Reference is made to commonly-assigned, U.S. patent application Ser. No. 12/511,147, entitled “PRINTHEAD HAVING REINFORCED NOZZLE MEMBRANE STRUCTURE” filed concurrently herewith.
This invention relates generally to the field of digitally controlled printing systems, and in particular to the printheads of these types of printing systems.
Traditionally, inkjet printing is accomplished by one of two technologies referred to as “drop-on-demand” and “continuous” inkjet printing. In both, liquid, such as ink, is fed through channels formed in a print head. Each channel includes a nozzle from which droplets are selectively extruded and deposited upon a recording surface.
Drop on demand printing only provides drops (often referred to a “print drops”) for impact upon a print media. Selective activation of an actuator causes the formation and ejection of a drop from a printhead that strikes the print media. The formation of printed images is achieved by controlling the individual formation of drops. Typically, one of two types of actuators is used in drop on demand printing—heat actuators and piezoelectric actuators. With heat actuators, a heater, placed at a convenient location adjacent to the nozzle, heats the ink. This causes a quantity of ink to phase change into a gaseous steam bubble that raises the internal ink pressure sufficiently for an ink droplet to be expelled. With piezoelectric actuators, an electric field is applied to a piezoelectric material possessing properties causing a wall of a liquid chamber adjacent to a nozzle to be displaced, thereby producing a pumping action that causes an ink droplet to be expelled.
Continuous inkjet printing uses a pressurized liquid source connected in fluid communication to a printhead to eject liquid jets from the printhead. Streams of drops are formed from the liquid jets. Some of these drops are selected to contact a print media (often referred to a “print drops”) while others are selected to be collected and either recycled or discarded (often referred to as “non-print drops”). For example, when no print is desired, the drops are deflected into a capturing mechanism (commonly referred to as a catcher, interceptor, or gutter) and either recycled or discarded. When printing is desired, the drops are not deflected and allowed to strike a print media. Alternatively, deflected drops can be allowed to strike the print media, while non-deflected drops are collected in the capturing mechanism.
As the printing industry continues to develop these types of printing systems, aspects of these printing systems are refined in order to maintain various characteristics. For example, as longer printheads (often referred to as pagewide printheads) are developed, printhead components can be refined in order to maintain manufacturing costs at reasonable levels. Nozzle plates, for example, can be thinned or otherwise reduced in thickness while channels that, for example, supply liquid to the nozzles are lengthened or otherwise increased in size. As a result, these printheads tend to be structurally weak so that if the printhead is subjected to mechanical stresses, for example, during packaging or operation, the printhead might sufficiently fatigue and prematurely fail. Throughout this process, there is a desire to maintain printhead characteristics that help to provide acceptable image quality levels during printhead operation.
As such, there is an ongoing effort to improve the structural integrity of printheads while maintaining printhead characteristics that help to provide acceptable image quality levels during printhead operation.
According to one feature of the present invention, a printhead includes a first nozzle bore, a liquid chamber, and a second nozzle bore. The liquid chamber is positioned between the first nozzle bore and the second nozzle bore and extends beyond the opening of the first nozzle bore. The first nozzle bore is in liquid communication with the second nozzle bore through the liquid chamber.
According to another feature of the present invention, a printhead includes a jetting module including a plurality of nozzle structures. Each nozzle structure includes a first nozzle bore, a liquid chamber, and a second nozzle bore. The liquid chamber is positioned between the first nozzle bore and the second nozzle bore and extends beyond the opening of the first nozzle bore. The first nozzle bore is in liquid communication with the second nozzle bore through the liquid chamber.
According to another feature of the present invention, a method of printing includes providing a printhead including a jetting module including a plurality of nozzle structures, each nozzle structure including a first nozzle bore, a liquid chamber, and a second nozzle bore, the liquid chamber being positioned between the first nozzle bore and the second nozzle bore, the liquid chamber extending beyond the opening of the first nozzle bore, the first nozzle bore being in liquid communication with the second nozzle bore through the liquid chamber; and a drop forming mechanism associated with the jetting module; providing a liquid under pressure sufficient to eject jets of the liquid through the plurality of nozzle structures; and actuating the drop forming mechanism to form drops from the jets of liquid.
In the detailed description of the example embodiments of the invention presented below, reference is made to the accompanying drawings, in which:
The present description will be directed in particular to elements forming part of, or cooperating more directly with, apparatus in accordance with the present invention. It is to be understood that elements not specifically shown or described can take various forms well known to those skilled in the art. In the following description and drawings, identical reference numerals have been used, where possible, to designate identical elements.
The example embodiments of the present invention are illustrated schematically and not to scale for the sake of clarity. One of the ordinary skills in the art will be able to readily determine the specific size and interconnections of the elements of the example embodiments of the present invention.
As described herein, the example embodiments of the present invention provide a printhead or printhead components typically used in inkjet printing systems. However, many other applications are emerging which use inkjet printheads to emit liquids (other than inks) that need to be finely metered and deposited with high spatial precision. As such, as described herein, the terms “liquid” and “ink” refer to any material that can be ejected by the printhead or printhead components described below.
Referring to
Recording medium 32 is moved relative to printhead 30 by a recording medium transport system 34, which is electronically controlled by a recording medium transport control system 36, and which in turn is controlled by a micro-controller 38. The recording medium transport system shown in
Ink is contained in an ink reservoir 40 under pressure. In the non-printing state, continuous ink jet drop streams are unable to reach recording medium 32 due to an ink catcher 42 that blocks the stream and which can allow a portion of the ink to be recycled by an ink recycling unit 44. The ink recycling unit reconditions the ink and feeds it back to reservoir 40. Such ink recycling units are well known in the art. The ink pressure suitable for optimal operation will depend on a number of factors, including geometry and thermal properties of the nozzles and properties of the ink. A constant ink pressure can be achieved by applying pressure to ink reservoir 40 under the control of ink pressure regulator 46. Alternatively, the ink reservoir can be left unpressurized, or even under a reduced pressure (vacuum), and a pump is employed to deliver ink from the ink reservoir under pressure to the printhead 30. In such an embodiment, the ink pressure regulator 46 can comprise an ink pump control system. As shown in
The ink is distributed to printhead 30 through an ink channel 47. The ink preferably flows through slots or holes etched through a silicon substrate of printhead 30 to its front surface, where a plurality of nozzles and drop forming mechanisms, for example, heaters, are situated. When printhead 30 is fabricated from silicon, drop forming mechanism control circuits 26 can be integrated with the printhead. Printhead 30 also includes a deflection mechanism (not shown in
Referring to
Liquid, for example, ink, is emitted under pressure through each nozzle 50 of the array to form filaments of liquid 52. In
Jetting module 48 is operable to form liquid drops having a first size or volume and liquid drops having a second size or volume through each nozzle. To accomplish this, jetting module 48 includes a drop stimulation or drop forming device 28, for example, a heater or a piezoelectric actuator, that, when selectively activated, perturbs each filament of liquid 52, for example, ink, to induce portions of each filament to breakoff from the filament and coalesce to form drops 54, 56.
In
Typically, one drop forming device 28 is associated with each nozzle 50 of the nozzle array. However, a drop forming device 28 can be associated with groups of nozzles 50 or all of nozzles 50 of the nozzle array.
When printhead 30 is in operation, drops 54, 56 are typically created in a plurality of sizes or volumes, for example, in the form of large drops 56, a first size or volume, and small drops 54, a second size or volume. The ratio of the mass of the large drops 56 to the mass of the small drops 54 is typically approximately an integer between 2 and 10. A drop stream 58 including drops 54, 56 follows a drop path or trajectory 57.
Printhead 30 also includes a gas flow deflection mechanism 60 that directs a flow of gas 62, for example, air, past a portion of the drop trajectory 57. This portion of the drop trajectory is called the deflection zone 64. As the flow of gas 62 interacts with drops 54, 56 in deflection zone 64 it alters the drop trajectories. As the drop trajectories pass out of the deflection zone 64 they are traveling at an angle, called a deflection angle, relative to the undeflected drop trajectory 57.
Small drops 54 are more affected by the flow of gas than are large drops 56 so that the small drop trajectory 66 diverges from the large drop trajectory 68. That is, the deflection angle for small drops 54 is larger than for large drops 56. The flow of gas 62 provides sufficient drop deflection and therefore sufficient divergence of the small and large drop trajectories so that catcher 42 (shown in
When catcher 42 is positioned to intercept large drop trajectory 68, small drops 54 are deflected sufficiently to avoid contact with catcher 42 and strike the print media. As the small drops are printed, this is called small drop print mode. When catcher 42 is positioned to intercept small drop trajectory 66, large drops 56 are the drops that print. This is referred to as large drop print mode.
Referring to
Drop stimulation or drop forming device 28 (shown in
Positive pressure gas flow structure 61 of gas flow deflection mechanism 60 is located on a first side of drop trajectory 57. Positive pressure gas flow structure 61 includes first gas flow duct 72 that includes a lower wall 74 and an upper wall 76. Gas flow duct 72 directs gas flow 62 supplied from a positive pressure source 92 at downward angle θ of approximately a 45° relative to liquid filament 52 toward drop deflection zone 64 (also shown in
Upper wall 76 of gas flow duct 72 does not need to extend to drop deflection zone 64 (as shown in
Negative pressure gas flow structure 63 of gas flow deflection mechanism 60 is located on a second side of drop trajectory 57. Negative pressure gas flow structure includes a second gas flow duct 78 located between catcher 42 and an upper wall 82 that exhausts gas flow from deflection zone 64. Second duct 78 is connected to a negative pressure source 94 that is used to help remove gas flowing through second duct 78. An optional seal(s) 84 provides an air seal between jetting module 48 and upper wall 82.
As shown in
Gas supplied by first gas flow duct 72 is directed into the drop deflection zone 64, where it causes large drops 56 to follow large drop trajectory 68 and small drops 54 to follow small drop trajectory 66. As shown in
Alternatively, deflection can be accomplished by applying heat asymmetrically to filament of liquid 52 using an asymmetric heater 51. When used in this capacity, asymmetric heater 51 typically operates as the drop forming mechanism in addition to the deflection mechanism. This type of drop formation and deflection is known having been described in, for example, U.S. Pat. No. 6,079,821, issued to Chwalek et al., on Jun. 27, 2000. Conventional electrostatic deflection can also be used to accomplish drop deflection.
As shown in
Referring to
The liquid chamber 106 is positioned between the first nozzle bore 100A and the second nozzle bore 107A and extends beyond the opening of the first nozzle bore such that the liquid chamber 106 is wider than the opening of the first nozzle bore 100A when viewed from a plane that is parallel to a cross sectional view of the jetting module 48 (the view shown in
The opening of the first nozzle bore 100A and the opening of the second nozzle bore 107A are not equivalent. Typically, the opening of the second nozzle bore 107A is smaller than the opening of the first nozzle bore 100A. This reduces the total pressure drop across the printhead and therefore the pressure required for jetting. This type of nozzle geometry 50 also creates a converging flow which helps in jet straightness and also reduces issues due to possible misalignments between 100A and 107A during manufacturing that could cause jet misdirection. Another advantage of this design is the ability to optimize heater geometry for a more effective stimulation because the heater geometry and the jet size and liquid velocity can be designed independently compared to a design where support layer 104 and second nozzle membrane 107 are absent.
Substrate 102 includes a liquid feed channel 47 that provides liquid to the plurality of nozzle structures 50. Liquid feed channel 47 extends along the length 108 of the nozzle plate 112 such that liquid feed channel 47 is common to each nozzle structure 50 of the plurality of nozzle structures 50. Including a liquid feed channel that is common to nozzle structures 50 helps to reduce the likelihood of drop misdirection caused by, for example, misdirected liquid jets. Portions 114 of substrate 102 form walls 116 that help to define the liquid feed channel 47. Substrate 102 is a silicon substrate. First nozzle membrane 100 includes integrated CMOS circuitry fabricated on substrate 102 using, for example, a CMOS process that includes a standard 0.5 micrometers mixed signal process incorporating two levels of polysilicon and three levels of metal. In
The CMOS process also provides a layer of polysilicon (POLY 1, POLY 2) as a stimulation device, for example, a heater element for heating liquid in each nozzle structure 50. During fabrication, a recess (not shown) over first nozzle bore 100A can be etched at the same time as the oxide/nitride film over the bond pads are etched while the bores are photolithographically defined and etched subsequently, since such steps are compatible with VLSI CMOS processing.
As a result of the conventional CMOS fabrication steps a silicon substrate of approximately 675 micrometers in thickness and about 6 inches in diameter is provided. Larger or smaller diameter silicon wafers can be used equally as well. A plurality of transistors are formed in the silicon substrate through conventional steps of selectively depositing various materials to form these transistors as is well known in the industry. Supported on the silicon substrate are a series of layers eventually forming an oxide/nitride insulating layer that has one or more layers of polysilicon and metal layers formed therein in accordance with desired pattern. Vias are provided between various layers as needed and to the bond pads. The various bond pads are provided to make respective connections of data, latch clock, enable clocks, and power provided from a circuit board mounted adjacent the printhead or from a remote location. Although only one of the bond pads is shown it will be understood that multiple bond pads are formed in the nozzle array. The first nozzle membrane 100 shown in
At this point, the silicon wafers are taken out of the CMOS facility. The support layer 104 is typically coated and patterned at this stage followed by deposition and patterning of layer 107 (as shown in
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The invention has been described in detail with particular reference to certain preferred embodiments thereof, but it will be understood that variations and modifications can be effected within the scope of the invention.
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Number | Date | Country | |
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20110025779 A1 | Feb 2011 | US |