Claims
- 1. A prepreg comprising at least one layer of a film comprising an organic polymer having substantially no melting point and having a tensile modulus of 700 kg/mm.sup.2 or more and a tensile strength of 35 kg/mm.sup.2 or more and at least one layer of a resin, said film and said resin layer being bonded to each other.
- 2. A prepreg according to claim 1, wherein said resin layer comprises a thermosetting resin.
- 3. A prepreg according to claim 1, wherein said resin layer comprises a thermoplastic resin.
- 4. A prepreg according to any one of claims 1 to 3, wherein a plurality of films and a plurality of resin layers are alternately bonded.
- 5. A prepreg according to claim 2, wherein said thermosetting resin is a resin selected from the group comprising an epoxy resin, a polyimide resin, an unsaturated polyester resin, a phenolic rosin, and a polyurethane resin.
- 6. A prepreg according to claim 3, wherein said thermoplastic resin is a resin selected from the group comprising a polyphenylene sulfide, a polyether ketone, a polyether ether ketone, a polyether sulfone, a polyether imide, and a polyamide imide.
- 7. A prepreg according to claim 1, wherein said film is a film comprising an aromatic polyamide.
- 8. A prepreg comprising at least one layer of a film comprising an organic polymer having substantially no melting point and having a tensile module of 700 kg/mm.sup.2 or more and a tensile strength of 35 kg/mm.sup.2 or more and at least one layer of a fiber-reinforced resin layer, said film and said fiber-reinforced resin layer being bonded to each other.
- 9. A prepreg according to claim 8, wherein a resin used in the fiber-reinforced resin layer comprises a thermosetting resin.
- 10. A prepreg according to claim 8, wherein a resin used in the fiber-reinforced resin layer comprises a thermoplastic resin.
- 11. A prepreg according to any one of claims 8 to 10, wherein at least one layer of film is laminated on an inner layer or an outer layer of at least one laminated fiber-reinforced resin layer.
- 12. A prepreg according to any one of claims 8 to 10, wherein the film and the fiber-reinforced resin layer are alternately laminated every other layer or every plurality of layers.
- 13. A prepreg according to any one of claims 8 to 10, wherein a fiber-reinforced layer reinforced by a fiber selected from the group comprising carbon fiber, glass fiber, aromatic polyamide fiber, boron fiber, alumina fiber, silicon carbide fiber, polybenzimidazole fiber, and polybenzothiazole fiber is used.
- 14. A prepreg according to any one of claims 8 to 10, wherein the reinforcing fibers in the fiber-reinforced resin layer consist of a unidirectionally fiber-arranged sheet.
- 15. A prepreg according to any one of claims 8 to 10, wherein the reinforcing fibers of the fiber-reinforced resin layer consist of a sheet selected from a group of a woven fabric, a knitted fabric, a nonwoven fabric, and a mat sheet.
- 16. A prepreg according to claim 8, wherein a fiber-reinforced resin layer with a thermosetting resin which is a resin selected from the group comprising an epoxy resin, a polyimide resin, an unsaturated polyester resin, a phenolic resin, and a polyurethane resin is used.
- 17. A prepreg according to claim 10, wherein a fiber-reinforced resin layer with a thermoplastic resin which is a resin selected from the group comprising a polyphenylene sulfide, a polyether ketone, a polyether ether ketone, a polyethyl sulfone, a polyether imide, and a polyamide imide is used.
- 18. A prepreg according to claim 8, wherein said film in a film comprising an aromatic polyamide.
- 19. A plate molded body comprising at least one layer of a film and at least one layer of a resin and/or a fiber-reinforced resin layer, wherein said film comprises an organic polymer having substantially no melting point and has a tensile module of 700 kg/mm.sup.2 or more and a tensile strength of 35 kg/mm.sup.2 or more, said film, said resin layer, or said fiber-reinforced resin being bonded to each other.
- 20. A plate molded body according to claim 19, wherein a resin used in the resin layer and fiber-reinforced resin layer comprises a thermosetting resin.
- 21. A plate molded body according to claim 19, wherein a resin used in the resin layer and fiber-reinforced resin layer consists of a thermoplastic resin.
- 22. A plate molded body according to claim 20, wherein the thermosetting resin is a resin selected from a group comprising an epoxy resin, a polyimide resin, an unsaturated polyester resin, a phenolic resin, and a polyurethane resin.
- 23. A plate molded body according to claim 21, wherein the thermoplastic resin is a resin selected from a group comprising a polyphenylene sulfide, a polyether ketone, a polyether other ketone, a polyethyl sulfone, a polyether imide, and a polyamide imide.
- 24. A plate molded body according to any one of claims 19 to 21, wherein at least one layer of film is laminated on an inner layer or an outer layer of the at least one laminated fiber-reinforced resin layers.
- 25. A plate molded body according to any one of claims 19 to 21, wherein the film and the fiber-reinforced resin layer are alternately laminated every other layer or every plurality of layers.
- 26. A plate molded body according to any one of claims 19 to 21, wherein a fiber-reinforced layer reinforced by a fiber selected from a group comprising carbon fiber, glass fiber, aromatic polyamide fiber, boron fiber, alumina fiber, silicon carbide fiber, polybenzimidazole fiber, and polybenzothiazole fiber is used.
- 27. A plate molded body according to any one of claims 19 to 21, wherein the reinforcing fibers in the fiber-reinforced resin layer consist of a unidirectionally fiber-arranged sheet.
- 28. A plate molded body according to any one of claims 19 to 21, wherein the reinforcing fibers of the fiber-reinforced resin layer consist of a sheet selected from a group of a woven fabric, a knitted fabric, a nonwoven fabric, and a mat sheet.
- 29. A plate molded body according to claim 19 wherein said film in a film comprising an aromatic polyamide.
Priority Claims (6)
Number |
Date |
Country |
Kind |
1-97595 |
Apr 1989 |
JPX |
|
1-97596 |
Apr 1989 |
JPX |
|
1-105756 |
Apr 1989 |
JPX |
|
1-300803 |
Nov 1989 |
JPX |
|
1-303250 |
Nov 1989 |
JPX |
|
1-14124 |
Jan 1990 |
JPX |
|
Parent Case Info
This application is a divison of application Ser. No. 08/034.171, filed Feb. 12, 1993, U.S. Pat. No. 5,597,631 which is a continuation of application Ser. No. 07/582,183, now abandoned, which entirely incorporated herein by reference.
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Date |
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4868050 |
Tanaka et al. |
Sep 1989 |
|
4892774 |
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Jan 1990 |
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4954382 |
Riefler et al. |
Sep 1990 |
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Foreign Referenced Citations (2)
Number |
Date |
Country |
2228609 |
May 1973 |
FRX |
1570000 |
Jun 1976 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Elias, Hans-Georg, "Neue Polymere Werkstoffe 1969-1974", pp. 129-149. |
Enka Information Sheet: Arenka a high tensile, high modulus aramid (1981). |
Divisions (1)
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Number |
Date |
Country |
Parent |
34171 |
Feb 1993 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
582183 |
Nov 1990 |
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