PRINTED CIRCUIT BOARDS

Abstract

Printed circuit boards are provided. A printed circuit board includes a main body and an anti-EMI coating. The main body includes a substrate and a conductor connected to an electronic component on the substrate. The anti-EMI coating is formed on the substrate or the conductor by printing, plating or deposition, to prevent EMI.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1 is a perspective diagram of an embodiment of a printed circuit board;

FIG. 2A is a perspective diagram of another embodiment of a printed circuit board;

FIG. 2B is a perspective diagram of another embodiment of a printed circuit board;

FIGS. 3A and 3B are perspective diagrams of another embodiment of a printed circuit board; and

FIG. 4 is a perspective diagram of a plurality of anti-EMI coatings coupled with a circuit system on a substrate.

Claims

1. A printed circuit board, comprising: a main body, comprising a substrate and a conductor connected to an electronic component on the substrate; andan anti-EMI coating, formed on the main body to prevent EMI.

2. The printed circuit board as claimed in claim 1, wherein the anti-EMI coating is formed on the substrate by printing, plating or deposition.

3. The printed circuit board as claimed in claim 1, wherein the anti-EMI coating is formed on the conductor by printing, plating or deposition.

4. The printed circuit board as claimed in claim 1, wherein the anti-EMI coating surrounds the conductor.

5. The printed circuit board as claimed in claim 1, wherein the anti-EMI coating covers the conductor and connects to the substrate.

6. The printed circuit board as claimed in claim 1, wherein the main body comprises a plurality of substrates with the anti-EMI coating disposed therebetweeen.

7. The printed circuit board as claimed in claim 1, the main body comprising a first conductive layer and a second conductive layer, the substrate comprising a connection hole with the conductor disposed therethrough to electrically connect the first and second conductive layers, wherein the anti-EMI coating is disposed around the hole and surrounds the conductor.

8. The printed circuit board as claimed in claim 7, wherein the connection hole is a through hole, blind hole or buried hole.

9. The printed circuit board as claimed in claim 1, further comprising a plurality of standardized anti-EMI coatings with specific electrical parameters, wherein circuits of the printed circuit board are designed according to electrical parameters of the anti-EMI coatings and the conductor.

10. The printed circuit board as claimed in claim 9, wherein the anti-EMI coatings are stacked on the main body.

11. The printed circuit board as claimed in claim 9, wherein the anti-EMI coatings are coupled with the conductor in series.

12. The printed circuit board as claimed in claim 9, the main body comprising a plurality of conductors in parallel, wherein the anti-EMI coatings are correspondingly coupled with the conductors in parallel and collectively influence the conductors.

13. A printed circuit board, comprising: a main body, comprising a substrate and an electronic circuit disposed on the substrate; anda plurality of anti-EMI coatings, formed on the main body and coupled with the electronic circuit to prevent EMI.

14. The printed circuit board as claimed in claim 13, wherein the anti-EMI coating is formed on the substrate by printing, plating or deposition.

15. The printed circuit board as claimed in claim 13, wherein the anti-EMI coating is formed on the electronic circuit by printing, plating or deposition.

16. The printed circuit board as claimed in claim 13, wherein the main body comprises a plurality of substrates with the anti-EMI coating disposed therebetweeen.

17. The printed circuit board as claimed in claim 13, further comprising a plurality of standardized anti-EMI coatings with specific electrical parameters, wherein circuits of the printed circuit board are designed according to electrical parameters of the anti-EMI coatings and the electronic circuit.

18. The printed circuit board as claimed in claim 13, wherein the anti-EMI coatings are stacked on the main body.

19. The printed circuit board as claimed in claim 13, wherein the anti-EMI coatings are coupled with the electronic circuit in series.

20. The printed circuit board as claimed in claim 13, the main body comprising a plurality of conductors in parallel, wherein the anti-EMI coatings are correspondingly coupled with the conductors in parallel and collectively influence the conductors.