Droplet ejection devices are used for depositing droplets on a substrate. Ink jet printers are a type of droplet ejection device. Ink jet printers typically include an ink supply to a nozzle path. The nozzle path terminates in a nozzle opening from which ink drops are ejected. Ink drop ejection is controlled by pressurizing ink in the ink path with an actuator, which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electro statically deflected element. A typical printhead has an array of ink paths with corresponding nozzle openings and associated actuators, such that drop ejection from each nozzle opening can be independently controlled. In a drop-on-demand printhead, each actuator is fired to selectively eject a drop at a specific pixel location of an image as the printhead and a printing substrate are moved relative to one another. In high performance printheads, the nozzle openings typically have a diameter of 50 microns or less, e.g. around 35 microns, are separated at a pitch of 100-300 nozzle/inch, have a resolution of 100 to 3000 dpi or more, and provide drop sizes of about 1 to 70 picoliters or less. Drop ejection frequency can be 10 kHz or more.
Printing accuracy is influenced by a number of factors, including the size and velocity uniformity of drops ejected by the nozzles in the head and among multiple heads in a printer. The drop size and drop velocity uniformity are in turn influenced by factors such as the dimensional uniformity of the ink paths, acoustic interference effects, contamination in the ink flow paths, and the actuation uniformity of the actuators.
In general, in an aspect, a printhead includes a body; an actuator attached to the body, and an enclosed space between the actuator and the body forms a chamber; an opening defined by the body for releasing pressure in the chamber; and a seal attached to the opening to seal the chamber while permitting pressure to be released.
Implementation can include one or more of the following features. The actuator can include a piezoelectric material, and the seal can be made of plastic (e.g., polyimide). The printhead can include a laminate subassembly, the actuator can be attached to the laminate subassembly, and the laminate subassembly can include a flex print, cavity plate, descender plate, acoustic dampener, spacer, and an orifice plate. Openings can be formed in the acoustic dampener, and channels can be formed in the descender plate. The printhead can include an ink manifold defined by the body. The seal can be attached to the opening using a detachable adhesive.
In another aspect, a flexible circuit includes a body made of a flexible material, electrical traces formed on the body, and openings defined by the body for fluid to pass through.
Implementations can include one or more of the following features. The body can be made of a polyimide, or can include two layers of a flexible material (e.g., polyimide) that are bonded together (e.g., with an adhesive that can include polyimide). The body can include a base layer (e.g., polyimide material), the electrical traces being formed on the base layer, and a coverlay (e.g., printable polyimide) covering the electrical traces.
In yet another aspect, a laminate subassembly includes a plurality of laminates, including an actuator, cavity plate, descender plate, and orifice plate, each laminate having openings, the openings in each laminate align with the openings in the other laminates, and inspection of the openings ensures alignment and placement of the laminates.
Implementations can include one or more of the following features. The laminate subassembly can further include a fiducial mark on the actuator, such that the fiducial mark is visible when the laminates are aligned. The plurality of laminates can also include an acoustic dampener, flexible circuit, and a spacer.
In an aspect, a method of aligning laminates includes providing a plurality of laminates with openings, including an actuator, cavity plate, descender plate, and orifice plate, one of the laminates includes a fiducial mark; aligning the laminates using the openings in the laminates and the fiducial mark on one of the laminates; attaching the laminates together; and inspecting the openings to determine alignment of the laminates. Inspecting the openings can include using a camera to look through the openings in the laminates to verify that the fiducial mark is aligned with the openings.
Further aspects, features, and advantages will become apparent from the following detailed description, the drawings, and the claims.
Referring to
Referring to
Referring to
Referring to
When the air pressure inside the chamber 32 rises, a force is applied around the perimeter of the opening 22, where the seal 24 contacts the opening 22. The amount of force applied to the seal 24 is a function of the radius of the opening 22. At a certain pressure, the adhesive that bonds the seal 24 to the opening 22 can detach from the surface of the opening 22 to release air pressure, and subsequently reattach. The radius of the opening 22 and strength of the adhesive can be designed for specified air pressures, such that the adhesive detaches and reattaches at specified air pressures.
Referring to
Referring to
Referring to
The body 12 can be made of a plastic material, such as polyphenylene sulfide (PPS), or metal, such as aluminum. The cover 26 can be made of metal or a plastic material, such as Delrin® acetal. The flex print 30 and acoustic dampener 38 can be made of Upilex® polyimide, while the descender plate 36 and cavity plate 34 can be made of a metal, such as Kovar® metal alloy. The spacer 40 can be made of material with a low modulus, such as carbon (about 7 MPa) or polyimide (about 3 MPa). The orifice plate 42 can be made of stainless steel.
The spacer 40 can be used to bond the orifice plate 42 and acoustic dampener 38 within the laminate subassembly 14. Rather than directly apply adhesive to the orifice plate 42 or acoustic dampener 38, adhesive can be directly applied on both sides of the spacer and the orifice plate 42 and acoustic dampener 38 can then be bonded to the spacer. The spacer can also distribute the strain between laminates with different thermal coefficients of expansion. For example, laminates with different thermal coefficients of expansion bonded together at a bonding temperature of about 150° C. can bow as the laminates cool to room temperature (about 22° C.). The spacer can reduce bowing in the laminate subassembly by distributing the bond strain. The thickness of the spacer and its modulus can affect its ability to distribute strain within the subassembly. The percent strain of the spacer is a function of the strain divided by the thickness of the spacer.
Referring to
In other implementations, the body and laminate subassembly can be attached by other securing devices, such as adhesives, screws, and clasps. The parts of the subassembly can be secured by other materials or adhesives. The seal 24 can be attached to the opening in the body by other adhesives. Referring to
The connectors 60 in
Referring to
Referring to
Referring to
Referring again to
Other implementations are within the scope of the following claims.
This application is a divisional application of U.S. patent application Ser. No. 11/741,325 filed on Apr. 27, 2007, now U.S. Pat. No. 8,403,460, which claims the benefit under 35 USC §119(e) to U.S. Patent Application Ser. No. 60/796,154, filed on Apr. 28, 2006. The contents of both of which are hereby incorporated by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
5512793 | Takeuchi et al. | Apr 1996 | A |
6070965 | Fujimoto | Jun 2000 | A |
6089698 | Temple et al. | Jul 2000 | A |
6260951 | Harvey et al. | Jul 2001 | B1 |
6322200 | Feinn et al. | Nov 2001 | B1 |
8403460 | Duby et al. | Mar 2013 | B2 |
20020051039 | Moynihan et al. | May 2002 | A1 |
20030215335 | Crivelli | Nov 2003 | A1 |
20040107902 | Jiang et al. | Jun 2004 | A1 |
20050179735 | Keenan et al. | Aug 2005 | A1 |
Number | Date | Country |
---|---|---|
0666605 | Apr 1998 | EP |
1559556 | Aug 2005 | EP |
11-216861 | Aug 1999 | JP |
11-238920 | Aug 1999 | JP |
200574966 | Mar 2005 | JP |
2005-238720 | Sep 2005 | JP |
2006-62373 | Mar 2006 | JP |
WO 9315911 | Aug 1993 | WO |
WO 9910179 | Mar 1999 | WO |
Entry |
---|
U.S. Appl. No. 60/796,154, Apr. 28, 2006, Duby et al. |
Communication pursuant to Article 94(3) EPC in Europe Application No. 07761353.7 mailed May 6, 2010, 7 pages. |
International Preliminary Report on Patentability from international application No. PCT/US2007/067506 dated Nov. 6, 2008, 6 pgs. |
International Search Report and Written Opinion from international application No. PCT/US2007/067506 dated Feb. 12, 2008, 9 pgs. |
Search Report dated Dec. 28, 2009 in co-pending European application No. 07761353.7. |
Office action dated Jan. 13, 2011 issued in corresponding Chinese application No. 201010126147.7, 5 pgs. |
Office action dated Apr. 13, 2011 issued in Chinese Application No. 201010126149.6. |
Office action dated Jul. 19, 2011 issued in Japanese Application No. 2009-507954. |
Office action dated Aug. 4, 2011 issued in Chinese application no. 201010126147.7, 5 pgs. |
Office action dated Aug. 30, 2011 issued in Chinese Application No. 200780015481.1. |
Office action dated Feb. 23, 2012 issued in Chinese application no. 201010126149.6, 5 pgs. |
Office action issued Mar. 5, 2012 in Chinese application no. 201010126147.7, 8 pgs. |
Office Action dated Mar. 21, 2012 issued in Japanese Application No. 2011-254023 (4 pages). |
Office action dated May 29, 2012 issued in Chinese Application No. 200780015481.1. |
Office Action dated Jul. 3, 2012 and its English translation issued in Japanese Application No. 2011-254022 (8 pages). |
Office action dated Oct. 10, 2012 issued in Chinese application no. 201010126147.7 (8 pgs.). |
Chinese Office action issued Mar. 1, 2013 in Chinese Application No. 201010126147.7, 10 pages. |
Chinese office action, with English translation, Application No. 201010126147.7, dated Aug. 13, 2013, 12 pages. |
Hong, Jin et al., “Printed Circuit Technology,” (with partial English translation) Dec. 31, 2003, pp. 236-239. |
Number | Date | Country | |
---|---|---|---|
20130155153 A1 | Jun 2013 | US |
Number | Date | Country | |
---|---|---|---|
60796154 | Apr 2006 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11741325 | Apr 2007 | US |
Child | 13766939 | US |