The present invention relates to pressure sensors. More specifically, the invention relates to pressure sensors which are used in a corrosive environment.
Pressure sensors are used to measure the pressure process fluids used in industrial processes. The measured pressure is used to monitor and/or control operation of the industrial process.
The process fluid which is sensed by the pressure sensor may, in some instances, be corrosive or otherwise require a highly pure environment. One technique to address such installation requirements is to separate the pressure sensor from the process fluid using an isolation diaphragm. An oil fill couples the pressure sensor to the isolation diaphragm such that pressure applied to the diaphragm is applied to the pressure sensor. However, this isolation technique can introduce errors in pressure measurements.
Various pressure sensor designs are known in the art. One type of pressure sensor is formed of an elongate substantially brittle material. The sensor itself can be fabricated of a corrosion resistance material such as sapphire. Examples of this type of pressure sensor are shown and described in U.S. Pat. No. 5,637,802, issued Jun. 10, 1997; U.S. Pat. No. 6,079,276, issued Jun. 27, 2000; U.S. Pat. No. 6,082,199, issued Jul. 4, 2000; U.S. Pat. No. 6,089,097, issued Jul. 18, 2000; U.S. Ser. No. 09/478,434, filed Jan. 6, 2000; U.S. Ser. No. 09/478,383, filed Jan. 6, 2000; U.S. Ser. No. 09/477,689, filed Jan. 6, 2000; U.S. Ser. No. 09/603,640, filed Jun. 26, 2000; U.S. Ser. No. 09/755,346, filed Jan. 5, 2001; and U.S. Ser. No. 09/978,311, filed Oct. 15, 2001 which are incorporated herein by reference in their entirety.
However, in some embodiment, the bond or seal which is used to couple the elongate pressure sensor to the mounting structure can be corroded by certain types of process fluid or can be a source of contaminates to highly pure process fluids.
A pressure sensor assembly includes an elongate pressure sensor and a sensor mounting block. The elongate pressure sensor extends through an opening in the mounting block and a seal is provided between the mounting block and the elongate pressure sensor. A protective element covers the seal and at least portions of the elongate pressure sensor to prevent the bond from contacting process fluid.
In one embodiment, the pressure sensor is carried in an elongate sheath which generally conforms to the shape of the pressure sensor. A packing material between the sheath and the pressure sensor is configured to transfer a pressure applied to the sheath to the pressure sensor.
Pressure sensors are used in process monitoring and process control to monitor and/or responsively control the process. Various industrial processes require ultra-high purity for all wetted materials (i.e., materials which are exposed to the process fluid). For example, some processing steps used in the semiconductor industry require ultra-high purity handling procedures for the process fluids. The semiconductor industry follows specifications set forth by SEMI (Semiconductor Equipment and Materials Institute, Inc.) for ultra-high purity material handling. These guidelines set forth acceptable materials and surface conditions for those elements which interface directly with the process media. There are other standards and industries which require ultra-high purity practices.
Many industries which require ultra-high purity practices for handling the process fluid tend to resist the introduction of new materials or surfaces into the process. The use of new materials requires a long certification and testing process. Following certification, the industry must develop a level of confidence that the new material or surface will not add impurities to the process. Thus, it may be impossible, or it may take an extended period of time, to introduce new materials into ultra-high purity processing.
In general, pressure transmitters which are currently used to measure pressures in ultra-high purity processes have errors in their pressure measurements. One source of errors is the requirement that the pressure sensor comply with ultra-high purity practices. This may require the introduction of an isolation diaphragm which physically isolates the pressure sensor from the process fluid. Another source of errors is simply due to the configuration and characteristics of the pressure sensor. The present invention provides a technique for using highly accurate elongate pressure sensors in ultra-high purity processes.
The sensor mounting block 104 has a first side 106 and an opposed second side 108 with an opening 110 extending therebetween. Elongate pressure sensor 102 extends through opening 110 between sides 106 and 108. A seal (or bond) 112 seals the interface between sensor 102 and mounting block 104. Seal 112 can comprise, for example, a weld or braze (gold germanium, solders, adhesives, etc.).
This type of sensor configuration provides accurate measurements, in some instances accuracy which is orders of magnitude higher than prior art techniques. The sensor 102 consists of two wafers of substantially brittle material fused together to create a capacitance based absolute pressure sensing device capable of operating at pressures up to 3000 psi. A thin layer of metal, such as chromium, can be deposited along the entire length of the sensor 102, for example by sputtering. The chromium provides a shield to stray capacitance and electrical noise. A layer of nickel can be deposited over the chromium and used for bonding to the sensor when the sensor is mounted in a mounting block.
One difficulty in using this sensor configuration is mounting the sensor 102 to some type of support structure such as mounting block 104 such that it can be coupled to the process. All materials which are exposed to the process should be acceptable for ultra-high purity applications. Example materials include vacuum melted austenitic stainless steel, chromium and nickel, all with an electropolished surface finish. Additionally, perfluoroelastomers/fluoropolymers in high purity form can also be used.
In accordance with one embodiment of the invention, a protective element (i.e., a sheath or coating) 120 covers the elongate pressure sensor 102 and seal 112. Protective element 120 isolates pressure sensor 102 and seal 112 from the process fluid 123. Element 120 can be applied using any appropriate technique. Various examples are set forth below.
In operation, a distal end 130 of pressure sensor 102 is responsive to applied pressure. Electrical contacts 132 carried on a proximal end 134 of sensor 102 provide an output which is representative of the applied pressure. For example, capacitive plates can be carried within distal end 130. The capacitance can be measured through contacts 132 and is related to the deflection of the capacitive plates and therefore the applied pressure.
Protective element 120 is in contact with a pressurized fluid and deflects in a manner such that the pressure applied by the pressurized fluid is transferred to the pressure sensor 102. Protective element 120 can be fabricated using any appropriate technique and is preferably of a configuration such that the applied pressure is accurately and repeatably transferred to the pressure sensor 102 while conforming to the practices required in ultra-high purity processes. A number of example configurations and fabrication techniques are set forth below. However, in broad aspects, the invention is not limited to these specific embodiments.
In one embodiment, protective element 120 constitutes a coating and is fabricated by molding a larger piece of moldable material, such as plastic over the sensor 102 and at least part of the mounting block 104. One alternative is to use a molding process that uses high pressure molding techniques in order to achieve a very thin coating. Alternatively, the molding piece is formed as a thick body and then the molded piece is exposed to a material removal process, such as by a machining process. The protective coating 120 is sufficiently thin to allow the applied pressure to be transferred to the sensor 102. Any appropriate moldable plastic can be used including polytetrafluoroethylene (PTFE). The high Young's Modulus of the sensor 102 minimizes any effects due to the protective coating of plastic.
In another embodiment, illustrated in the perspective view of
In another embodiment illustrated in
An optional packing material 162 can be used to fill any space between protective coating 160 and sensor 102. Packing material 162 can comprise, for example, a pure alumina powder. During fabrication, the powder can be used in a slurry form and a centrifuge used to force the slurry into the opening of the protective element 160. A cap 164 is used to hold the packing material 162 within the protective coating 160 and secure the sensor 102 therein. The cap 164 can be, for example, a layer of epoxy or low temperature glass and will act as a barrier to humidity if desired.
In another example, a small amount of binder can be used in the packing material 162 to cause the packing material to solidify when sintered. For example, a glass powder that sinters or flows at sufficiently low temperatures can be used to fix the packing material 162.
Another example packing material 162 includes a metal powder used either in a packed state or sintered. The metal powder can be braised or soldered to permanently seal the protective coating 160. In all embodiments, the packing material provides a coupling between the protective element 160 and the sensor 102 without inparting mounting stress onto the sensor 102. By sintering or reflowing the packing material, performance degradation due to shifts of the packing material can be reduced.
In the embodiment of
The present invention provides a pressure sensor assembly which utilizes a highly accurate pressure sensor in a configuration which is acceptable to ultra-high purity processes. A protective element is used to cover surfaces which are not compatible with ultra-high purity process procedures such as to cover a bond which bonds a pressure sensor of a brittle material to a mounting block. The protective element is configured to allow pressure to be transferred to the pressure sensor while preventing the bond from contacting the process fluid. The protective element can be of an appropriate material and processed in such a manner that it is acceptable to industries which utilize ultra-high purity processes.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. For example, in various aspects, other types of coating material or techniques can be used. Further, various techniques used to fabricate the protective element can be varied as can be the shape of the protective element. In some aspects, although the figures and discussion herein relate to an elongate pressure sensor, other pressure sensor configurations are included within the scope of the invention. Similarly, in various aspects the present invention is not limited to a pressure sensor of a brittle material. Other packing materials include ceramic powder (conductive or non-conductive) which reduce hysteresis and creep errors or dielectric powders such as glasses and SiO2.
Number | Name | Date | Kind |
---|---|---|---|
3079576 | Kooiman | Feb 1963 | A |
3147085 | Gatti | Sep 1964 | A |
3239827 | Werner et al. | Mar 1966 | A |
3356963 | Buck | Dec 1967 | A |
3387226 | Haisma et al. | Jun 1968 | A |
3405559 | Moffatt | Oct 1968 | A |
3477036 | Haisma | Nov 1969 | A |
3589965 | Wallis et al. | Jun 1971 | A |
3645137 | Hazen | Feb 1972 | A |
3696985 | Herring et al. | Oct 1972 | A |
3743552 | Fa | Jul 1973 | A |
3744120 | Burgess et al. | Jul 1973 | A |
3750476 | Brown | Aug 1973 | A |
3766634 | Babcock et al. | Oct 1973 | A |
3834604 | Fendley et al. | Sep 1974 | A |
3854892 | Burgess et al. | Dec 1974 | A |
3858097 | Polye | Dec 1974 | A |
3899878 | Compton et al. | Aug 1975 | A |
3939559 | Fendley et al. | Feb 1976 | A |
RE28798 | Herring et al. | May 1976 | E |
3962921 | Lips | Jun 1976 | A |
3994430 | Cusano et al. | Nov 1976 | A |
4018374 | Lee et al. | Apr 1977 | A |
4064549 | Cretzler | Dec 1977 | A |
4078711 | Bell et al. | Mar 1978 | A |
4084438 | Lee et al. | Apr 1978 | A |
4088799 | Kurtin | May 1978 | A |
4127840 | House | Nov 1978 | A |
4128006 | Grabow | Dec 1978 | A |
4158217 | Bell | Jun 1979 | A |
4177496 | Bell et al. | Dec 1979 | A |
4196632 | Sikorra | Apr 1980 | A |
4202217 | Kurtz et al. | May 1980 | A |
4208782 | Kurtz et al. | Jun 1980 | A |
4216404 | Kurtz et al. | Aug 1980 | A |
4222277 | Kurtz et al. | Sep 1980 | A |
4236137 | Kurtz et al. | Nov 1980 | A |
4257274 | Shimada et al. | Mar 1981 | A |
4274125 | Vogel | Jun 1981 | A |
4276533 | Tominaga et al. | Jun 1981 | A |
4278195 | Singh | Jul 1981 | A |
4287501 | Tominaga et al. | Sep 1981 | A |
4301492 | Paquin et al. | Nov 1981 | A |
4359498 | Mallon et al. | Nov 1982 | A |
4366716 | Yoshida | Jan 1983 | A |
4389895 | Rud, Jr. | Jun 1983 | A |
4410872 | Stecher et al. | Oct 1983 | A |
4412203 | Kurtz et al. | Oct 1983 | A |
4416156 | Denmark et al. | Nov 1983 | A |
4419142 | Matsukawa | Dec 1983 | A |
4422125 | Antonazzi et al. | Dec 1983 | A |
4422335 | Ohnesorge et al. | Dec 1983 | A |
4424713 | Kroninger, Jr. et al. | Jan 1984 | A |
4426673 | Bell et al. | Jan 1984 | A |
4434665 | Adolfsson et al. | Mar 1984 | A |
4443293 | Mallon et al. | Apr 1984 | A |
4454765 | Lodge | Jun 1984 | A |
4456901 | Kurtz et al. | Jun 1984 | A |
4479070 | Frische et al. | Oct 1984 | A |
4495820 | Shimada et al. | Jan 1985 | A |
4497473 | Robyn et al. | Feb 1985 | A |
4507973 | Barr et al. | Apr 1985 | A |
4517622 | Male | May 1985 | A |
4525766 | Petersen | Jun 1985 | A |
4535219 | Sliwa, Jr. | Aug 1985 | A |
4539061 | Sagiv | Sep 1985 | A |
4542436 | Carusillo | Sep 1985 | A |
4547801 | Haisma et al. | Oct 1985 | A |
4558817 | Kiendl | Dec 1985 | A |
4572000 | Kooiman | Feb 1986 | A |
4586109 | Peters et al. | Apr 1986 | A |
4591401 | Neidig et al. | May 1986 | A |
4598996 | Taniuchi | Jul 1986 | A |
4609966 | Kuisma | Sep 1986 | A |
4625559 | Carter et al. | Dec 1986 | A |
4628403 | Kuisma | Dec 1986 | A |
4649070 | Kondo et al. | Mar 1987 | A |
4689999 | Shkedi | Sep 1987 | A |
4703658 | Mrozack, Jr. et al. | Nov 1987 | A |
4716492 | Charboneau et al. | Dec 1987 | A |
4732663 | Kato et al. | Mar 1988 | A |
4753109 | Zabler | Jun 1988 | A |
4754365 | Kazahaya | Jun 1988 | A |
4764747 | Kurtz et al. | Aug 1988 | A |
4769882 | Rosen et al. | Sep 1988 | A |
4773972 | Mikkor | Sep 1988 | A |
4774196 | Blanchard | Sep 1988 | A |
4780572 | Kondo et al. | Oct 1988 | A |
4800758 | Knecht et al. | Jan 1989 | A |
4806783 | Anderson | Feb 1989 | A |
4810318 | Haisma et al. | Mar 1989 | A |
4849374 | Chen et al. | Jul 1989 | A |
4852408 | Sanders | Aug 1989 | A |
4857130 | Curtis | Aug 1989 | A |
4875368 | Delatorre | Oct 1989 | A |
4879903 | Ramsey et al. | Nov 1989 | A |
4883215 | Goesele et al. | Nov 1989 | A |
4901197 | Albarda et al. | Feb 1990 | A |
4908921 | Chen et al. | Mar 1990 | A |
4929893 | Sato et al. | May 1990 | A |
4954925 | Bullis et al. | Sep 1990 | A |
4971925 | Alexander et al. | Nov 1990 | A |
4972717 | Southworth et al. | Nov 1990 | A |
4980243 | Malikowski et al. | Dec 1990 | A |
4983251 | Haisma et al. | Jan 1991 | A |
4994781 | Sahagen | Feb 1991 | A |
5001934 | Tuckey | Mar 1991 | A |
5005421 | Hegner et al. | Apr 1991 | A |
5009689 | Haisma et al. | Apr 1991 | A |
5013380 | Aoshima | May 1991 | A |
5024098 | Petitjean et al. | Jun 1991 | A |
5028558 | Haisma et al. | Jul 1991 | A |
5044202 | Southrth et al. | Sep 1991 | A |
5050034 | Hegner et al. | Sep 1991 | A |
5050035 | Hegner et al. | Sep 1991 | A |
5068712 | Murakami et al. | Nov 1991 | A |
5084123 | Curtis | Jan 1992 | A |
5085223 | Lars et al. | Feb 1992 | A |
5087124 | Smith et al. | Feb 1992 | A |
5088329 | Sahagen | Feb 1992 | A |
5094109 | Dean et al. | Mar 1992 | A |
5095741 | Bartig et al. | Mar 1992 | A |
5113868 | Wise et al. | May 1992 | A |
5123849 | Deak et al. | Jun 1992 | A |
5133215 | Lane, III et al. | Jul 1992 | A |
5155061 | O'Connor et al. | Oct 1992 | A |
5157972 | Broden et al. | Oct 1992 | A |
5174926 | Sahagen | Dec 1992 | A |
5178015 | Loeppert et al. | Jan 1993 | A |
5189591 | Bernot | Feb 1993 | A |
5189916 | Mizumoto et al. | Mar 1993 | A |
5197892 | Yoshizawa et al. | Mar 1993 | A |
5201228 | Kojima et al. | Apr 1993 | A |
5201977 | Aoshima | Apr 1993 | A |
5214563 | Estes | May 1993 | A |
5214961 | Kojima et al. | Jun 1993 | A |
5227068 | Runyon | Jul 1993 | A |
5228862 | Baumberger et al. | Jul 1993 | A |
5231301 | Peterson et al. | Jul 1993 | A |
5236118 | Bower et al. | Aug 1993 | A |
5242863 | Xiang-Zheng et al. | Sep 1993 | A |
5242864 | Fassberg et al. | Sep 1993 | A |
5257542 | Voss | Nov 1993 | A |
5261999 | Pinker et al. | Nov 1993 | A |
5271277 | Pandorf | Dec 1993 | A |
5287746 | Broden | Feb 1994 | A |
5294760 | Bower et al. | Mar 1994 | A |
5314107 | d'Aragona et al. | May 1994 | A |
5315481 | Smolley | May 1994 | A |
5319324 | Satoh et al. | Jun 1994 | A |
5326726 | Tsang et al. | Jul 1994 | A |
5332469 | Mastrangelo | Jul 1994 | A |
5349492 | Kimura et al. | Sep 1994 | A |
5381300 | Thomas et al. | Jan 1995 | A |
5424650 | Frick | Jun 1995 | A |
5437189 | Brown et al. | Aug 1995 | A |
5440075 | Kawakita et al. | Aug 1995 | A |
5466630 | Lur | Nov 1995 | A |
5470797 | Mastrangelo | Nov 1995 | A |
5471884 | Czarnocki et al. | Dec 1995 | A |
5478972 | Mizutani et al. | Dec 1995 | A |
5479827 | Kimura et al. | Jan 1996 | A |
5481795 | Hatakeyama et al. | Jan 1996 | A |
5483834 | Frick | Jan 1996 | A |
5528452 | Ko | Jun 1996 | A |
5532187 | Schreiber-Prillwitz et al. | Jul 1996 | A |
5554809 | Tobita et al. | Sep 1996 | A |
5612497 | Walter et al. | Mar 1997 | A |
5637802 | Frick et al. | Jun 1997 | A |
5731522 | Sittler | Mar 1998 | A |
5808205 | Romo | Sep 1998 | A |
6016702 | Maron | Jan 2000 | A |
6079276 | Frick et al. | Jun 2000 | A |
6082199 | Frick et al. | Jul 2000 | A |
6089097 | Frick et al. | Jul 2000 | A |
6106476 | Corl et al. | Aug 2000 | A |
6126889 | Scott et al. | Oct 2000 | A |
6131462 | EerNisse et al. | Oct 2000 | A |
6182498 | Mizutani et al. | Feb 2001 | B1 |
6311563 | Ishikura | Nov 2001 | B1 |
6508129 | Sittler | Jan 2003 | B1 |
6561038 | Gravel et al. | May 2003 | B2 |
Number | Date | Country |
---|---|---|
632 891 | Nov 1982 | CH |
153132 | May 1974 | CZ |
1 648 764 | Jun 1971 | DE |
2 021 479 | Nov 1971 | DE |
2 221 062 | Nov 1972 | DE |
24 59 612 | Jul 1975 | DE |
34 04 262 | Sep 1984 | DE |
40 11 901 | Oct 1991 | DE |
42 44 450 | Dec 1992 | DE |
0 024 945 | Sep 1980 | EP |
0 136 050 | Aug 1984 | EP |
0 161 740 | Feb 1985 | EP |
0 166 218 | May 1985 | EP |
0 182 032 | Sep 1985 | EP |
0 190 508 | Dec 1985 | EP |
0 207 272 | May 1986 | EP |
0 213 299 | Jun 1986 | EP |
0 210 843 | Jul 1986 | EP |
0 256 150 | Aug 1986 | EP |
0 351 701 | Jul 1989 | EP |
0 355 340 | Feb 1990 | EP |
0 383 391 | Aug 1990 | EP |
0 430 676 | Nov 1990 | EP |
0 410 679 | Jan 1991 | EP |
0 413 547 | Feb 1991 | EP |
0 444 942 | Sep 1991 | EP |
0 444 943 | Sep 1991 | EP |
0 451 993 | Oct 1991 | EP |
0 456 060 | Nov 1991 | EP |
0 460 763 | Nov 1991 | EP |
0 473 109 | Mar 1992 | EP |
0 476 897 | Mar 1992 | EP |
0 526 290 | Feb 1993 | EP |
0 547 684 | Jun 1993 | EP |
0 556 009 | Aug 1993 | EP |
0 579 298 | Jan 1994 | EP |
0 928 959 | Jul 1999 | EP |
1 568 487 | May 1969 | FR |
2 246 506 | May 1975 | FR |
2 455 733 | Nov 1980 | FR |
1 069 435 | Nov 1963 | GB |
1 305 885 | Apr 1971 | GB |
2034478 | Jun 1980 | GB |
2 071 853 | Mar 1981 | GB |
2 168 160 | Nov 1985 | GB |
49-38911 | Apr 1974 | JP |
60-97676 | May 1985 | JP |
62-70271 | Mar 1987 | JP |
60-195546 | Jul 1987 | JP |
62-104131 | Jul 1987 | JP |
62-167426 | Jul 1987 | JP |
62-259475 | Nov 1987 | JP |
63-285195 | Nov 1988 | JP |
63-292032 | Nov 1988 | JP |
91-311556 | Apr 1990 | JP |
2-148768 | Jun 1990 | JP |
2-249936 | Oct 1990 | JP |
3-239940 | Oct 1991 | JP |
2852593 | Mar 1993 | JP |
5-107254 | Apr 1993 | JP |
5-231975 | Sep 1993 | JP |
6-21741 | Jan 1994 | JP |
6-265428 | Sep 1994 | JP |
6-300650 | Oct 1994 | JP |
283761 | Oct 1998 | JP |
11006780 | Dec 1999 | JP |
463643 | Oct 1975 | SU |
736216 | May 1980 | SU |
1398825 | May 1988 | SU |
1597627 | Oct 1990 | SU |
1629763 | Feb 1991 | SU |
WO 8300385 | Feb 1983 | WO |
WO 8502677 | Jun 1985 | WO |
WO 8707947 | Dec 1987 | WO |
WO 8707948 | Dec 1987 | WO |
WO 9322644 | Nov 1993 | WO |
WO 9616418 | May 1996 | WO |
WO 9627123 | Sep 1996 | WO |
Number | Date | Country | |
---|---|---|---|
20030209080 A1 | Nov 2003 | US |