Claims
- 1. High density pressboard comprised of 20-95% by weight aromatic polyamide fibrids and 80-5% by weight high temperature resistant floc, said pressboard having a calculated void volume of 13 to 28% by volume of the pressboard, a thickness of 0.5 to 50 mm, a mercury intrusion volume at low surface/volume, V.sub.ml, of less than 0.20 cm.sup.3 /g; a mercury intrusion volume at high surface/volume, V.sub.mh, of 0.08 to 0.28 cm.sup.3 /g, an oil absorption by volume in cm.sup.3 /g, V.sub.o, of 0.09 to 0.28 and by weight of 8-24 wt.%; and a total available absorption volume in cm.sup.3 /g, V.sub.a, equal to the largest of the values for V.sub.ml, V.sub.mh, and V.sub.o ; the ratio of V.sub.a to V.sub.ml being at least 1.1; said pressboard having a compression set of greater than 0.12 mm but less than 0.35 mm.
- 2. Pressboard of claim 1 wherein the high temperature resistant floc is an aromatic polyamide floc and the pressboard has a density of 1.0 to 1.20 g/cm.sup.3.
- 3. Pressboard of claim 2 wherein at least a portion of the floc consists of poly(p-phenylene terephthalamide).
- 4. Pressboard of claim 1 wherein at least a portion of the floc is glass fiber floc.
- 5. Pressboard of claim 2 wherein the aromatic polyamide fibrids and floc consist essentially of poly(m-phenylene isophthalamide).
- 6. Pressboard of claim 5 wherein the pressboard is comprised of 50-70% by weight fibrids and 50-30% by weight floc.
- 7. Pressboard of claim 6 wherein the density is 1.02 to 1.17 g/cm.sup.3.
- 8. Pressboard of claim 7 wherein the density is 1.10 to 1.15 g/cm.sup.3.
- 9. Pressboard of claim 6 wherein the compression set is greater than 0.20 mm but less than 0.30 mm.
- 10. Process for preparing the high density pressboard of any one of claims 1-9 whereby an aqueous slurry having 0.1 to 2% by weight total solids comprised of 20-95% by weight fibrids of an aromatic polyamide and 80-5% by weight of high temperature resistant floc having a length of 2 to 12 mm, said aromatic polyamide fibrids and said high temperature resistant floc having a melting point higher than 320.degree. C., the slurry is formed into a waterleaf having a water content of 50-95% by weight of the waterleaf; the waterleaf is combined into multiple layers to form a wet lap; the wet lap is pressed at 100.degree. to 200.degree. C. under a pressure of 10 to 60 kg/cm.sup.2 to form a low density pressboard having a calculated void volume of 30 to 60% by volume of the pressboard, the low density pressboard is dried, ultimately at 270.degree. to 320.degree. C. until substantially no further moisture is evolved and then pressed at 8 to 350 kg/cm.sup.2 at 270.degree. to 320.degree. C.
- 11. The process of claim 10 wherein the high temperature resistant floc is comprised of an aromatic polyamide.
- 12. The process of claim 11 wherein the pressboard is comprised of 50-70% by weight of poly(m-phenylene isophthalamide) fibrids and 30-50% by weight of poly(m-phenylene isophthalamide) floc.
- 13. Process of claim 12 wherein the low density pressboard is dried, ultimately at 275.degree.-300.degree. C., and pressed at 275.degree.-285.degree. C. and 15 to 70 kg/cm.sup.2.
- 14. The process of claim 13 wherein the final pressboard is cooled under restraint.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation of application Ser. No. 697,797, filed Feb. 4, 1985, abandoned, which is a continuation-in-part of Ser. No. 589,601, filed Mar. 14, 1984, abandoned.
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Number |
Name |
Date |
Kind |
3756908 |
Gross |
Sep 1973 |
|
4060451 |
Uchiyama et al. |
Nov 1977 |
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2815451 |
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DEX |
2302379 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
697797 |
Feb 1985 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
589601 |
Mar 1984 |
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