The present application claims priority from PCT/US 2008/057287 filed on Mar. 17, 2008.
Some print heads actuate or apply force to a diaphragm to eject fluid through one or more nozzles. When ejecting fluid at higher frequencies, trajectory or other ejection errors may result, reducing print quality.
As shown by
Each of channels 42 is formed by one or more structures and has a floor 52, transverse sidewalls or sides 54 and longitudinal ends 56, 58. End 56 is located adjacent to fill chamber or portion 46 while longitudinal end 58 is located adjacent to or proximate the ejection chamber or portion 48 and nozzle openings 50.
Nozzle openings 50 comprise orifices along a nozzle edge 61 of substrate 22 (shown in
According to one example embodiment, substrate 22 is formed from a homogenous layer of silicon into which channels 42 and openings 50 are fabricated using photolithography, etching and/or other fabrication techniques. According to yet another example embodiment, substrate 22 may be formed from a homogenous layer of one or more polymeric materials into which channels 42 and openings 50 are fabricated. In one embodiment, the one or more polymeric materials may comprise thermoset polymeric materials, such as epoxy. In yet other embodiments, one or more polymeric materials may comprise a thermoplastic polymeric material, such as polyetherimide (PEI). In those embodiments in which substrate 22 is formed from a thermoplastic material, substrate 22 made exhibit enhanced ink resistance and rigidity.
Examples of low-cost high modulus polymeric materials from which substrate 22 may be injection molded include Examples of low-cost high modulus polymeric materials from which substrate 22 may be injection molded include liquid crystal polymers (LCP), polysulfone (PS) and Poly-ether-ether-ketone (PEEK). Other examples of polymeric materials from which substrate 22 may be molded include: polyethylenteraphalate (PET), polyethyleneimine (PEI), Polyphenylene sulfide, (PPS) and polyisoprene (PI). In yet other embodiments, substrate 22 may be impression molded. Use of polymers to form substrate 22 may reduce the cost of print head 20, enable a wider format of print heads by avoiding or reducing silicon-based processing and harnessing improved mechanical properties of polymers such a strain to failure, facilitate rapid turn-around prototyping, and increase the degrees of freedom for fluidic architecture of channels 32.
In some embodiments, the polymeric material forming substrate 22 may additionally include a percentage of filler material. Examples of filler material include, but are not limited to, carbon, titania, metal, and glass. In those embodiments in which the polymeric material includes a filler material, substrates 22 may exhibit increased rigidity and thermal conductivity.
In one embodiment, channels 42 and openings 50 are molded into substrate 22. For example, in one embodiment, substrate 22 is injection molded. Use of injection molding facilitates varied geometries for openings 50 which may provide benefits with regard to fluid drop uniformity and/or directionality. In still other embodiments, channels 42 may be formed in substrate 22 in other fashions such as by one or more material removal techniques such as photolithography or photopatterning and etching, electromechanical machining, such as cutting, sawing, grinding and the like, or laser ablation or cutting.
As shown by
In one embodiment, diaphragm 26 is formed from a glass layer having a thickness of about 58 μm. Such thin glass sheets are commercially available from vendors such as Schott. North America, Inc. of Elmsford, N.Y. According to one embodiment, diaphragm 26, formed from such a glass material, has a mechanical modulus of about 60 GPa and a Poisson's Ratio of about 0.25. Diaphragm 26 has a coefficient of thermal expansion of between about 3 and about 9 ppm. In other embodiments, diaphragm 26, formed from such a glass material, may have other dimensions. In still other embodiments, diaphragm 26 may be formed from other materials.
Actuators 28 comprise mechanisms or devices configured to selectively and/or flex portions of diaphragm 26 opposite to one or more of channels 42 so as to change the internal volume of ejection portions 48 to force fluid out of channels 42 through nozzle openings 50. In the example embodiment illustrated, actuators 28 comprise piezo electric or piezo resistive actuators, wherein piezo electric element deforms, flexes or changes shape in response to an applied electrical potential or voltage. As shown by
Electrical conductors 64 comprise one or more electrically conductive structures or layers supported by diaphragm 26 and in contact with an associated piezo element 66. Electrical conductors 64 assist in forming an electrical potential across piezo elements 66, facilitating ejection of fluid through openings 50. In one embodiment, electrical conductors 64 comprise a metal composite upon diaphragm 26. For example, in one embodiment, electrical conductors 64 comprise sputtered indium tin oxide (ITO) having a thickness of about 02 μm. In other embodiments, conductors 64 may comprise other electrically conductive materials and may have other dimensions. Electrical conductors 64 may also be joined to diaphragm 26 in other fashions or merely extend adjacent to diaphragm 26.
Piezo element 66 comprise patches or bands of piezo material. In one embodiment, piezo elements comprise piezo electric ceramic or piezo electric crystals which, when subjected to an externally applied voltage, change shape by a small amount. Examples of piezo materials include, but are not limited to, lead zirconate titanate (PZT). In other embodiments, piezo elements 66 maybes comprise other piezo ceramics or crystals.
As further shown by
In the example illustrated, piezo elements are formed by sputtering the piezo material, such as PZT, to form a thick layer 70 of piezo material upon the conductors 64 and then removing a substantial thickness of portions of the layer to define the length and bounds of the piezo elements. The thinner portions 72 of the piezo material layer are so thin that they do not effectively function as the part of the piezo elements.
Electrical conductors 68 comprise the one or more electrically conductive structures in electrical contact with piezo elements 66 and configured to cooperate with electrical conductor 64 to apply a voltage across piezo element 66. Electrical conductors 68 enable distinct voltages to be applied across different element 66. As a result, fluid may be independently ejected through individual openings 50 to form a pattern or image of fluid upon a surface being printed upon. In one embodiment, electrical conductors 66 comprise a sputtered electrical he conductive material, such as gold or indium tin oxide, patterned onto element 66. In other embodiments, electrical conductors 66 may comprise other configurations or geometries of other electrically conductive materials.
Supports 30, 32 in each comprise structures extending between floor 52 on an underside of diaphragm 26 overlapping or along the effective edges 76, 78 of piezo element 66. As shown by
In addition to supporting diaphragm 26 along or opposite to edges or ends 78 of piezo element 66, support 32 further serves as a restrictor. In particular, support 32 inhibits flow of fluid out of ejection portion 48 towards fill portion 46. As a result, fluid is more likely to flow in the opposite direction out of ejection portion 48 towards nozzle 50.
In other embodiments, supports 30, 32 may have different shapes and dimensions. In other embodiments, supports 30, 32, substrate 22 and diaphragm 26 may be formed from other materials. In other embodiment, supports 30, 32 may be connected to diaphragm 26 in other fashions, such as by one or more adhesives. In still other embodiments, supports 30, 32 may not be connected to diaphragm 26 but may extend into close proximity to diaphragm 26.
As noted above, print head 20 is but one example embodiment. Similar benefits may be achieved with other embodiments having different dimensions and configurations.
Fluid ejectors 221A is similar to fluid ejector 21 except that fluid ejector 221A as differently shaped supports at opposite ends of the ejection portion 48 of its channel 42. In particular, the ejector 221A includes supports 300 and 302 in place of supports 30 and 32, respectively. Support 300 is generally triangular shaped with its tip pointing towards support 302. Support 300 is centrally located within the channel 42 to fluid my flow around opposite sides of support 300. Support 300 is arranged such that its wider base underlies edge 78 of piezo element 66.
Support 302 is generally circular in shape. Support 302 is centrally located within channel 42 such a fluid flows around opposite side to support 302. Support 302 is located such that edge 78 of piezo element 66 intercepts a center point of support 302. In one embodiment, support 302 occupies a greater transverse width of channel 42 as compared to support 300, enhancing its ability to serve as a restrictor inhibiting reverse flow of fluid from ejection portion 48 of channel 42.
Fluid ejector 221B is similar to fluid ejector 21 except that fluid ejector 221B includes supports 310 and 312 in place of supports 30 and 32, respectively. As shown by
Supports 312 comprised structures projecting from opposite transverse sides of channel 42 towards one another so as to form an intermediate channel or opening 315. Supports 312 extend between the floor of channel 42 and diaphragm 26 opposite to and partially along edge 78 of piezo element 66. According to one example embodiment, supports 312 are dimensioned or shaped such that opening 315 is smaller than opening 313, enhancing the ability of supports 312 to additionally serve as a restrictor, inhibiting reverse flow fluid from ejection from chamber or portion 48.
Although each of supports 312 is illustrated as being triangular in shape, in other embodiments, supports 312 may alternatively be semi-oval, semicircular or rectangular in shape. Supports 312 may have different shapes from that of supports 310. For example, in one embodiment, supports 310 may be semi-oval, semicircular or triangular in shape to enhance fluid flow while supports 312 may be rectangular in shape or may have less gradual faces (faces more perpendicular to the longitudinal direction of channel 42), such as faces 317 towards ejection portion 48, to better restrict reverse fluid flow out of ejection portion 48.
Fluid ejector 221C is similar to fluid ejector 21 except that fluid ejector 221C includes supports 320 and 322 in place of supports 30 and 32, respectively. Supports 320 comprise multiple structures projecting from the floor 52 of channel 42 towards diaphragm 26 and either connected to or in contact with diaphragm 26. As shown by
Support 322 extends between the floor 52 of channel 42 and diaphragm 26. Support 322 further extends below, opposite to or less partially along edge 78 of piezo element 66. Support 322 is centrally located within channel 42 to facilitate fluid flow about and around support 322.
In other embodiments, support 322 may have other configurations. For example, in other embodiments, support 322 may alternatively be configured similarly to supports 312. Support 310 may alternatively be configured similar to supports 300 or 310 as well. Like supports 30 and 32, each of supports 300, 302, 310, 312, 320 and 322 serve to support or inhibit flexing of selected portions of diaphragm 26 along channel 26 to enhance performance of print head 20. Supports 300, 302, 310, 312, 320 and 322 increase the separation or disparity between natural modal frequencies of diaphragm 26 without substantially sacrificing pumping efficiency. Because the disparity between natural modal frequencies of diaphragm 26 is increased, actuators 28 may be actuated or “fired” at a faster frequency without corresponding trajectory or other fluid ejection errors that otherwise might exist due to the natural modal frequency disparity being too close to the firing frequency.
Although the present disclosure has been described with reference to example embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the claimed subject matter. For example, although different example embodiments may have been described as including one or more features providing one or more benefits, it is contemplated that the described features may be interchanged with one another or alternatively be combined with one another in the described example embodiments or in other alternative embodiments. Because the technology of the present disclosure is relatively complex, not all changes in the technology are foreseeable. The present disclosure described with reference to the example embodiments and set forth in the following claims is manifestly intended to be as broad as possible. For example, unless specifically otherwise noted, the claims reciting a single particular element also encompass a plurality of such particular elements.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2008/057287 | 3/17/2008 | WO | 00 | 8/12/2010 |
Publishing Document | Publishing Date | Country | Kind |
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WO2009/116993 | 9/24/2009 | WO | A |
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