Each printhead die in an inkjet pen or print bar includes tiny channels that carry ink to the ejection chambers. Ink is distributed from the ink supply to the die channels through passages in a structure that supports the printhead die(s) on the pen or print bar. It may be desirable to shrink the size of each printhead die, for example to reduce the cost of the die and, accordingly, to reduce the cost of the pen or print bar. The use of smaller dies, however, can require changes to the larger structures that support the dies, including the passages that distribute ink to the dies.
The same part numbers designate the same or similar parts throughout the figures. The figures are not necessarily to scale. The size of some parts is exaggerated to more clearly illustrate the example shown.
Inkjet printers that utilize a media wide print bar have been developed to help increase printing speeds and reduce printing costs. Conventional media wide print bar assemblies include multiple parts that carry printing fluid from the printing fluid supplies to the small printhead dies from which the printing fluid is ejected on to the paper or other print media. While reducing the size and spacing of the printhead dies continues to be important for reducing cost, channeling printing fluid from the larger supply components to ever smaller, more tightly spaced dies requires complex flow structures and fabrication processes that can actually increase overall cost.
A new fluid flow structure has been developed to enable the use of smaller printhead dies to help reduce cost in printhead assemblies for media wide and other inkjet printers. Examples of the new fluid flow structure and processes for making such structures are disclosed in international patent application PCT/US2013/028207 filed Feb. 28, 2013 and PCT/US2013/033046 filed Mar. 20, 2013, each of which is incorporated herein by reference in its entirety.
A printhead implementing one example of the new structure includes multiple printhead dies molded into an elongated, monolithic body of moldable material. Printing fluid channels molded into the body carry printing fluid directly to flow passages in each die. The molding in effect grows the size of each die for making external fluid connections and for attaching the dies to other structures, thus enabling the use of smaller dies. The printhead dies and printing fluid delivery channels can be molded at the wafer level to form a composite printhead wafer with built-in printing fluid channels, eliminating the need to form the printing fluid channels in a silicon substrate and enabling the use of thinner, longer and narrower dies. Very thin long, narrow printhead die “slivers” are now possible. In one example, a new printhead die includes a structure having a thickness of 100 μm or less containing multiple fluid ejectors and multiple fluid ejection chambers with a ratio of length to width of 50 or more. In one specific implementation of this example, the die structure is 25 mm long (or longer) and not more than 200 μm wide and is embedded in a molding with a printing fluid delivery channel that is only about 90 μm wide.
These and other examples shown in the figures and described below illustrate but do not limit the invention, which is defined in the Claims following this Description.
As used in this document, a “printhead” and a “printhead die” mean that part of an inkjet printer or other inkjet type dispenser that dispenses fluid from one or more openings. A printhead includes one or more printhead dies. “Printhead” and “printhead die” are not limited to printing with ink and other printing fluids but also include inkjet type dispensing of other fluids and/or for uses other than printing.
Referring first to
In the example of print bar 12 shown in
Referring now to
Printing fluid supply channel 44 is substantially wider than printing fluid ports 54, as shown, to carry printing fluid from larger, loosely spaced passages in the flow regulator or other parts that carry printing fluid into print bar 12 to the smaller, tightly spaced printing fluid ports 54 in printhead die 36. Thus, printing fluid supply channels 44 can help reduce or even eliminate the need for a discrete “fan-out” fluid routing structure necessary in some conventional printheads. In addition, exposing a substantial area of printhead die surface 56 directly to channel 44, as shown, allows printing fluid in channel 44 to help cool die 36 during printing.
The idealized representation of a printhead die 36 in
Printhead 36 shown in
Continuing to refer to
A molded printhead 14 enables the use of long, narrow and very thin printhead dies 36. While a 100 μm thick printhead die 36 with an aspect ratio of 50 is believed to be new, it has been shown that a 100 μm thick printhead die 36 that is about 25 mm long and 200 μm wide can be molded into a 500 μm thick molding 38 with 90 μm wide channels 44—a die length to width ratio of 120, which is almost 2½ times that of even the smallest dies now available in conventional printheads. The thickness of printhead die 36 is indicated by dimension TD in
It is expected that current die handling equipment and micro device molding tools and techniques can adapted to mold dies 36 as thin as 50 μm, with a length/width ratio up to 150, and to mold channels 44 as narrow as 30 μm. Molding 38 provides an effective but inexpensive structure in which multiple rows of such die “slivers” 36 can be supported in a single, monolithic body. The die slivers can be spaced within the molding to eliminate the need for a discrete ink channel fan-out structure used in conventional printheads.
As noted at the beginning of this Description, the examples shown in the figures and described above illustrate but do not limit the invention. Other examples are possible. Therefore, the foregoing description should not be construed to limit the scope of the invention, which is defined in the following claims.
Number | Date | Country | Kind |
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PCT/US2013/028207 | Feb 2013 | WO | international |
PCT/US2013/033046 | Mar 2013 | WO | international |
The present application is a continuation application claiming priority under 35 USC § 120 from co-pending U.S. patent application Ser. No. 14/771,008 filed on Aug. 27, 2015 by Chen et al. and entitled PRINTHEAD DIE, which was an application filed under 35 USC 371 claiming party from PCT/US2013/046065 filed on Jun. 17, 2013 by Chen et al. and entitled PRINTHEAD DIE, the full disclosures each of which are hereby incorporated by reference.
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