This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2014-170552, filed Aug. 25, 2014, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a power supply stabilizing technique.
In an X-ray computed tomography (CT) apparatus, a silicon photomultiplier (Si-PM) is used as a sensor, where the Si-PM includes Si photodiode arrays using a plurality of avalanche photodiodes (hereinafter, referred to as APD), which are a type of Si photodiode. Such a Si-PM detects visible light or ultraviolet light into which a scintillator converts from X-ray energy. The Si-PM detects an amount of radiation light in a so-called Geiger mode, in which the photodiodes are operated according to a reverse voltage exceeding the breakdown voltage of the photodiodes. Therefore, when a power supply voltage to the Si-PM fluctuates, a detection signal for the amount of radiation light may fluctuate even when the amount of radiation light does not change. As a result, precise detection of the amount of radiation light may not be carried out.
In general, according to one embodiment, a technique for stabilizing a power supply voltage, and a photodetector using the technique, is provided.
According to one embodiment, a power supply stabilizing circuit includes a diode having a cathode connected to an output terminal of a direct current power circuit configured to generate a direct current voltage and to supply the voltage therefrom to a load circuit, and a capacitor connected to an anode of the diode.
Hereinafter, embodiments will be described with reference to the drawings.
The Si-PM is formed by a plurality of Si photodiodes arranged in an array. Each Si photodiode forming the Si-PM converts photons from a scintillator into photoelectrons at a high speed. Because the Si-PM uses a plurality of Si photodiodes, the Si-PM varies largely in terms of its output current, depending on the amount of radiation light. From the viewpoint of a power circuit having the Si-PM connected thereto, the Si-PM is an element having a large load fluctuation.
When the power supply voltage supplied to the Si photodiode includes undershoot or overshoot and the power supply voltage fluctuates in the range from Vs1 to Vs2 in
A DC/DC converter 11 generates a direct current voltage Vout1 of, for example, 50 V from a direct current power source Vin and supplies the voltage Vout1 from an output end. The output end of the DC/DC converter 11 is connected to a power supply terminal 12a of a Si photodiode array 12. The Si photodiode array 12 includes a plurality of Si photodiodes 12c and a plurality of resistors 12d, and series connections of the Si photodiode 12c and the resistor 12d are disposed in an arrayed shape. The Si photodiode 12c is operated in Geiger mode in order to detect the photons radiated from a scintillator 13. The detection signal of the Si photodiode array 12 is output from the output terminal 12b.
A power supply stabilizing circuit 14 is connected to the output end of the DC/DC converter 11. This power supply stabilizing circuit 14 includes, for example, a Schottky barrier diode (hereinafter, referred to as Schottky diode) D1, a capacitor C1, a P-channel MOS transistor (hereinafter, referred to as a PMOS transistor) Q1, and a resistor R1.
The Schottky diode D1 and the capacitor C1 are connected in series between the output end of the DC/DC converter 11 and ground. In other words, the cathode of the Schottky diode D1 is connected to the output end of the DC/DC converter 11, the anode of Schottky diode 11 is connected to one electrode of the capacitor C1, and the other electrode of the capacitor C1 is grounded.
A connection node N1 of the Schottky diode D1 and the capacitor C1 is connected to a gate electrode of the PMOS transistor Q1. A source of the PMOS transistor Q1 is connected to the output end of the DC/DC converter 11, and a drain of the PMOS transistor Q1 is connected to the connection node N1 of the Schottky diode D1 and the capacitor C1 through resistor R1.
An operation of the power supply stabilizing circuit 14 illustrated in
As illustrated in
Further, the capacitor C1 is charged in the stationary state, and the voltage of a connection node N1 between the Schottky diode D1 and the capacitor C1 is V1. This voltage V1 satisfies V1=Vout1−Vf (Vf indicates a forward voltage drop). Since the Vf of the Schottky diode D1 is smaller than that of the PN junction diode, the voltage V1 is substantially equal to Vout1 (Vout2). In the stationary state, the Schottky diode D1 is in a non-conductive state, with no flow of currents Iout1 and Iin1.
Further, since the voltage V1 of the connection node N1 is higher than a threshold voltage Vqt of the PMOS transistor Q1, the PMOS transistor Q1 is in an OFF state. Therefore, current Iin2 does not flow into the resistor R1.
In the above state, at a time T1, when the Si photodiode array 12 is radiated with light and the load is increased, the voltage Vout2 and the output current Iout2 of the power supply terminal 12a of the Si photodiode array 12 are urged to decrease. In this state, if there is no power supply stabilizing circuit 14 according to the embodiment, the DC/DC converter 11 would perform a stabilizing operation to increase the output current and the output voltage according to the decrease of the output voltage Vout2 (Vout1).
By contrast, in the embodiment, when the load of the Si photodiode array 12 is increased, the Schottky diode D1 becomes conductive before the DC/DC converter 11 executes the stabilizing operation. In other words, when the Vout2 becomes lower than the Vout1−Vf, the Schottky diode D1 becomes conductive, and the electric charges of the capacitor C1 are added to the output current of the DC/DC converter 11 through the Schottky diode D1, as current Iout1. The Schottky diode D1 has a lower forward voltage drop Vf than the PN junction diode, as mentioned above, and a faster switching speed. Therefore, the Schottky diode D1 instantly becomes conductive in response to a drop of the voltage Vout2, and is able to supply the current Iout1. Accordingly, the output current Iout2 to the Si photodiode array 12 is instantly increased, as illustrated in
As mentioned above, when the load of the Si photodiode array 12 is increased and the voltage Vout2 and the output current Iout2 of the power supply terminal 12a of the Si photodiode array 12 begin to decrease, the Schottky diode D1 supplements the output current Iout2 to the Si photodiode array 12 by adding the current Iout1 at a high speed. Therefore, as illustrated in
As mentioned above, when the current Iout1 flows from the capacitor C1 through the Schottky diode D1 and the voltage V1 of the connection node N1 becomes lower than the threshold voltage Vqt of the PMOS transistor Q1, the PMOS transistor Q1 switches to an ON state. When this occurs, the current Iin2 flows through the PMOS transistor Q1 and the resistor R1 to charge the capacitor C1. At this point, since the voltage (voltage V1) of the anode of the Schottky diode D1 becomes lower than the voltage (output voltage Vout1 (or Vout2)) of the cathode, a reverse leak current Iin1 flows from the DC/DC converter 11 through the Schottky diode D1, to charge the capacitor C1. In other words, the capacitor C1 is charged according to the current Iin1 and Iin2 at a high speed.
Then, at a time T2, when the voltage V1 of the connection node N1 becomes higher than the threshold voltage Vqt of the PMOS transistor Q1, the PMOS transistor Q1 turns into an OFF state. Therefore, the current Iin2 flowing through the PMOS transistor Q1 and the resistor R1 is shut down, and the capacitor C1 is gradually charged according to the reverse leak current Iin1 from the Schottky diode D1. As a result, an overshoot of the output voltage Vout2 is prevented.
At a time T3, when the voltage V1 of the connection node N1 becomes equal to Vout1−Vf or, in other words, when the voltage V1 gets substantially equal to the output voltage Vout1 (Vout2), the reverse leak current Iin1 of the Schottky diode D1 is shut down, and charging of the capacitor C1 according to the reverse leak current Iin1 is stopped.
The same operation as set forth above is also performed at a staring time of the DC/DC converter 11. In an initial state, where the DC/DC converter 11 starts and the voltage Vout1 (Vout2) is supplied from the output end of the DC/DC converter 11, the capacitor C1 is not charged. Therefore, the voltage V1 of the connection node N1 of the Schottky diode D1 and the capacitor C1 is at a low level. The PMOS transistor Q1 is in an ON state and the capacitor C1 is charged according to the current Iin2 flowing through the PMOS transistor Q1 and the resistor R1. Here, the capacitor C1 is also charged according to the reverse leak current Iin1 of the Schottky diode D1. Therefore, the capacitor C1 is charged according to the current Iin1 and Iin2 at a high speed. Then, when the voltage V1 of the connection node N1 becomes higher than the threshold voltage Vqt of the PMOS transistor Q1, the PMOS transistor Q1 switches to the OFF state. Therefore, the current Iin2 becomes shut down, and the capacitor C1 becomes gradually charged according to the reverse leak current Iin1 of the Schottky diode D1. When the voltage V1 of the connection node N1 reaches the output voltage Vout1−Vf, the reverse leak current Iin1 of the Schottky diode D1 is shut down and the charge of the capacitor C1 is stopped.
According to the first embodiment, when the load of the Si photodiode array 12 becomes larger, the current Iout1 is supplied at a high speed from the capacitor C1 through the Schottky diode D1 and added to the output current Iout2 to the Si photodiode array 12, prior to the stabilizing operation of the DC/DC converter 11. This may suppress a fluctuation of the voltage Vout2 at the power supply terminal 12a of the Si photodiode array 12, and hence prevents an overshoot and an undershoot of the voltage Vout2. As a result, the detection precision of the Si photodiode array 12 is improved.
In other words, the Si photodiode array 12 operates at an extremely high speed (on the order of 10 ns or less). Further, the power supply voltage is a high voltage (for example, 50 V). Therefore, in response to a fast load fluctuation, it is difficult for a general DC/DC converter to stabilize the power supply voltage of 50 V according to the feedback control. According to the power supply stabilizing circuit 14 of the first embodiment, however, the power supply voltage may be stabilized by following the operation of the Si photodiode array 12 at a high speed. Accordingly, detection precision of the Si photodiode array 12 is improved.
As mentioned above, according to the first embodiment, the power supply stabilizing circuit 14 stabilizes the output voltage Vout2 prior to the stabilizing operation by the DC/DC converter 11, thereby preventing the overshoot and the undershoot of the output voltage Vout2.
Further, according to the first embodiment, when the electric charge of the capacitor C1 is reduced, the capacitor C1 can be charged at a highspeed according to the current Iin2 flowing through the PMOS transistor Q1 and the resistor R1 and the reverse leak current Iin1 of the Schottky diode D1. When the capacitor C1 is fully charged and the voltage V1 of the connection node N1 exceeds the threshold voltage Vqt of the PMOS transistor Q1, the capacitor C1 is gradually charged according to only the reverse leak current Iin1 of the Schottky diode D1. Therefore, an overshoot of the output voltage Vout2 can be prevented.
In the first embodiment, it is assumed that a load fluctuation of the Si photodiode array 12 (which is the load of the DC/DC converter 11) is fast, and the power supply stabilizing circuit 14 includes the PMOS transistor Q1 and the resistor R1 in order to charge the capacitor C1 at a high speed.
In the second embodiment, it is assumed that the load fluctuation of the Si photodiode array 12 is more gradual compared to the first embodiment. In this case, the capacitor C1 may afford a sufficient charging time. Therefore, the power supply stabilizing circuit 14 is formed by the Schottky diode D1 and the capacitor C1, and the capacitor C1 is gradually charged according to the reverse leak current of the Schottky diode D1.
At a time T11, when the DC/DC converter 11 starts, the output signal Vout1 is supplied from the output end of the DC/DC converter 11. Here, since the Schottky diode D1 is in a reverse bias state, the reverse leak current Iin1 flows in the Schottky diode D1 to charge the capacitor C1. The voltage V1 of the connection node N1 increases according to the charge of the capacitor C1. At a time T12, when the voltage V1 becomes Vout1−Vf (i.e., when the voltage V1 becomes substantially equal to the output voltage Vout1), the reverse leak current Iin1 of the Schottky diode D1 is shut down and the charge of the capacitor C1 is completed.
In the above state, the supply operation of the current Iout1 by the Schottky diode D1 when the load of the Si photodiode array 12 is increased is the same as that of the first embodiment.
When the current Iout1 by the Schottky diode D1 is supplied to the output current Iout2 to the Si photodiode array 12, the voltage V1 of the connection node N1 of the Schottky diode D1 and the capacitor C1 becomes less than Vout1−Vf. Therefore, the reverse leak current Iin1 flows to the Schottky diode D1 and the capacitor C1 is gradually charged according to this reverse leak current Iin1.
According to the second embodiment, where the load fluctuation of the Si photodiode array 12 is more gradual than in the first embodiment, the voltage of the power supply terminal 12a of the Si photodiode array 12 may sufficiently be stabilized, in a similar manner as the first embodiment. Therefore, the detection precision of the Si photodiode array 12 may be improved.
Further, in the case of the second embodiment, since the power supply stabilizing circuit 14 may be formed by the Schottky diode D1 and the capacitor C1, the structure of the second embodiment is simpler than the structure of the first embodiment.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2014-170552 | Aug 2014 | JP | national |