The application claims priority under 35 U.S.C. 119(a) to Chinese application number 201010504447.4 filed on Oct. 9, 2010, which is incorporated herein by reference in its entirety as if set forth in full.
1. Technical Field
The embodiments described herein relate to electronic circuits, and more particularly, to a power supply device, a processing chip for a digital microphone and related digital microphone.
2. Related Art
Digital microphone is an electro-acoustic component of the microphone, which directly outputs a digital pulse signal. Digital microphone has the characteristics of high anti-interference capabilities, high integration, and ease of use, and it is widely used for power and size sensitive portable devices.
For the processing chip 12, the higher the PSRR of the power supply module 121, the better the performance of the processing chip is, but when the power supply module 121 employs one LDO, its PSRR is still relatively low and there is no better solution for power supply module with higher PSRR under the existing technologies.
A power supply device, a processing chip for a digital microphone and related digital microphone are described herein and the described provides a power supply device with higher PSRR.
In one aspect, a power supply device includes: at least two cascaded low-dropout linear regulators connected in series comprising a first low-dropout linear regulator LDO and a second LDO, wherein the type of the pass device for the first LDO is different with the type of the pass device for said second LDO.
In another aspect, a processing chip for digital microphone includes a processing module and a power supply module, wherein the power supply modules includes at least two cascaded low dropout linear regulators connected in series comprising a first low-dropout linear regulator LDO and a second LDO, wherein the type of the pass device for the first LDO is different with the type of the pass device for said second LDO.
In another aspect, a digital microphone includes a microphone and a processing chip, wherein the processing chip includes a processing module and a power supply module, wherein the power module includes at least two cascaded low-dropout linear regulators connected in series comprising a first low-dropout linear regulator LDO and a second LDO, wherein the type of the pass device for the first LDO is different with the type of the pass device for said second LDO.
Because the overall PSRR of the power supply is equal to the sum of the PSRR of each individual LDO, a power supply with higher PSRR is achieved.
These and other features, aspects, and embodiments are described below in the section entitled “Detailed Description.”
Features, aspects, and embodiments are described in conjunction with the attached drawings, in which:
Referring now to the drawings, a description will be made herein of embodiments herein.
The first embodiment of the power supply device:
The PSRR of the power supply device may be calculated based on the following formula:
In particular, PSRR1 is the PSRR of the LDO 31, PSRR2 is the PSRR of the LDO 32, PSRRn is the PSRR of the LDO 3n, the PSRR of the power supply device is equal to the sum of PSRR of each individual LDO and hence the power supply device possesses higher PSRR as a result.
The second embodiment of the power supply device:
The difference between this embodiment and previous embodiment is that in this embodiment, n=3. In addition, in this embodiment, the pass device of each LDO may be a PMOS FET or an NMOS FET. When the pass device of the LDO is an NMOS FET, the LDO may further include a voltage pump to overcome the impact of the gate-source voltage VGS, and the voltage pump may be configured to connect between the operational amplifier of the LDO and the power supply of the LDO.
The PSRR of the power supply device is equal to the sum of PSRR of the three LDOs, resulting in a power supply device with higher PSRR.
An embodiment for the processing chip:
The schematic diagram for this embodiment is the same as the processing chip 12 illustrated in
An embodiment for the digital microphone:
The schematic diagram for this embodiment is the same as the schematic diagram in
While certain embodiments have been described above, it will be understood that the embodiments described are by way of example only. Accordingly, the systems and methods described herein should not be limited based on the described embodiments. Rather, the systems and methods described herein should only be limited in light of the claims that follow when taken in conjunction with the above description and accompanying drawings.
Number | Date | Country | Kind |
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2010 1 0504447 | Oct 2010 | CN | national |
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Entry |
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Chinese First Examination Report of China Application No. 201010504447.4, dated Apr. 3, 2013. |
Number | Date | Country | |
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20120086419 A1 | Apr 2012 | US |