Embodiments relate to sensors and piezoresistive sensing elements. Embodiments also relate to bipolar transistors. Embodiments additionally relate to semiconductor processing as applied to producing bipolar transistor, piezoresistors, and composite diaphragms.
Current technology supplies pressure transducers having composite diaphragms and piezoresistive elements. U.S. Pat. No. 6,528,340 and U.S. Pat. No. 6,796,193, both incorporated herein by reference, disclose pressure transducers that have composite diaphragms and piezoresistors. Systems and methods where the composite diaphragms and the piezoresistors are formed on a substrate through a series of semiconductor processing steps are also disclosed.
The current technology provides pressure transducers where pressure produces flex or strain on a composite diaphragm. The amount of flex or strain effects the resistance of piezoresistors. In one transducer, piezoresistors are attached to a composite diaphragm. In another transducer, piezoresistors are formed directly on the substrate. The piezoresistors can then be electrically configured to accept an input voltage and to produce an output voltage dependent on the amount of flex or strain on the composite diaphragm.
In some applications, the output voltage can be directly measured using an analog to digital converter or other device. The measurement can then be interpreted as a pressure reading. In other applications the output voltage must be amplified before it can be measured. Those skilled in the art of analog circuitry know of many different amplifier circuits that can be used to amplify the output voltage. For example, four piezoresistors attached to the composite diaphragm can be electrically configured as a wheatstone bridge to produce a high quality output voltage that is passed to a differential amplifier for amplification.
Passing a signal from a transducer to an amplifier adds noise to the signal. It is therefore advantageous to amplify an output voltage as close to a transducer as possible. The embodiments disclosed herein directly address the shortcomings of current systems and methods by locating amplifier circuit element very close to the composite diaphragm and to the piezoresistors.
The following summary is provided to facilitate an understanding of some of the innovative features unique to the embodiments and is not intended to be a full description. A full appreciation of the various aspects of the embodiments can be gained by taking the entire specification, claims, drawings, and abstract as a whole.
It is therefore an aspect of the embodiments to obtain a substrate having a top and a bottom. The substrate can be a semiconductor wafer such as the p type substrates commonly used in semiconductor processing.
Another aspect of the embodiments is to create diffusion areas in the substrate top. For example, an implanter can be used to produce n type diffusion areas into a p type substrate. An epitaxial layer is then formed over the top. The diffusion areas spread into the epitaxial layer when it is formed. For example, n type diffusion areas spread into an n type epitaxial layer when it is formed over the previously discussed p type substrate.
A further aspect of the embodiments is to form junction isolations into the epitaxial layer to create transistor areas. Transistor areas lie over diffusion areas and within junction isolations. Creating a collector, base, and emitter within a transistor area results in the creation of a bipolar transistor. Those skilled in the art of semiconductor processing are familiar with the formation of junction isolations, collectors, bases, and emitters to produce bipolar transistors.
Yet another aspect of the embodiments is to form a composite diaphragm by etching the bottom. Etching processes such as those used in the incorporated references, U.S. Pat. No. 6,528,340 and U.S. Pat. No. 6,796,193, can etch patterns into the substrate with the epitaxial layer and the diffusion areas being etch stops. As such, some diffusion areas become transistor elements while others become composite diaphragm elements. The result is that transistors and composite diaphragms are simultaneously produced.
The accompanying figures, in which like reference numerals refer to identical or functionally similar elements throughout the separate views and which are incorporated in and form a part of the specification, further illustrate the present invention and, together with the background of the invention, brief summary of the invention, and detailed description of the invention, serve to explain the principles of the present invention.
The particular values and configurations discussed in these non-limiting examples can be varied and are cited merely to illustrate at least one embodiment and are not intended to limit the scope thereof. In general, the figures are not to scale.
An npn transistor has a p type base 106, n type emitter 108, and n type collector 107. A pnp transistor has a p type emitter 109, p type collector 110, and an n type base 111.
Leadouts 105 of p type material lie on either side of a piezoresistor structure 112. The piezoresistor structure 112 can be a single piezoresistor, perhaps in a serpentine or similar pattern, or can be a group of piezoresistors in parallel or in series. The leadouts 105 supply convenient electrical connections on either side of the piezoresistor structure.
Wires can be bonded to the leadouts, bases, collectors, and emitters or can alternatively be formed using common semiconductor processing techniques. For example, aluminum wires can be created by a series of step including deposition, lithography, and etching. Those skilled in the art of semiconductor processing know of many techniques for creating wired connections between components on a die.
It will be appreciated that variations of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also that various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.