1. Technical Field
The present disclosure relates to a printed circuit board (PCB).
2. Description of Related Art
PCBs can be found in most electronic devices and must be able to support transmission of high-speed differential signals. If high-speed differential signals are transmitted to at least three electronic elements, laying out signal lines of the PCBs becomes overly complicated and may lead to design flaws affecting performance of the PCBs.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
A pair of first bonding pads 11A and 11B and a pair of second bonding pads 12A and 12B are mounted on the first signal layer 10, and electrically connected to the pair of first vias 40A and 40B, and the pair of second vias 41A and 41B. The second bonding pads 12A and 12B are connected to a first electronic element 1. The first bonding pads 11A and 11B are connected to a second electronic element 2.
A pair of third bonding pads 23A and 23B, a pair of fourth bonding pads 24A and 24B, a pair of fifth bonding pads 25A and 25B, a pair of sixth bonding pads 26A and 26B, a pair of seventh bonding pad 27A and 27B, and a pair of eighth bonding pads 28A and 28B are mounted on the second signal layer 20. The fourth bonding pads 24A and 24B are mounted between the third bonding pads 23A and 23B and the fifth bonding pads 25A and 25B. The third bonding pads 23A and 23B are connected to the second bonding pads 12A and 12B by the second vias 41A and 41B. The seventh bonding pads 27A and 27B are mounted between the sixth bonding pads 26A and 26B and the eighth bonding pads 28A and 28B. The seventh bonding pads 27A and 27B are connected to the fifth bonding pads 25A and 25B. The sixth bonding pads 26A and 26B are connected to the first bonding pads 11A and 11B by the first vias 40A and 40B. The fourth bonding pads 24A and 24B are connected to the control chip 4 for transmission of a pair of high-speed signals therethrough such as a pair of differential signals from the control chip 4. The eighth bonding pads 28A and 28B are connected to a third electronic element 3.
When the control chip 4 transmits the pair of high speed signals to the first electronic element 1, a first passive element 21 is used to connect the third bonding pads 23A to the fourth bonding pad 24A. A second passive element 22 is used to connect the third bonding pads 23B to the fourth bonding pad 24B. The control chip 4 outputs the pair of high-speed signals to the first electronic element 1 through the fourth bonding pads 24A and 24B, the first and second passive elements 21 and 22, the third bonding pads 23A and 23B, the second vias 41A and 41B, and the second bonding pads 12A and 12B.
Referring to
Referring to
It is to be understood, however, that even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
2010 1 0242441 | Aug 2010 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
5039824 | Takashima et al. | Aug 1991 | A |
20020118523 | Okabe et al. | Aug 2002 | A1 |
20100012363 | Chen et al. | Jan 2010 | A1 |
20110147070 | Mcilquham et al. | Jun 2011 | A1 |
Number | Date | Country | |
---|---|---|---|
20120026707 A1 | Feb 2012 | US |