This application claims the priority of Korean Patent Application No. 10-2012-0098486, filed on Sep. 5, 2012, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
1. Field
The present disclosure relates to pressure sensors and pressure sensing methods thereof, and more particularly, to pressure sensors integrated as thin film transistors (TFTs) and pressure sensing methods thereof.
2. Description of the Related Art
In order to realize flexible electronic components, components and materials for forming the components have to be mechanically reliable, as well as have excellent electric characteristics. To achieve these flexible electronic components, much research into material science/engineering has been conducted. Such technology may be applied to stretchable electronic components, as well as flexible electronic components.
Related art organic materials may be manufactured on a flexible substrate through a low temperature process; however, they do not have excellent piezoelectric characteristics. On the other hand, related art inorganic materials may have excellent piezoelectric characteristics; however, they may be applied to a hard substrate but may not be applied to a flexible substrate because a high temperature process is necessary. That is, the organic and inorganic materials both have technical issues making it difficult for such materials to be applied to pressure sensors for an electronic skin. Thus, a material that is flexible, may be processed under a low temperature, and may have excellent piezoelectric characteristics is needed.
Exemplary embodiments provide pressure sensors integrated as thin film transistors (TFTs) on a flexible substrate and pressure sensing methods.
According to an aspect of an exemplary embodiment, there is provided a pressure sensor including: a substrate; a sensor thin film transistor (TFT) disposed on the substrate and comprising a gate insulating layer, wherein the gate insulating layer comprises an organic matrix in which piezoelectric inorganic nano-particles are dispersed; a power unit configured to apply an alternating current (AC) signal to a gate of the sensor TFT; and a pressure sensing unit configured to obtain a remnant polarization value based on a drain current which is generated in response to the AC signal and detected by the sensor TFT, and to sense pressure based on the remnant polarization value.
When an amplitude of the AC signal applied to the gate is VGamp, an amplitude of the drain current is IDamp, and an average drain current value is IDmean, the remnant polarization value may be in proportion to a value of
and the pressure sensor may be configured to sense the pressure by using a variation in the remnant polarization value.
The AC signal may have a frequency ranging from about 0.001 Hz to about 1 GHz.
A voltage amplitude of the AC signal may range from 0.01 V to 100 V.
The organic matrix may include a piezoelectric organic material.
The piezoelectric organic material may be selected from P(VDF-TrFE), P(VDF-TrFE-CFE), and P(VDF-TrFE-CtFE).
The organic matrix may have a crystalline structure.
The piezoelectric inorganic nano-particles may be selected from the group consisting of gallium orthophosphate (GaPO4), langasite (La3Ga5SiO14), a quartz analogic crystal, barium titanate (BaTiO3), lead titanate (PbTiO3), lead zirconate titanate (Pb[ZrxTi1-x]O3 (0≦x≦1), potassium niobate (KNbO3), lithium niobate (LiNbO3), lithium tantalate (LiTaO3), sodium tungstate (Na2WO3), zinc oxide (Zn2O3), Ba2NaNb5O5, Pb2KNb5O15, sodium potassium niobate ((K,Na)NbO3), bismuth ferrite (BiFeO3), sodium niobate (NaNbO3), bismuth titanate (Bi4Ti3O12), and sodium bismuth titanate (Na0.5Bi0.5TiO3).
The pressure sensor may further include a switching TFT that is electrically connected to the sensor TFT, wherein a sensor pixel structure of the pressure sensor comprises one switching TFT and one sensor TFT.
The organic matrix may have a crystalline structure.
The organic matrix may be formed to have the crystalline structure through an annealing process which implements a temperature of 120° C. or higher.
The substrate may be a flexible substrate.
The substrate may be formed of a material including polyimide.
According to an aspect of another exemplary embodiment, there is provided a pressure sensing method including: applying an alternating current (AC) signal to a gate of a sensor thin film transistor (TFT) comprising a piezoelectric gate insulating layer; detecting a drain current from the sensor TFT, the drain current being generated in response to the AC signal; and obtaining a remnant polarization value based on the drain current and sensing a pressure based on the remnant polarization value.
The piezoelectric gate insulating layer may include an organic matrix, in which piezoelectric inorganic nano-particles are dispersed.
The above and/or other aspects will become apparent and more readily appreciated from the following description of exemplary embodiments, taken in conjunction with the accompanying drawings of which:
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present exemplary embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the exemplary embodiments are merely described below, by referring to the figures, to explain aspects of the present description. It will be understood that when an element or layer is referred to as being “on” another element or layer, the element or layer can be directly on another element or layer or intervening elements or layers. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
Referring to
Referring to
The substrate 1 may be a flexible substrate. For example, the substrate 1 may be formed of a material including polyimide.
The gate insulating layer 33 may be a piezoelectric gate insulating layer. For example, the gate insulating layer 33 may include an organic matrix, in which piezoelectric inorganic nano-particles are dispersed.
The organic matrix is formed as a thin film for forming the gate insulating layer 33, and may be formed of a piezoelectric organic material. The organic matrix may be formed to have a crystalline structure through an annealing process which implements a temperature of about 120° or higher. The piezoelectric organic material for forming the organic matrix may be selected from, for example, P(VDF-TrFE), P(VDF-TrFE-CFE), and P(VDF-TrFE-CtFE).
The piezoelectric inorganic nano-particles may be dispersed in the organic matrix formed as the thin film. When the gate insulating layer 33 is formed of the organic matrix, in which the piezoelectric inorganic nano-particles are dispersed, the pressure sensor 10 may achieve advantages as a result of the organic material and the inorganic material. That is, the pressure sensor 10 having excellent piezoelectric characteristics may be formed on the substrate 1, that is, the flexible substrate, by using a low temperature process.
The piezoelectric inorganic nano-particles used in the gate insulating layer 33 may be selected from the group consisting of, for example, gallium orthophosphate (GaPO4), langasite (La3Ga5SiO14), a quartz analogic crystal, barium titanate (BaTiO3), lead titanate (PbTiO3), lead zirconate titanate (Pb[ZrxTi1-x]O3 (0≦x≦1), potassium niobate (KNbO3), lithium niobate (LiNbO3), lithium tantalate (LiTaO3), sodium tungstate (Na2WO3), zinc oxide (Zn2O3), Ba2NaNb5O5, Pb2KNb5O15, sodium potassium niobate ((K,Na)NbO3), bismuth ferrite (BiFeO3), sodium niobate (NaNbO3), bismuth titanate (Bi4Ti3O12), and sodium bismuth titanate (Na0.5Bi0.5TiO3). It is understood that the piezoelectric inorganic nano-particles may be selected from other materials as well.
As described above, the gate insulating layer 33 having the structure in which the piezoelectric inorganic nano-particles are dispersed in the organic matrix has a nano-compound form, and such a gate insulating layer 33 may have both characteristics of the organic material, that is, flexibility and processability at low temperatures, and characteristics of the inorganic material, that is, an improved piezoelectric coefficient characteristic.
The sensor TFT 30 may be manufactured through processes shown in, for example,
Referring to
After forming the gate electrode 31 as described above, the gate insulating layer 33 is formed to cover the gate electrode 31 at operation S1000, which includes operations S200, S300, S400 and S500.
The gate insulating layer 33 may be formed through a process of forming an insulating layer by spin-coating a piezoelectric nanocomposite, in which the piezoelectric inorganic nano-particles are dispersed in the piezoelectric organic material at operation S200, drying the insulating layer at operation S300, melting the insulating layer at operation S400, and re-crystallizing the insulating layer at operation S500. According to an exemplary embodiment, the melting of the insulating layer is performed by annealing the insulating layer at a temperature of, for example, about 200° C., and the recrystallization of the insulating layer may be performed by maintaining a temperature of 120° C. or higher, for example, at about 140° C., for about two hours.
According to an exemplary embodiment, a heat cycle including the melting and recrystallizing of the insulating layer may be additionally performed at least once in order to improve the crystallization and piezoelectric characteristics.
As described above, after forming the gate insulating layer 33, a channel layer 35 is formed on the gate insulating layer 33 as a Pentacene layer, for example, by using a semiconductor material at operation S600, and the source electrode 37 and the drain electrode 39 may be formed on the channel layer 35 at operation S700.
For example, the channel layer 35 may be formed using a thermal evaporation method. In addition, the source electrode 37 and the drain electrode 39 may be formed, for example, using the thermal evaporation method. The source and drain electrodes 37 and 39 may be formed of, for example, a metal material including gold (Au).
In the sensor TFT 30 as described above, a piezoelectric coefficient d33 of the gate insulating layer 33 may be adjusted by adjusting a crystallizing temperature of the organic matrix and an amount of the piezoelectric inorganic nano-particles.
For example, a case where the gate insulating layer 33 is formed to have a structure in which the organic matrix is formed of P(VDF-TrFE) and BaTiO3 piezoelectric inorganic nano-particles are dispersed in the P(VDF-TrFE) matrix, will be described below.
As described above, the characteristics of the gate insulating layer 33 may be improved by adjusting the crystallizing temperature of the organic matrix and the amount of the piezoelectric inorganic nano-particles.
For example, when the organic matrix is formed of the P(VDF-TrFE), the piezoelectric characteristics are improved when the crystallizing temperature is increased, as shown in
As shown in
As shown in
Referring back to
The pressure sensing unit 100 senses pressure by using a drain current ID obtained from the sensor TFT 30 in a state where the AC signal is applied to the gate G1 of the sensor TFT 30. That is, the pressure sensing unit 100 obtains a remnant polarization value Pr from the drain current ID, and calculates the pressure from the remnant polarization value Pr.
As described above, when the gate voltage, in which the AC sine wave signal is added to the DC component, is applied to the gate G1, the drain current ID in the form of a sine wave is generated in response and obtained. Equation 1 below expresses an AC sine wave signal VG applied to the gate G1, and Equation 2 and
V
G
=V
G
amp sin(ωt+φVG) Equation (1)
I
D
=I
D
mean
+I
D
amp sin(ωt+φID) (2)
In Equation 1, VGamp denotes an amplitude of a gate bias, that is, an amplitude of the AC sine wave signal, and in equation 2, IDmean denotes an average value of the drain current and IDamp denotes an amplitude of the drain current.
According to an exemplary embodiment, IDmean and IDamp have the following relationships with a channel width W and a channel length L of the sensor TFT 30, as expressed by Equation 3:
In Equation 3, VD denotes a drain voltage and V0 denotes a gate voltage at which electric current starts to flow in the sensor TFT 30.
From Equation 3, the gate voltage V0 may be calculated by using Equation 4 below, and a relationship between the remnant polarization value Pr and V0 may be expressed by Equation 5. That is, as shown in Equation 4 and Equation 5, the remnant polarization value Pr is in proportion to
In Equation 5, ε0 is about 8.854×10−14 F/cm, εr denotes a dielectric constant, and d denotes a thickness of the gate insulating layer 33.
Therefore, the piezoelectric coefficient d33 may be obtained from the remnant polarization value Pr by using Equation 6. Also, when the piezoelectric coefficient is already acknowledged, the pressure sensor 10 may measure the pressure by using the remnant polarization value Pr calculated by using Equation 5. In Equation 6 below, σ3 denotes stress applied to a predetermined location of the pressure sensor 10.
The remnant polarization value Pr may be distinguishable according to the pressure.
Also, as shown in
According to an exemplary embodiment, the gate insulating layer 33 is formed to have a structure in which the piezoelectric inorganic nano-particles are dispersed in the organic material, and thus, the sensitivity of the pressure sensor 10 with respect to the pressure under limited piezoelectric characteristics may be greatly improved.
In the pressure sensor 10 according to an exemplary embodiment, the sensor TFT 30 may be formed to show a positive piezoelectric coefficient d33 of, for example, about 120 to about 960 pC/N.
According to the pressure sensor 10 of an exemplary embodiment, when the pressure sensing operation is performed, the AC signal is applied to the gate 01 of the sensor TFT 30 which functions as an input terminal of the pressure sensor 10 in order to sense the drain current ID and the gate voltage V0. To do this, the AC signal input to the gate 01 of the sensor TFT 30 may have a frequency ranging from about 0.001 Hz to about 1 GHz. The AC signal may have a voltage amplitude ranging from about 0.01 V to about 100 V.
The pressure sensing unit 100 detects the remnant polarization value Pr value that is in proportion to a value of
by using the sensed drain current ID and V0 so as to sense the applied pressure in multiple levels by using the variation in the remnant polarization value Pr. That is, the variation in the pressure and the absolute value of the pressure may be obtained.
According to the pressure sensor 10 of an exemplary embodiment, since the piezoelectric inorganic nano-particles having excellent piezoelectric characteristics are dispersed in the organic material of the gate insulating layer 33, the flexible substrate may be used as the substrate 1, and at the same time, the pressure sensor may be manufactured through a low temperature process while having the excellent piezoelectric characteristics of the inorganic material.
Also, according to the pressure sensing method of an exemplary embodiment, the AC signal is applied to the gate 01 of the sensor TFT 30 which has the piezoelectric gate insulating layer 33 when performing the pressure sensing operation, and thus, the variation amount of the drain current according to the pressure variation may be increased, and accordingly, the sensitivity with respect to the pressure may also be increased.
The pressure sensor 10 according to the exemplary embodiments may be applied to flexible or stretchable electronic components. Applicable ranges of the stretchable electronic components may contribute to products in new application fields, and the application fields may be widely expandable to large-sized sensors, actuators, memories, solar batteries, electronic devices capable of charging by themselves, etc.
It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each exemplary embodiment should typically be considered as available for other similar features or aspects in other exemplary embodiments.
Number | Date | Country | Kind |
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10-2012-0098486 | Sep 2012 | KR | national |