BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, in which:
FIG. 1 is a front and side perspective of a printer embodying the present invention;
FIG. 2 shows the printer of FIG. 1 with the front face in the open position;
FIG. 3 shows the printer of FIG. 2 with the printhead cartridge removed;
FIG. 4 shows the printer of FIG. 3 with the outer housing removed;
FIG. 5 shows the printer of FIG. 3 with the outer housing removed and printhead cartridge installed;
FIG. 6 is a schematic representation of the printers fluidic system;
FIG. 7 is a top and front perspective of the printhead cartridge;
FIG. 8 is a top and front perspective of the printhead cartridge in its protective cover;
FIG. 9 is a top and front perspective of the printhead cartridge removed from its protective cover;
FIG. 10 is a bottom and front perspective of the printhead cartridge;
FIG. 11 is a bottom and rear perspective of the printhead cartridge;
FIG. 12 shows the elevations of all sides of the printhead cartridge;
FIG. 13 is an exploded perspective of the printhead cartridge;
FIG. 14 is a transverse section through the ink inlet coupling of the printhead cartridge;
FIG. 15 is an exploded perspective of the ink inlet and filter assembly;
FIG. 16 is a section view of the cartridge valve engaged with the printer valve;
FIG. 17 is a perspective of the LCP molding and flex PCB;
FIG. 18 is an enlargement of inset A shown in FIG. 17;
FIG. 19 is an exploded bottom perspective of the LCP/flex PCB/printhead IC assembly;
FIG. 20 is an exploded top perspective of the LCP/flex PCB/printhead IC assembly;
FIG. 21 is an enlarged view of the underside of the LCP/flex PCB/printhead IC assembly;
FIG. 22 shows the enlargement of FIG. 21 with the printhead ICs and the flex PCB removed;
FIG. 23 shows the enlargement of FIG. 22 with the printhead IC attach film removed;
FIG. 24 shows the enlargement of FIG. 23 with the LCP channel molding removed;
FIG. 25 shows the printhead ICs with back channels and nozzles superimposed on the ink supply passages;
FIG. 26 in an enlarged transverse perspective of the LCP/flex PCB/printhead IC assembly;
FIG. 27 is a plan view of the LCP channel molding;
FIGS. 28A and 28B are schematic section views of the LCP channel molding priming without a weir;
FIGS. 29A, 29B and 29C are schematic section views of the LCP channel molding priming with a weir;
FIG. 30 in an enlarged transverse perspective of the LCP molding with the position of the contact force and the reaction force;
FIG. 31 shows a reel of the IC attachment film;
FIG. 32 shows a section of the IC attach film between liners; and
FIG. 33 is a partial section view showing the laminate structure of the attachment film.