, for example, direct 105 the PCB into its correct position on the mounting. Optionally, gentle push 106 may engage the PCB-to-power-contact to on the PCB to the PCB contact on the PCB mounting.


In some embodiments, mounting may be simple vertical lowing of the PCB onto the base. Optionally mounting may not require complex motions and/or action (for example tilting and/or translating the PCB, and/or soldering contacts and/or plugging in cords). For example, the PCB guide may include a mounting pin. Optionally during positioning 104 the mounting pin may optionally enter holes in the PCB and direct 105 the PCB while it is being pushed 106 into position on the mounting. Optionally, pushing 106 the PCB onto the mounting may engage a PCB-to-power-contact installed on the PCB to a PCB contact on the mounting thereby electrically connecting 107 the PCB to the power supply. For example, PCB-to-power-contact may include a clip and the PCB contact may include a rail. The clip may, optionally, slide onto and/or grasp the PCB contacts. Alternatively or additionally, PCB contact may include a clip that grasps a rail on the PCB.


In some embodiments a test circuit may be included in the PCB. The test circuit may be used to test 108 whether the PCB is in good electrical connection with the PCB contacts.


In some embodiments the PCB may be secured 109 into the base. For example if the PCB mounts are mounting pins, the PCB may be secured 109 by hot melting the mounting pins.


In some embodiments, once the PCB has been mounted, various components may be connected 110 to the surface of the PCB. For example, there may be contacts for an electric motor and/or a rotation sensor for the motor and/or other sensors and/or power supply contacts.


Installing Battery Contacts

Referring now to further drawings, FIG. 2 is a perspective view of installation of battery contacts (for example contacts 220 and 220′) into a base (for example base 230) according to an embodiment of the invention. FIGS. 3A-B are detailed perspective views of exemplary battery contacts 220, 220′. An exemplary relationship is depicted between the battery terminal supports 236, 236′ and the PCB contact guides 232. FIG. 2 also illustrates other components of base 230, for example PCB guides 234, 234′.


In some embodiments, positive and negative battery connectors 220, 220′ respectively, may be lowered into place on a plastic base 230. For example a negative terminal 228 may be supported by a negative terminal support 236 and/or a positive terminal 228′ may be supported by a positive terminal support 236′.


In some embodiments, battery terminal 228 may have multiple redundant fingers, each independently contacting the battery. If one of the fingers is blocked (for example by corrosion and/or dirt), the other finger may supply contact and/or electrical connection.


In some embodiments, PCB connectors may include a rail 226 and a base plate 222. Optionally the base plate 222 may be mounted to the base 230 using guides 232. Guides 232 may optionally pass through holes 224 in the base plate 222 to hold the rail 226 in precise locations for connecting to the PCB. The battery terminals 228, 228′ may optionally be electrically joined to the rails 226, 226′ via a thin metal ribbons 225, 225′. The metal ribbons 225, 225′ may optionally be flexible. Flexibility of the ribbons 225, 225′ may optionally facilitate the guides 232 fixing of the rails 226 in their proper location separately from the supporting of the terminals 228, 228′. Flexibility may optionally facilitate fixing of the rails 226 in their proper location regardless of small imprecision and/or movements in the location of the terminals 228, 228′. Connection between the terminals 228, 228′ and the PCB connecting the rails 226 may optionally be formed by an adaptor element according to the particular geometry of a device, for example the base 230. For example, an adapter element may include a conducting ribbon that is adapted to the base geometry. For example, the ribbon 225 is straight while the ribbon 225′ is bent.


In some embodiments, the ribbon 225 may have a cut out 227 portion. For example, the cut out portion 227 may allow part of the battery support 236 to pass through the ribbon 225. In the exemplary embodiment of FIG. 4A, the part of battery support 236 passing through the cut out 227 has a triangular form. The support 236 passing through the cut out 227 may, optionally, guide the ribbon 225 and/or stabilize the ribbon 225 in position.


In some embodiments, the battery connectors 220, 220′ are monolithic elements. For example, each connector 220, 220′ may be made of a single piece of metal. Alternatively or additionally, each connector 220, 220′ may be made of multiple components.


Modification of the Power Source without Changing the PCB

Referring now to further drawings, FIGS. 4A and 4B illustrate an example of modifying a power source without modifying a PCB that controls a device using the power source.



FIG. 4A is an over head illustration of the embodiment of FIGS. 2 and 3. In the example of FIG. 4A the power source includes the battery terminals 228, 228′ and the supports 236, 236′ and is configured for holding three AG13 button batteries (not shown).



FIG. 4B is an over head illustration of an alternative embodiment of a device including a modified connector 220″. In the example of FIG. 4B a base 230′, the battery terminals 228, 228″ and the supports 236,236″ are configured for holding three AG12 button batteries (not shown). AG 12 batteries may be smaller than AG13 batteries. To accommodate the smaller batteries, the supports 236″ and 236 are closer together than the corresponding supports 236, 236′ of base 230. Nevertheless, the PCB connectors (rails 226) of the battery connectors remain in the same locations. In order to connect the terminal 228″ to its corresponding PCB connector rail 226′ in the modified geometry of FIG. 4B, the ribbon 225″ is optionally bent in an opposite direction from ribbon 225′.


Clip Contacts

Referring now to further drawings, FIG. 5 is a perspective view illustration of an exemplary embodiment of a PCB 540 with a PCB-to-power-contact, for example the clips 550, for connecting to a power source. FIGS. 6A-C are detail views of an exemplary clip 550.



FIG. 5 illustrates an exemplary embodiment clip 550 mounted on the bottom of a PCB 540. For example, the clips 550 extend downward from the bottom of the PCB 540 in a direction substantially perpendicular to the plane of PCB 540. In some embodiments, a PCB (for example PCB 540) may include guide holes 524, 524′. Pins (for example PCB guides 234, 234′) may line up with guides holes 524, 524′ to position the PCB 540 for proper mounting (for example to the base 230). In the exemplary embodiment of the PCB 540 and the base 230, the guide 234 fits in the hole 524 located between the clips 550. The close proximity of the guide 234 and the guide hole 524 to the clips 550 may facilitate precise locating of the clips 550 as they are lowered onto the rails 226.



FIG. 6A is a perspective view of an exemplary embodiment of the clip 550. The clip 550 optionally includes a base 554 for connecting to a contact on the PCB 540. The clip 550 optionally includes two sent of fingers 552. Optionally, the fingers 552 and the base 554 are formed from a single integral piece of metal, for example of spring steel.


In alternative exemplary embodiment a clip contact may have more or less than four fingers. For example, a clip may have three fingers, for example one finger in the middle and opposing fingers on either side. Optionally, a clip may have five, six or more fingers.



FIGS. 6B and 6C illustrate a side view of an exemplary embodiment of a contact clip (for example clip 550). The base of the fingers 552 may optionally be bent until the fingers 552 close together. The end of fingers 552 may be bent back outward to produce the gap 553. As illustrated in FIG. 6C, the clip 550 may be lowered onto a rail (for example the rail 226) having the form of a vertical metal plate. The rail 226 slides into the gap 553. As the clip 550 is pushed downward, the rail 226 pushes apart the fingers 552 and slides between the fingers 552.


In some embodiments, as the fingers 552 spread, admitting the rail 226 into the gap 553, the fingers 552 are elastically deformed. The fingers 552 may optionally spring back to grasp the rail 226 from two sides, for example as illustrated in FIG. 6C. Contact between the fingers 552 and the rail 226 may supply an electrical connection between the PCB 540 and the PCB contacts.


In some embodiments, friction and/or compression forces between the fingers 552 and the rail 226 may resist disconnection. The forces and/or torques produced by the contact between the fingers 552 and the mounting plate 226 may optionally be balanced such that the clip 550 holds to the rail 526 without requiring an external restraining force and/or torque for example from the base 230 and/or the PCB 540 and/or the guides 234 and/or the guides 232 that join them without requiring an external force to hold the clip 550 to the rail 226. For example, opposite fingers 552 may apply forces to the rail in opposite directions. In the example friction between the fingers 552 and the rail 226 may resist disconnection according to the sum of the magnitude of the force between the fingers 552 and the rail 226. The net force and or torque on the base 554 and or the rail 226 may be the vector sum of the forces and/or torques. Opposite forces and torques may have vector forces that substantially nullify each other. For example, in some embodiments the net force may range between half and a tenth of the sum of the force magnitudes. For example, in some embodiments the net force may be less than a tenth the sum of the force magnitudes. Additionally or alternatively, other mounting clips (for example various forms of grounding clips) may be used as contacts between a PCB and a power supply.


Mounting a PCB with Power Source Connecting Contacts

Referring now to further drawings, FIG. 7 is a schematic partial cutaway side view of the mounting of an exemplary PCB 540 onto an exemplary base 230 and FIG. 8 is a perspective front cutaway view of the PCB 540 and the base 230 showing the fingers 552 clasping the rails 226.


As illustrated in FIG. 7, pushing the PCB 540 onto the base 230 guided by the guides 234, 234′ may optionally bring together the clip 550 and the rail 226 in a desired direction. For example, the clip 550 may contact with the rail 226 in a direction substantially perpendicular to the plane of the PCB 540. Bringing together the clip 550 and the rail 226 in the desired direction may optionally mechanically engage the clip 550 to the rail 226 and complete a connection between the clip 550 and the rail 226 supplying an electrical connection between the power supply and the PCB 540. The resulting engagement is illustrated in FIG. 8. Installing the PCB 540 to the mounting of the base 230 may optionally be completed by hot melting the top of the guide 234, 234′ to secure the PCB 540 into place. The guides 232 are illustrated in FIGS. 8, 9A and 9B after hot melting.



FIGS. 9A and 9B illustrate close up schematic partial cutaway views of two alternate exemplary embodiments of the PCB power connection clips 550, 950. For example, FIG. 9A illustrates an embodiment that corresponds to FIGS. 2-8 wherein a clip 550 mounted on the bottom of the PCB 540 connects to a rail 260 on the battery contacts 220. FIG. 9B illustrates an alternative embodiment wherein a rail 926 mounted on the bottom of the PCB 540 connects to a clip 950 on the battery contacts 220.


FIGS. 9A,B also illustrate that in the exemplary embodiments of FIGS. 4A,B the guide 234 is optionally longer than the combined lengths of corresponding pairs of the rails 226 or 926 and the clips 550 or 950. As the PCB 540 is positioned over the base 230, the guides 234 optionally enter holes 524 before the clip 550, 950 contacts corresponding the rail 226,926. The guide 234 may guide the rails 226, 926 to precisely slide into the gaps 553, 953 of corresponding the clips 550, 950.


A System for Connecting a PCB to a Power Supply

Referring now to further drawings, FIGS. 10A, B are block diagrams of a system for mounting a PCB to a power supply. FIG. 10A shows the system before mounting and FIG. 10B shows the system after mounting.


In some embodiments, a PCB 1040 may include a clip 1050 on a face to be mounted onto a base (for example base 1030). The clip 1050 may include for example the clip 550 as described herein above or various clip contacts known in the art (for example as described in U.S. Pat. No. 7,501,587 and/or U.S. Pat. No. 7,488,181 where are incorporated in their entirety by reference into the specification).


In some embodiments, the clip 1050 may form a connection to a clip contact 1026 included in a power contact 1020. For example the connection may be formed by simply pressing the clip 1050 onto the clip contact 1026. Optionally, the forces between the clip 1050 and the clip contact 1026 may be balanced so that they do not require a counter force and/or torque from the PCB 1040 and/or the power contact 1020. An electrical connection 1025 may be supplied between the clip contact 1026 and a battery terminal 1028. In some embodiments the contact 1020 may include a mounting plate 1022 for mounting to the base 1030.


In some embodiments the base 1030 may include the guides 1032 to position the PCB 1040 and/or the contact 1020 during mounting of the PCB 1040 to the base 1030 and the power contact 1020.


In some embodiments the base 1030 may include a terminal support 1036.


It is expected that during the life of a patent maturing from this application many relevant PCB connectors will be developed and the scope of the terms contacts, clips, rails and connectors is intended to include all such new technologies a priori.


As used herein the term “about” refers to ±5%.


The terms “comprises”, “comprising”, “includes”, “including”, “having” and their conjugates mean “including but not limited to”.


The term “consisting of” means “including and limited to”.


The term “consisting essentially of” means that the composition, method or structure may include additional ingredients, steps and/or parts, but only if the additional ingredients, steps and/or parts do not materially alter the basic and novel characteristics of the claimed composition, method or structure.


As used herein, the singular form “a”, “an” and “the” include plural references unless the context clearly dictates otherwise. For example, the term “a compound” or “at least one compound” may include a plurality of compounds, including mixtures thereof.


Throughout this application, various embodiments of this invention may be presented in a range format. It should be understood that the description in range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention. Accordingly, the description of a range should be considered to have specifically disclosed all the possible subranges as well as individual numerical values within that range. For example, the description of a range such as from 1 to 6 should be considered to have specifically disclosed subranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6 etc., as well as individual numbers within that range, for example, 1, 2, 3, 4, 5, and 6. This applies regardless of the breadth of the range.


Whenever a numerical range is indicated herein, it is meant to include any cited numeral (fractional or integral) within the indicated range. The phrases “ranging/ranges between” a first indicate number and a second indicate number and “ranging/ranges from” a first indicate number “to” a second indicate number are used herein interchangeably and are meant to include the first and second indicated numbers and all the fractional and integral numerals therebetween.


It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination or as suitable in any other described embodiment of the invention. Certain features described in the context of various embodiments are not to be considered essential features of those embodiments, unless the embodiment is inoperative without those elements.


All publications, patents and patent applications mentioned in this specification are herein incorporated in their entirety by reference into the specification, to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated herein by reference. In addition, citation or identification of any reference in this application shall not be construed as an admission that such reference is available as prior art to the present invention. To the extent that section headings are used, they should not be construed as necessarily limiting.

Claims
  • 1. A power supply contact mountable on a base of a device having a geometry for receiving a power supply and for surface installation of a printed circuit board, the power supply contact comprising: a base plate mountable on the base of the device, the base plate lying in a first plane;a rail extending upwardly from the base plate in a second plane perpendicular to the first plane;a power supply terminal; andan adaptor connecting the rail to the power supply terminal,wherein the rail is in electrical contact with the printed circuit board and the power supply terminal is in electrical contact with the power supply when the printed circuit board and the power supply are installed in the device.
  • 2. The power supply contact according to claim 1, wherein the power supply contact is monolithic.
  • 3. The power supply contact according to claim 1, wherein the adaptor is a flexible ribbon adaptable to the geometry of the base.
  • 4. The power supply contact according to claim 1, wherein the adaptor is a flexible conductive metal ribbon electrically joining the terminal to the rail.
  • 5. A power supply contact mountable on a base of a device having a geometry for receiving a power supply and for surface installation of a printed circuit board, the power supply contact comprising: a base plate mountable on the base of the device;a rail extending upwardly from the base plate;a power supply terminal; andan adaptor connecting the rail to the power supply terminal,wherein the rail is in electrical contact with the printed circuit board and the power supply terminal is in electrical contact with the power supply when the printed circuit board and the power supply are installed in the device, andwherein the base plate has a terminal support which supports the power supply terminal and the adaptor has a cut out portion allowing a part of the terminal support to pass therethrough.
  • 6. The power supply contact according to claim 1, wherein the power supply terminal is an electrically conductive plate.
  • 7. The power supply contact according to claim 1, wherein the power supply terminal has a plurality of redundant fingers, each finger independently connectable to the power supply.
  • 8. The power supply contact according to claim 1, wherein the base plate has a power supply contact guide in the form of a mounting pin which passes through a hole the base plate.
  • 9. The power supply contact according to claim 1, wherein a thickness of the rail ranges between 0.05 and 0.5 millimeters.
  • 10. A device for receiving a battery having a positive battery contact and a negative battery contact and for surface installation of a printed circuit board, the device comprising: a base;a battery cavity in the base;a first terminal support in the battery cavity;a second terminal support in the battery cavity spaced apart from the first terminal support;a first power supply contact comprising: a first base plate mounted in the battery cavity;a first rail extending upwardly from the first base plate;a first power supply terminal comprising an electrically conductive plate supported by the first terminal support, the electrically conductive plate electrically connectable to the negative battery contact; anda first adaptor connecting the first rail to the first power supply terminal; anda second power supply contact comprising: a second base plate mounted in the battery cavity;a second rail extending upwardly from the second base plate;a second power supply terminal comprising a plurality of redundant fingers supported by the second terminal support, each finger independently electrically connectable to the positive battery contact; andan adaptor connecting the rail to the second power supply terminal,wherein the first power supply terminal of the first power supply contact is in electrical connection with the negative battery contact and the second power supply terminal of the second power supply contact is in electrical connection with the positive battery contact when the battery is installed in the battery cavity, andwherein the first rail of the first power supply contact is in electrical contact with the printed circuit board and the second rail of the second power supply contact is in electrical contact with the printed circuit board when the printed circuit board is installed in the device.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 13/873,335, filed Apr. 30, 2013, the entire contents of which are incorporated by reference herein.

US Referenced Citations (514)
Number Name Date Kind
1795630 Wilson Mar 1931 A
2860635 Wilburn Nov 1958 A
3203269 Perrine Aug 1965 A
3212685 Swan et al. Oct 1965 A
3794028 Mueller et al. Feb 1974 A
3994295 Wulff Nov 1976 A
4195636 Behnke Apr 1980 A
4218724 Kaufman Aug 1980 A
4273122 Whitney et al. Jun 1981 A
4300554 Hessberg et al. Nov 1981 A
4403987 Gottinger Sep 1983 A
4435173 Siposs et al. Mar 1984 A
4465478 Sabelman et al. Aug 1984 A
4565543 Bekkering et al. Jan 1986 A
4585439 Michel Apr 1986 A
4599082 Grimard Jul 1986 A
4601702 Hudson Jul 1986 A
4685903 Cable et al. Aug 1987 A
4698055 Sealfon Oct 1987 A
4810215 Kaneko Mar 1989 A
4850966 Grau et al. Jul 1989 A
4867743 Vaillancourt Sep 1989 A
4886499 Cirelli et al. Dec 1989 A
4919596 Slate et al. Apr 1990 A
4929241 Kulli May 1990 A
4950246 Muller Aug 1990 A
D322671 Szwarc Dec 1991 S
5109850 Blanco et al. May 1992 A
5112317 Michel May 1992 A
5131816 Brown et al. Jul 1992 A
5190521 Hubbard et al. Mar 1993 A
5254096 Rondelet et al. Oct 1993 A
5300045 Plassche, Jr. Apr 1994 A
5342313 Campbell et al. Aug 1994 A
5348544 Sweeney et al. Sep 1994 A
5366498 Brannan et al. Nov 1994 A
5383865 Michel Jan 1995 A
5478315 Brothers et al. Dec 1995 A
5482446 Williamson et al. Jan 1996 A
5496274 Graves et al. Mar 1996 A
5501665 Jhuboo et al. Mar 1996 A
5505709 Funderburk et al. Apr 1996 A
5562686 Sauer et al. Oct 1996 A
5593390 Castellano et al. Jan 1997 A
5616132 Newman Apr 1997 A
5643218 Lynn et al. Jul 1997 A
5645955 Maglica Jul 1997 A
5647853 Feldmann et al. Jul 1997 A
5662678 Macklin Sep 1997 A
5672160 Osterlind et al. Sep 1997 A
5690618 Smith et al. Nov 1997 A
D393314 Meisner et al. Apr 1998 S
5766186 Faraz et al. Jun 1998 A
5795675 Maglica Aug 1998 A
5800420 Gross et al. Sep 1998 A
5807375 Gross et al. Sep 1998 A
5814020 Gross Sep 1998 A
5836920 Robertson Nov 1998 A
5848991 Gross et al. Dec 1998 A
5851197 Marano et al. Dec 1998 A
5858001 Tsals et al. Jan 1999 A
5858008 Capaccio Jan 1999 A
5868710 Battiato et al. Feb 1999 A
5931814 Alex et al. Aug 1999 A
5941850 Shah et al. Aug 1999 A
5948392 Haslwanter et al. Sep 1999 A
5954697 Srisathapat et al. Sep 1999 A
5957895 Sage et al. Sep 1999 A
5968011 Larsen et al. Oct 1999 A
5993423 Choi Nov 1999 A
6004297 Steenfeldt-Jensen et al. Dec 1999 A
6033245 Yamkovoy Mar 2000 A
6033377 Rasmussen et al. Mar 2000 A
6064797 Crittendon et al. May 2000 A
6074369 Sage et al. Jun 2000 A
6186982 Gross et al. Feb 2001 B1
6200289 Hochman et al. Mar 2001 B1
6200296 Dibiasi et al. Mar 2001 B1
6224569 Brimhall May 2001 B1
6248093 Moberg Jun 2001 B1
6277095 Kriesel et al. Aug 2001 B1
6277098 Klitmose et al. Aug 2001 B1
6277099 Strowe et al. Aug 2001 B1
6287283 Ljunggreen et al. Sep 2001 B1
6293925 Safabash et al. Sep 2001 B1
6336729 Pavelle et al. Jan 2002 B1
6345968 Shupe Feb 2002 B1
6377848 Garde et al. Apr 2002 B1
6391005 Lum et al. May 2002 B1
6423029 Elsberry Jul 2002 B1
D465026 May et al. Oct 2002 S
6458102 Mann et al. Oct 2002 B1
6485461 Mason et al. Nov 2002 B1
6485465 Moberg et al. Nov 2002 B2
6500150 Gross et al. Dec 2002 B1
6503231 Prausnitz et al. Jan 2003 B1
6511336 Turek et al. Jan 2003 B1
6517517 Farrugia et al. Feb 2003 B1
D471274 Diaz et al. Mar 2003 S
D471983 Hippolyte et al. Mar 2003 S
6558351 Steil et al. May 2003 B1
6589229 Connelly et al. Jul 2003 B1
6595956 Gross et al. Jul 2003 B1
6595960 West et al. Jul 2003 B2
6645181 Lavi et al. Nov 2003 B1
6652482 Hochman Nov 2003 B2
6656158 Mahoney et al. Dec 2003 B2
6656159 Flaherty Dec 2003 B2
6659980 Moberg et al. Dec 2003 B2
6673033 Sciulli et al. Jan 2004 B1
6679862 Diaz et al. Jan 2004 B2
6689118 Alchas et al. Feb 2004 B2
6699218 Flaherty et al. Mar 2004 B2
6722916 Buccinna et al. Apr 2004 B2
6743211 Prausnitz et al. Jun 2004 B1
6749587 Flaherty Jun 2004 B2
6752787 Causey, III et al. Jun 2004 B1
6768425 Flaherty et al. Jul 2004 B2
6786890 Preuthun et al. Sep 2004 B2
6800071 McConnell et al. Oct 2004 B1
6805687 Dextradeur et al. Oct 2004 B2
6824529 Gross et al. Nov 2004 B2
6843782 Gross et al. Jan 2005 B2
6854620 Ramey Feb 2005 B2
6905298 Haring Jun 2005 B1
6908452 Diaz et al. Jun 2005 B2
6960192 Flaherty et al. Nov 2005 B1
6997727 Legrady et al. Feb 2006 B1
7001360 Veasey et al. Feb 2006 B2
7034223 Fan et al. Apr 2006 B2
7048715 Diaz et al. May 2006 B2
7060054 Nissels Jun 2006 B2
7060059 Keith et al. Jun 2006 B2
7097637 Triplett et al. Aug 2006 B2
7128727 Flaherty et al. Oct 2006 B2
7144384 Gorman et al. Dec 2006 B2
D544092 Lewis Jun 2007 S
7225694 Said Jun 2007 B2
7247149 Beyerlein Jul 2007 B2
7250037 Shermer et al. Jul 2007 B2
7267669 Staunton et al. Sep 2007 B2
7291132 DeRuntz et al. Nov 2007 B2
7291159 Schmelzeisen-Redeker et al. Nov 2007 B2
7303549 Flaherty et al. Dec 2007 B2
7344385 Chen Mar 2008 B2
7364570 Gerondale et al. Apr 2008 B2
7390314 Stutz, Jr. et al. Jun 2008 B2
7407493 Cane' Aug 2008 B2
D578210 Muta et al. Oct 2008 S
7455663 Bikovsky Nov 2008 B2
7465290 Reilly Dec 2008 B2
7488181 van Haaster Feb 2009 B2
7497842 Diaz et al. Mar 2009 B2
7501587 English Mar 2009 B2
7503786 Kato et al. Mar 2009 B2
7530964 Lavi et al. May 2009 B2
7547281 Hayes et al. Jun 2009 B2
7565208 Harris et al. Jul 2009 B2
7569050 Moberg et al. Aug 2009 B2
D600341 Loerwald Sep 2009 S
7585287 Bresina et al. Sep 2009 B2
7588559 Aravena et al. Sep 2009 B2
7589974 Grady et al. Sep 2009 B2
D602155 Foley et al. Oct 2009 S
D602586 Foley et al. Oct 2009 S
D604835 Conley Nov 2009 S
7628770 Ethelfeld Dec 2009 B2
7628772 McConnell et al. Dec 2009 B2
7628782 Adair et al. Dec 2009 B2
7637891 Wall Dec 2009 B2
7637899 Woolston et al. Dec 2009 B2
7641649 Moberg et al. Jan 2010 B2
7660627 McNichols et al. Feb 2010 B2
7678079 Shermer et al. Mar 2010 B2
7682338 Griffin Mar 2010 B2
7686787 Moberg et al. Mar 2010 B2
7699829 Harris et al. Apr 2010 B2
7699833 Moberg et al. Apr 2010 B2
7704088 Sakamoto Apr 2010 B2
7704227 Moberg et al. Apr 2010 B2
7704229 Moberg et al. Apr 2010 B2
7704231 Pongpairochana et al. Apr 2010 B2
7708717 Estes et al. May 2010 B2
7713238 Mernoe May 2010 B2
7713240 Istoc et al. May 2010 B2
7717913 Novak et al. May 2010 B2
7722574 Toman et al. May 2010 B2
7736344 Moberg et al. Jun 2010 B2
7744589 Mounce et al. Jun 2010 B2
7749194 Edwards et al. Jul 2010 B2
7776030 Estes et al. Aug 2010 B2
7780637 Jerde et al. Aug 2010 B2
7789857 Moberg et al. Sep 2010 B2
7801599 Young et al. Sep 2010 B2
7806868 De Polo et al. Oct 2010 B2
7828528 Estes et al. Nov 2010 B2
7837659 Bush, Jr. et al. Nov 2010 B2
7846132 Gravesen et al. Dec 2010 B2
7854723 Hwang et al. Dec 2010 B2
7857131 Vedrine Dec 2010 B2
7879025 Jacobson et al. Feb 2011 B2
7918825 O'Connor et al. Apr 2011 B2
7935104 Yodfat et al. May 2011 B2
7935105 Miller et al. May 2011 B2
7938803 Mernoe et al. May 2011 B2
7955305 Moberg et al. Jun 2011 B2
7967784 Pongpairochana et al. Jun 2011 B2
7967795 Cabiri Jun 2011 B1
7981105 Adair et al. Jul 2011 B2
7988683 Adair et al. Aug 2011 B2
7993300 Nyholm et al. Aug 2011 B2
7993301 Boyd et al. Aug 2011 B2
7998111 Moberg et al. Aug 2011 B2
8021357 Tanaka et al. Sep 2011 B2
8025658 Chong et al. Sep 2011 B2
8029469 Ethelfeld Oct 2011 B2
8034019 Nair et al. Oct 2011 B2
8038666 Triplett et al. Oct 2011 B2
8057431 Woehr et al. Nov 2011 B2
8057436 Causey et al. Nov 2011 B2
8062253 Nielsen et al. Nov 2011 B2
8066694 Wagener Nov 2011 B2
D650079 Presta et al. Dec 2011 S
D650903 Kosinski et al. Dec 2011 S
8086306 Katzman et al. Dec 2011 B2
D652503 Cameron et al. Jan 2012 S
8105279 Mernoe et al. Jan 2012 B2
8114046 Covino et al. Feb 2012 B2
8114064 Alferness et al. Feb 2012 B2
8114066 Naef et al. Feb 2012 B2
D657462 Siroky Apr 2012 S
8147446 Yodfat et al. Apr 2012 B2
8152764 Istoc et al. Apr 2012 B2
8152770 Reid Apr 2012 B2
8152779 Cabiri Apr 2012 B2
8152793 Keinanen et al. Apr 2012 B2
8157693 Waksmundzki Apr 2012 B2
8157769 Cabiri Apr 2012 B2
8162674 Cho et al. Apr 2012 B2
8162923 Adams et al. Apr 2012 B2
8167841 Teisen-Simony et al. May 2012 B2
8172591 Wertz May 2012 B2
8172804 Bikovsky May 2012 B2
8182462 Istoc et al. May 2012 B2
8197444 Bazargan et al. Jun 2012 B1
8206351 Sugimoto et al. Jun 2012 B2
8221356 Enggaard et al. Jul 2012 B2
8267921 Yodfat et al. Sep 2012 B2
8287520 Drew et al. Oct 2012 B2
8292647 McGrath et al. Oct 2012 B1
8308679 Hanson et al. Nov 2012 B2
8323250 Chong et al. Dec 2012 B2
8372039 Mernoe et al. Feb 2013 B2
8373421 Lindegger et al. Feb 2013 B2
8409142 Causey et al. Apr 2013 B2
8414557 Istoc et al. Apr 2013 B2
8430847 Mernoe et al. Apr 2013 B2
8469942 Kow et al. Jun 2013 B2
8474332 Bente, IV et al. Jul 2013 B2
8475408 Mernoe et al. Jul 2013 B2
8479595 Vazquez et al. Jul 2013 B2
8495918 Bazargan et al. Jul 2013 B2
8496862 Zelkovich et al. Jul 2013 B2
8512287 Cindrich et al. Aug 2013 B2
8517987 Istoc et al. Aug 2013 B2
8523803 Favreau Sep 2013 B1
8556856 Bazargan et al. Oct 2013 B2
8562364 Lin et al. Oct 2013 B2
8574216 Istoc et al. Nov 2013 B2
8603026 Favreau Dec 2013 B2
8603027 Favreau Dec 2013 B2
8628510 Bazargan et al. Jan 2014 B2
8674288 Hanson et al. Mar 2014 B2
8679060 Mernoe et al. Mar 2014 B2
8690855 Alderete, Jr. et al. Apr 2014 B2
8708961 Field et al. Apr 2014 B2
8751237 Kubota Jun 2014 B2
8753326 Chong et al. Jun 2014 B2
8753331 Murphy Jun 2014 B2
8764707 Moberg et al. Jul 2014 B2
8764723 Chong et al. Jul 2014 B2
8771222 Kanderian, Jr. et al. Jul 2014 B2
8777896 Starkweather et al. Jul 2014 B2
8777924 Kanderian, Jr. et al. Jul 2014 B2
8777925 Patton Jul 2014 B2
8784369 Starkweather et al. Jul 2014 B2
8784370 Lebel et al. Jul 2014 B2
8790295 Sigg et al. Jul 2014 B1
8795224 Starkweather et al. Aug 2014 B2
8795231 Chong et al. Aug 2014 B2
8795260 Drew Aug 2014 B2
8801668 Ali et al. Aug 2014 B2
8801679 Iio et al. Aug 2014 B2
8810394 Kalpin Aug 2014 B2
8814379 Griffiths et al. Aug 2014 B2
8920374 Bokelman et al. Dec 2014 B2
9061104 Daniel Jun 2015 B2
9061110 Avery et al. Jun 2015 B2
9089475 Fangrow Jul 2015 B2
9089641 Kavazov Jul 2015 B2
20010025168 Gross et al. Sep 2001 A1
20010041869 Causey et al. Nov 2001 A1
20020010423 Gross et al. Jan 2002 A1
20020029018 Jeffrey Mar 2002 A1
20020040208 Flaherty et al. Apr 2002 A1
20020055711 Lavi et al. May 2002 A1
20020065488 Suzuki et al. May 2002 A1
20020107487 Preuthun Aug 2002 A1
20020123740 Flaherty et al. Sep 2002 A1
20020169215 Meng Nov 2002 A1
20030009133 Ramey Jan 2003 A1
20030125671 Aramata et al. Jul 2003 A1
20030135159 Daily et al. Jul 2003 A1
20030160683 Blomquist Aug 2003 A1
20030171717 Farrugia et al. Sep 2003 A1
20040010207 Flaherty et al. Jan 2004 A1
20040092873 Moberg May 2004 A1
20040116866 Gorman et al. Jun 2004 A1
20040127857 Shemesh et al. Jul 2004 A1
20040158172 Hancock Aug 2004 A1
20040186419 Cho Sep 2004 A1
20040260233 Garibotto et al. Dec 2004 A1
20050033234 Sadowski et al. Feb 2005 A1
20050065466 Vedrine Mar 2005 A1
20050065472 Cindrich et al. Mar 2005 A1
20050071487 Lu et al. Mar 2005 A1
20050113761 Faust et al. May 2005 A1
20050159706 Wilkinson et al. Jul 2005 A1
20050171476 Judson et al. Aug 2005 A1
20050171512 Flaherty Aug 2005 A1
20050177136 Miller Aug 2005 A1
20050197650 Sugimoto et al. Sep 2005 A1
20050203461 Flaherty et al. Sep 2005 A1
20050238507 Dilanni et al. Oct 2005 A1
20050283114 Bresina et al. Dec 2005 A1
20060030816 Zubry Feb 2006 A1
20060095014 Ethelfeld May 2006 A1
20060122577 Poulsen et al. Jun 2006 A1
20060173406 Hayes et al. Aug 2006 A1
20060173439 Thorne et al. Aug 2006 A1
20060195029 Shults et al. Aug 2006 A1
20060211982 Prestrelski et al. Sep 2006 A1
20060229569 Lavi et al. Oct 2006 A1
20060264889 Moberg et al. Nov 2006 A1
20060264890 Moberg et al. Nov 2006 A1
20060264894 Moberg et al. Nov 2006 A1
20060270987 Peter Nov 2006 A1
20060283465 Nickel et al. Dec 2006 A1
20060293722 Slatkine et al. Dec 2006 A1
20070021733 Hansen et al. Jan 2007 A1
20070049865 Radmer et al. Mar 2007 A1
20070073228 Mernoe et al. Mar 2007 A1
20070118405 Campbell et al. May 2007 A1
20070167912 Causey et al. Jul 2007 A1
20070185449 Mernoe Aug 2007 A1
20070197968 Pongpairochana et al. Aug 2007 A1
20070203454 Shermer et al. Aug 2007 A1
20070233038 Pruitt et al. Oct 2007 A1
20070282269 Carter et al. Dec 2007 A1
20080021439 Brittingham et al. Jan 2008 A1
20080033367 Haury et al. Feb 2008 A1
20080033369 Kohlbrenner et al. Feb 2008 A1
20080033393 Edwards et al. Feb 2008 A1
20080051711 Mounce et al. Feb 2008 A1
20080051730 Bikovsky Feb 2008 A1
20080059133 Edwards et al. Mar 2008 A1
20080097381 Moberg et al. Apr 2008 A1
20080108951 Jerde et al. May 2008 A1
20080140006 Eskuri et al. Jun 2008 A1
20080140018 Enggaard et al. Jun 2008 A1
20080147004 Mann et al. Jun 2008 A1
20080167641 Hansen et al. Jul 2008 A1
20080188813 Miller et al. Aug 2008 A1
20080208138 Lim et al. Aug 2008 A1
20080215006 Thorkild Sep 2008 A1
20080215015 Cindrich et al. Sep 2008 A1
20080243087 Enggaard et al. Oct 2008 A1
20080249473 Rutti et al. Oct 2008 A1
20080262436 Olson Oct 2008 A1
20080269687 Chong et al. Oct 2008 A1
20080269723 Mastrototaro et al. Oct 2008 A1
20080274630 Shelton et al. Nov 2008 A1
20080294143 Tanaka et al. Nov 2008 A1
20080306449 Kristensen et al. Dec 2008 A1
20080312601 Cane Dec 2008 A1
20080319416 Yodfat et al. Dec 2008 A1
20090041805 Walker Feb 2009 A1
20090048347 Cohen et al. Feb 2009 A1
20090054750 Jennewine Feb 2009 A1
20090069784 Estes et al. Mar 2009 A1
20090076453 Mejlhede et al. Mar 2009 A1
20090088694 Carter et al. Apr 2009 A1
20090088731 Campbell et al. Apr 2009 A1
20090093792 Gross et al. Apr 2009 A1
20090093793 Gross et al. Apr 2009 A1
20090105650 Wiegel et al. Apr 2009 A1
20090124977 Jensen May 2009 A1
20090143730 De Polo et al. Jun 2009 A1
20090143735 De Polo et al. Jun 2009 A1
20090149830 Spector Jun 2009 A1
20090182277 Carter Jul 2009 A1
20090204076 Liversidge Aug 2009 A1
20090209896 Selevan Aug 2009 A1
20090234319 Marksteiner Sep 2009 A1
20090240240 Hines et al. Sep 2009 A1
20090253973 Bashan et al. Oct 2009 A1
20090259176 Yairi Oct 2009 A1
20090281585 Katzman et al. Nov 2009 A1
20090299290 Moberg Dec 2009 A1
20090299397 Ruan et al. Dec 2009 A1
20090326459 Shipway et al. Dec 2009 A1
20090326509 Muse et al. Dec 2009 A1
20100030156 Beebe et al. Feb 2010 A1
20100030198 Beebe et al. Feb 2010 A1
20100049128 McKenzie et al. Feb 2010 A1
20100049144 McConnell et al. Feb 2010 A1
20100057057 Hayter et al. Mar 2010 A1
20100076412 Rush et al. Mar 2010 A1
20100094255 Nycz et al. Apr 2010 A1
20100100076 Rush et al. Apr 2010 A1
20100100077 Rush et al. Apr 2010 A1
20100106098 Atterbury et al. Apr 2010 A1
20100121314 Iobbi May 2010 A1
20100137790 Yodfat Jun 2010 A1
20100137831 Tsals Jun 2010 A1
20100145303 Yodfat et al. Jun 2010 A1
20100145305 Alon Jun 2010 A1
20100162548 Leidig Jul 2010 A1
20100168607 Miesel Jul 2010 A1
20100168683 Cabiri Jul 2010 A1
20100198157 Gyrn et al. Aug 2010 A1
20100204657 Yodfat et al. Aug 2010 A1
20100234767 Sarstedt Sep 2010 A1
20100234830 Straessler et al. Sep 2010 A1
20100241065 Moberg et al. Sep 2010 A1
20100264931 Lindegger et al. Oct 2010 A1
20100274112 Hoss et al. Oct 2010 A1
20100274192 Mernoe Oct 2010 A1
20100280499 Yodfat et al. Nov 2010 A1
20100331826 Field et al. Dec 2010 A1
20110034900 Yodfat et al. Feb 2011 A1
20110054399 Chong et al. Mar 2011 A1
20110054400 Chong et al. Mar 2011 A1
20110125056 Merchant May 2011 A1
20110160654 Hanson et al. Jun 2011 A1
20110160666 Hanson et al. Jun 2011 A1
20110160669 Gyrn et al. Jun 2011 A1
20110172645 Moga et al. Jul 2011 A1
20110172745 Na et al. Jul 2011 A1
20110178472 Cabiri Jul 2011 A1
20110201998 Pongpairochana et al. Aug 2011 A1
20110238031 Adair et al. Sep 2011 A1
20110245773 Estes et al. Oct 2011 A1
20110270160 Mernoe Nov 2011 A1
20110282282 Lorenzen et al. Nov 2011 A1
20110282296 Harms et al. Nov 2011 A1
20110295205 Kaufmann et al. Dec 2011 A1
20110313238 Reichenbach et al. Dec 2011 A1
20110319861 Wilk Dec 2011 A1
20110319919 Curry et al. Dec 2011 A1
20120004602 Hanson et al. Jan 2012 A1
20120010594 Holt et al. Jan 2012 A1
20120022344 Kube Jan 2012 A1
20120022499 Anderson et al. Jan 2012 A1
20120029431 Hwang et al. Feb 2012 A1
20120035546 Cabiri Feb 2012 A1
20120041364 Smith Feb 2012 A1
20120041414 Estes et al. Feb 2012 A1
20120071828 Tojo et al. Mar 2012 A1
20120096953 Bente, IV et al. Apr 2012 A1
20120096954 Vazquez et al. Apr 2012 A1
20120101436 Bazargan et al. Apr 2012 A1
20120108933 Liang et al. May 2012 A1
20120129362 Hampo et al. May 2012 A1
20120160033 Kow et al. Jun 2012 A1
20120165733 Bazargan et al. Jun 2012 A1
20120165780 Bazargan et al. Jun 2012 A1
20120226234 Bazargan et al. Sep 2012 A1
20120259282 Alderete, Jr. et al. Oct 2012 A1
20130012875 Gross et al. Jan 2013 A1
20130068319 Plumptre et al. Mar 2013 A1
20130085457 Schiff et al. Apr 2013 A1
20130089992 Yang Apr 2013 A1
20130096509 Avery et al. Apr 2013 A1
20130110049 Cronenberg et al. May 2013 A1
20130133438 Kow et al. May 2013 A1
20130237953 Kow et al. Sep 2013 A1
20130245595 Kow et al. Sep 2013 A1
20130253419 Favreau Sep 2013 A1
20130253420 Favreau Sep 2013 A1
20130253421 Favreau Sep 2013 A1
20130323699 Edwards et al. Dec 2013 A1
20130331791 Gross et al. Dec 2013 A1
20140055073 Favreau Feb 2014 A1
20140055076 Favreau Feb 2014 A1
20140058349 Bazargan et al. Feb 2014 A1
20140083517 Moia et al. Mar 2014 A1
20140094755 Bazargan et al. Apr 2014 A1
20140128807 Moberg et al. May 2014 A1
20140128835 Moberg et al. May 2014 A1
20140135692 Alderete, Jr. et al. May 2014 A1
20140135694 Moberg et al. May 2014 A1
20140142499 Moberg et al. May 2014 A1
20140148784 Anderson et al. May 2014 A1
20140148785 Moberg et al. May 2014 A1
20140163522 Alderete, Jr. et al. Jun 2014 A1
20140194819 Maule et al. Jul 2014 A1
20140194854 Tsals Jul 2014 A1
20140207064 Yavorsky Jul 2014 A1
20140207065 Yavorsky Jul 2014 A1
20140207066 Yavorsky Jul 2014 A1
20140213975 Clemente et al. Jul 2014 A1
20140236087 Alderete, Jr. et al. Aug 2014 A1
20140261758 Wlodarczyk et al. Sep 2014 A1
Foreign Referenced Citations (79)
Number Date Country
1747683 Mar 2006 CN
1863566 Nov 2006 CN
101090749 Dec 2007 CN
201941304 Aug 2011 CN
102186733 Sep 2011 CN
1064693 Sep 1959 DE
0017412 Oct 1980 EP
0222656 May 1987 EP
0401179 Dec 1990 EP
1530979 May 2005 EP
1666080 Jun 2006 EP
2060606 May 2009 EP
2498589 Sep 2012 EP
H07-194701 Aug 1995 JP
H09-505758 Jun 1997 JP
2001-512992 Aug 2001 JP
2002-505601 Feb 2002 JP
2002-507459 Mar 2002 JP
2002-528676 Sep 2002 JP
2003-501157 Jan 2003 JP
2003-527138 Sep 2003 JP
2003-534061 Nov 2003 JP
2004-501721 Jan 2004 JP
2004-512100 Apr 2004 JP
2005-523127 Aug 2005 JP
2005-270629 Oct 2005 JP
2007-509661 Apr 2007 JP
2008-534131 Aug 2008 JP
2008-220961 Sep 2008 JP
2009-502273 Jan 2009 JP
9009202 Aug 1990 WO
9307922 Apr 1993 WO
9407553 Apr 1994 WO
9513838 May 1995 WO
9609083 Mar 1996 WO
9632975 Oct 1996 WO
9700091 Jan 1997 WO
9710012 Mar 1997 WO
9733638 Sep 1997 WO
9857683 Dec 1998 WO
9929151 Jun 1999 WO
9959665 Nov 1999 WO
0025844 May 2000 WO
0187384 Nov 2001 WO
0189607 Nov 2001 WO
0189613 Nov 2001 WO
0202165 Jan 2002 WO
0234315 May 2002 WO
02072182 Sep 2002 WO
03090833 Nov 2003 WO
2004032990 Apr 2004 WO
2004105841 Dec 2004 WO
2005018703 Mar 2005 WO
2005037350 Apr 2005 WO
2006037434 Apr 2006 WO
WO2006069380 Jun 2006 WO
2006102676 Sep 2006 WO
2006104806 Oct 2006 WO
2007051563 May 2007 WO
2007056504 May 2007 WO
2008001377 Jan 2008 WO
2008014908 Feb 2008 WO
2008057976 May 2008 WO
2008072229 Jun 2008 WO
2008076459 Jun 2008 WO
2008078318 Jul 2008 WO
2009044401 Apr 2009 WO
2009046989 Apr 2009 WO
2009125398 Oct 2009 WO
2009144085 Dec 2009 WO
2010078227 Jul 2010 WO
2010078242 Jul 2010 WO
2011075105 Jun 2011 WO
2011090955 Jul 2011 WO
2011156373 Dec 2011 WO
2012032411 Mar 2012 WO
2012040528 Mar 2012 WO
2012160157 Nov 2012 WO
2014179774 Nov 2014 WO
Non-Patent Literature Citations (95)
Entry
Daikyo Crystal Zenith® polymer, Manufactured by Daikyo Seiko, Ltd. (Jun. 25, 2008).
Copaxone® , Manufactured by Teva Pharmaceutical Industries Ltd. (2009).
Int'l Search Report issued May 13, 2009 in Int'l Application No. PCT/IL2008/001312.
Int'l Preliminary Report on Patentability issued Apr. 7, 2010 in Int'l Application No. PCT/IL2008/001312; Written Opinion.
Int'l Search Report issued Apr. 26, 2010 in Int'l Application No. PCT/US2009/069552.
Office Action issued Apr. 5, 2010 in U.S. Appl. No. 12/244,666.
Office Action issued Sep. 21, 2010 in U.S. Appl. No. 12/244,666.
Office Action issued Apr. 5, 2010 in U.S. Appl. No. 12/244,688.
Office Action issued Sep. 2, 2010 in U.S. Appl. No. 12/244,688.
Office Action issued Sep. 30, 2010 in U.S. Appl. No. 12/689,250.
Int'l Search Report issued Jan. 12, 2011 in Int'l Application No. PCT/US2010/048556; Written Opinion.
International Preliminary Report on Patentability issued on Jul. 5, 2011 in International Application No. PCT/US2009/069552; Written Opinion.
Office Action issued Jul. 13, 2011 in U.S. Appl. No. 12/559,563.
Int'l Preliminary Report on Patentability issued Sep. 1, 2011 in Int'l Application No. PCT/US2010/048556.
Office Action issued Sep. 6, 2011 in U.S. Appl. No. 12/345,818.
Office Action issued Feb. 21, 2012 in U.S. Appl. No. 12/689,249.
Int'l Search Report issued Jun. 17, 2011 in Int'l Application No. PCT/US2011/021604.
Int'l Search Report issued Oct. 12, 2011 in Int'l Application No. PCT/US2011/021605.
Office Action issued Oct. 28, 2011 in U.S. Appl. No. 12/615,828.
Int'l Search Report issued Sep. 22, 2011 in Int'l Application No. PCT/IL11/00368; Written Opinion.
U.S. Appl. No. 13/521,181 by Cabiri, filed Jul. 9, 2012.
U.S. Appl. No. 13/521,167 by Cabiri, filed Jul. 9, 2012.
Office Action issued May 16, 2012 in U.S. Appl. No. 12/615,828.
Office Action issued Jul. 2, 2012 in U.S. Appl. No. 13/272,555.
Office Action issued May 3, 2012 in CN Application No. 200880117084.X.
U.S. Appl. No. 13/472,112 by Cabiri, filed May 15, 2012.
U.S. Appl. No. 13/429,840 by Cabiri, filed Mar. 26, 2012.
Int'l Preliminary Report on Patentability issued Aug. 2, 2012 in Int'l Application No. PCT/US2011/021604.
U.S. Appl. No. 13/643,470 by Alon, filed Oct. 25, 2012.
U.S. Appl. No. 13/733,516 by Cabiri, filed Jan. 3, 2013.
Office Action issued Jan. 8, 2013 in JP Application No. 2010-527595.
Int'l Preliminary Report on Patentability issued Feb. 7, 2013 in Int'l Application No. PCT/US2011/021604.
Int'l Preliminary Report on Patentability issued Feb. 7, 2013 in Int'l Application No. PCT/US2011/021605.
English translation of an Office Action issued Jan. 30, 2013 in CN Application No. 200880117084.X.
U.S. Appl. No. 13/873,335 by Filman, filed Apr. 30, 2013.
U.S. Appl. No. 13/892,905 by Cabiri, filed May 13, 2013.
U.S. Appl. No. 13/874,121 by Degtiar, filed Apr. 30, 2013.
U.S. Appl. No. 13/874,085 by Cabiri, filed Apr. 30, 2013.
U.S. Appl. No. 13/874,017 by Cabiri, filed Apr. 30, 2013.
Int'l Search Report and Written Opinion issued Jul. 26, 2013 in Int'l Application No. PCT/US2012/039465.
Int'l Search Report and Written Opinion issued Aug. 5, 2013 in Int'l Application No. PCT/US2013/033118.
U.S. Appl. No. 13/964,651 by Gross, filed Aug. 12, 2013.
Office Action issued Aug. 15, 2013 in CN Application No. 200880117084.X.
Office Action issued Oct. 9, 2013 in IL Application No. 208634.
Office Action issued Nov. 5, 2013 in JP Application No. 2010-527595.
Office Action issued Sep. 29, 2013 in CN Application No. 201080040968.7.
Office Action issued Nov. 4, 2013 in EP Application No. 11 709 234.6.
Office Action issued Dec. 17, 2013 in JP Application No. 2012-529808.
Office Action issued Dec. 10, 2013 in CN Application No. 201180006567.4.
Office Action issued Jan. 8, 2014 in U.S. Appl. No. 13/521,167 by Cabiri.
U.S. Appl. No. 29/479,307 by Norton, filed Jan. 14, 2014.
U.S. Appl. No. 14/193,692 by Gross, filed Feb. 28, 2014.
Office Action issued Feb. 4, 2014 in EP Application No. 11 707 942.6.
English translation of an Office Action issued Mar. 5, 2014 in CN Application No. 200880117084.X.
Int'l Search Report and Written Opinion issued Apr. 3, 2014 in Int'l Application No. PCT/US2013/078040.
Extended European Search Report issued Mar. 27, 2014 in EP Application No. 14154717.4.
Office Action issued Feb. 28, 2014 in CN Application No. 201180006571.0.
U.S. Appl. No. 14/258,661 by Cabiri, filed Apr. 22, 2014.
Int'l Search Report and Written Opinion issued Jan. 7, 2014 in Int'l Application No. PCT/US2013/065211.
Office Action issued May 23, 2014 in U.S. Appl. No. 13/472,112 by Cabiri.
Office Action issued Jun. 3, 2014 in JP Application No. 2010-527595.
Office Action issued Jul. 7, 2014 in U.S. Appl. No. 12/244,666 by Gross.
Int'l Search Report and Written Opinion issued Jul. 31, 2014 in Int'l Application No. PCT/US2014/033598.
Extended European Search Report issued Aug. 7, 2014 in EP Application No. 1417477.4.
Office Action issued Aug. 6, 2014 in EP Application No. 11 707 942.6.
Office Action issued Sep. 2, 2014 in JP Application No. 2012-550069.
Office Action issued Sep. 2, 2014 in JP Application No. 2012-550068.
Office Action issued Aug. 26, 2014 in CN Application No. 201180006567.4.
Int'l Preliminary Report on Patentability issued Oct. 9, 2014 in Int'l Application No. PCT/US2013/033118.
Office Action issued Oct. 9, 2014 in U.S. Appl. No. 13/873,335.
Office Action issued Nov. 5, 2014 in U.S. Appl. No. 13/643,470 by Alon.
U.S. Appl. No. 14/553,399 by Cabiri, filed Nov. 25, 2014.
Office Action issued Nov. 2, 2014 in CN Application No. 201180006571.0.
Office Action issued Nov. 21, 2014 in U.S. Appl. No. 13/472,112 by Cabiri.
Office Action issued Nov. 21, 2014 in U.S. Appl. No. 13/429,840 by Cabiri.
Int'l Preliminary Report on Patentability issued Nov. 27, 2014 in Int'l Application No. PCT/US2013/039465.
U.S. Appl. No. 14/593,051 by Gross, filed Jan. 9, 2015.
U.S. Appl. No. 14/683,193 by Cabiri, filed Apr. 10, 2015.
Office Action issued Feb. 20, 2015 in U.S. Appl. No. 13/521,181 by Cabiri.
Office Action issued Feb. 24, 2015 in U.S. Appl. No. 14/258,661 by Cabiri.
Extended European Search Report issued Feb. 23, 2015 in EP Application No. 14166596.8.
Office Action issued Mar. 10, 2015 in U.S. Appl. No. 13/643,470 by Alon.
Office Action issued Mar. 10, 2015 in U.S. Appl. No. 12/244,666 by Gross.
Extended European Search Report issued Feb. 23, 2015 in EP Application No. 14166591.9.
Office Action issued Mar. 10, 2015 in CN Application No. 201180006567.4.
Office Action issued Mar. 31, 2015 in JP Application No. 2012-550068.
U.S. Appl. No. 14/715,791 by Cabiri, filed May 19, 2015.
U.S. Appl. No. 14/725,009 by Bar-El, filed May 29, 2015.
Office Action issued Jun. 4, 2015 in U.S. Appl. No. 13/667,739 by Cabiri.
Int'l Preliminary Report on Patentability issued May 14, 2015 in Int'l Application No. PCT/US2013/065211.
Office Action issued May 7, 2015 in JP Application No. 2012-550069.
Office Action issued May 13, 2015 in CN Application No. 201380025566.3.
Office Action issued Jul. 31, 2015 in U.S. Appl. No. 13/521,181 by Cabiri.
Office Action issued Aug. 13, 2015 in U.S. Appl. No. 14/553,399 by Cabiri.
Notice of Allowance issued Aug. 24, 2015 in U.S. Appl. No. 29/479,307 by Norton.
Related Publications (1)
Number Date Country
20150180146 A1 Jun 2015 US
Continuations (1)
Number Date Country
Parent 13873335 Apr 2013 US
Child 14638525 US