Downhole exploration and production efforts require the deployment of a large number of tools. These tools include the drilling equipment and other devices directly involved in the effort as well as sensors and measurement systems that provide information about the downhole environment. When one or more of the tools malfunctions during operation, the entire drilling or production effort may need to be halted while a repair or replacement is completed.
According to an aspect of the invention, a system to determine health prognostics for selection and management of a tool for deployment in a downhole environment includes a database configured to store life cycle information of the tool, the life cycle information including environmental and operational parameters associated with use of the tool; a memory device configured to store statistical equations to determine the health prognostics of the tool; and a processor configured to calibrate the statistical equations and build a time-to-failure model of the tool based on a first portion of the life cycle information in the database.
According to another aspect of the invention, a method to determine health prognostics for selection and management of a tool for deployment in a downhole environment includes storing, in a database, life cycle information of the tool, the life cycle information including environmental and operational parameters associated with use of the tool; storing, in a memory device, statistical equations to determine the health prognostics of the tool; and calibrating, using a processor, the statistical equations based on a first portion of the life cycle information and building a time-to-failure model of the tool.
Referring now to the drawings wherein like elements are numbered alike in the several Figures:
As noted above, the malfunction of a downhole tool during an exploration or production effort can be costly in terms of the time and related expense related to repair or replacement. Embodiments of the system and method detailed herein relate to the development of calibrated time to failure models that facilitate tool selection and management for a downhole project.
Table 1 illustrates the type of output provided by the TTF models 335. The table may include cumulative temperature in Centigrade (C), cumulative lateral and stickslip root-mean-square acceleration (g_RMS), drill hours, and worst-case, predicted mean, and best-case life (in hours). Thus, a tool may be selected based on its worst-case life hours being sufficiently greater than the drill hours (already-used time) to accommodate an expected duration of an operation, for example.
While one or more embodiments have been shown and described, modifications and substitutions may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is to be understood that the present invention has been described by way of illustrations and not limitation.
Number | Name | Date | Kind |
---|---|---|---|
5251144 | Ramamurthi | Oct 1993 | A |
5803186 | Berger et al. | Sep 1998 | A |
6516293 | Huang et al. | Feb 2003 | B1 |
6732052 | MacDonald et al. | May 2004 | B2 |
7107154 | Ward | Sep 2006 | B2 |
7143007 | Long et al. | Nov 2006 | B2 |
7286959 | Steinke | Oct 2007 | B2 |
7451639 | Goldfine et al. | Nov 2008 | B2 |
7979240 | Fielder | Jul 2011 | B2 |
8200442 | Adams et al. | Jun 2012 | B2 |
8204691 | Deere | Jun 2012 | B2 |
8255171 | Balestra | Aug 2012 | B2 |
8274399 | Strachan et al. | Sep 2012 | B2 |
8453764 | Turner et al. | Jun 2013 | B2 |
8494810 | Goldfine et al. | Jul 2013 | B2 |
20030168257 | Aldred | Sep 2003 | A1 |
20050197813 | Grayson | Sep 2005 | A1 |
20070239407 | Goldfine et al. | Oct 2007 | A1 |
20090299654 | Garvey | Dec 2009 | A1 |
20100042327 | Garvey | Feb 2010 | A1 |
20110125419 | Bechhoefer | May 2011 | A1 |
20110174541 | Strachan et al. | Jul 2011 | A1 |
20110196593 | Jiang | Aug 2011 | A1 |
20120016589 | Li et al. | Jan 2012 | A1 |
20120084008 | Zhan et al. | Apr 2012 | A1 |
20120118637 | Wang et al. | May 2012 | A1 |
20120316787 | Moran et al. | Dec 2012 | A1 |
Entry |
---|
Kale et al., “A Probabilistic Approach for Reliability and Life Prediction of Electronics in Drilling and Evaluation Tools” Annual Conference of the Prognostics and Health Management Society, 2014, pp. 1-20. |
Bailey et al., “Reliability Analysis for Power Electronics Modules”, IEEE 30th International Spring Seminar on Electronics Technology, 2007, pp. 1-6. |
Baker Hughes Incorporated “Repair and Maintenance Return Policy for Printed Circuit Board Assemblies”, Document RM-002, Revision B, 2010, pp. 1-17. |
Baker Hughes Incorporated, “OnTrak Repair & Maintenance Manual”, OTK-10-0500-001 Rev N, 2008, pp. 1-35. |
Barker et al., “PWB Solder Joint Life Calculations Under Thermal and Vibrational Loading”, Journal of the IES, vol. 35, No. 1, Feb. 1992, pp. 17-25. |
Boller et al., “Encyclopedia of Structural Health Monitoring”, Pub. Date: Mar. 2009, ISBN-13: 9780470058220, pp. 1-30. |
Born et al., “Marginal Checking—A Technique to Detect Incipient Failures”, Proceedings of the IEEE Aerospace and Electronics Conference, May 22-26, 1989, pp. 1880-1886. |
Chatterjee et al., “Fifty Years of Physics of Failure”, Journal of Reliability Information Analysis Center, 2012, pp. 1-5. |
Dasgupta, Abhijit “Failure Mechanism Models for Cyclic Fatigue”, IEEE Transactions on Reliability, vol. 42, No. 4, Dec. 1993, pp. 548-555. |
Duffek, Darrell, “Effect of Combined Thermal and Mechanical Loading on the Fatigue of Solder Joints”, Master's Thesis 2004. University of Notre Dame, IN, pp. 1-65. |
Evans et al., “A Framework for Reliability Modeling of Electronics”, 1995 Proceedings Annual Reliability and Maintainability Symposium, 1995, pp. 144-151. |
Garvey et al., “Pattern Recognition Based Remaining Useful Life Estimation of Bottom Hole Assembly Tools”, SPE/IADC Drilling Conference and Exhibition, 2009, pp. 1-8. |
Gingerich et al., “Reliable Electronics for High-Temperature Downhole Applications”, SPE 56438, 1999, pp. 1-8. |
Hu et al., “A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics”, ASME Journal of Electronics Packaging, vol. 113, Sep. 1991, pp. 275-285. |
International Preliminary Report on Patentability for PCT Application No. PCT/US2014/069088, dated Jun. 21, 2016, pp. 1-8. |
Kalgren et al., “Application of Prognostic Health Management in Digital Electronic Systems”, Aerospace Conference, IEEE 2007, pp. 1-9. |
Lall et al., “Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments”, 2005 Electronic Components and Technology Conference, 2005, pp. 127-136. |
Lall et al., “Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads”, IEEE Transactions on Components and Packaging Technologies, vol. 32, No. 3, Sep. 2009, pp. 600-616. |
Lall, Pradeep “Tutorial: Temperature As an Input to Microelectronics-Reliability Models”, IEEE Transactions on Reliability, vol. 45, No. 1, Mar. 1996, pp. 3-9. |
Mirgkizoudi et al., “Reliability Testing of Electronic Packages in Harsh Environments”, 12th Electronics Packaging Technology Conference, 2010, pp. 224-230. |
Mishra et al., “In-situ Sensors for Product Reliability Monitoring”, Proceedings of SPIE, vol. 4755, 2002, pp. 10-19. |
Nasser et al., “Electronics Reliability Prognosis Through Material Modeling and Simulation”, IEEE Aerospace Conference, 2006, pp. 1-7. |
Normann et al., “Recent Advancements in High-Temperature, High-Reliability Electronics Will Alter Geothermal Exploration”, Proceedings World Geothermal Congress, Apr. 24-29, 2005, pp. 1-5. |
Osterman, Dr. Michael “We Still Have a Headache With Arrhenius”, Electronics Cooling, vol. 7, No. 1, Feb. 2001, pp. 1-3. |
Ridgetop Group, “Hot Carrier Injection (HCI) Die-Level Reliability Monitor”, retrieved Oct. 12, 2016, retrieved from the Internet http://www.ridgetopgroup.com/products/semiconductors-for-critical-applications/sentinel-silicon-technology/hot-carrier-injection-hci/. |
Shinohara et al., “Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis”, Egineering, 2010, pp. 1006-1018. |
Sutherland et al., “Prognostics, A New Look at Statistical Life Prediction for Condition-Based Maintenance”, IEEE, 2003, pp. 1-6. |
Vichare et al., “Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design”, Quality Technology & Quantitative Management, vol. 4, No. 2, 2007, pp. 235-250. |
Vichare, Nikhil M. “Prognosis and Health Management of Electronics by Utilizing Environmental and Usage Loads”, Doctoral Thesis 2006, University of Maryland, College Park, pp. 1-166. |
Vijayaragavan, Niranjan “Physics of Failure based Reliability Assessment of Printed Circuit Boards used in Permanent Downhole Monitoring Sensor Gauges”, Master's Thesis 2003, University of Maryland, College Park, pp. 1-46. |
Wassell et al., “Method of Establishing Vibration Limits and Determining Accumulative Vibration Damage in Drilling Tools”, SPE Annual Technical Conference and Exhibition, Sep. 2010, pp. 1-10. |
White et al., “Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation”, NASA Joint Propulsion Laboratory Report, Project No. 102197, 2008, pp. 1-216. |
Wong, Kam L. “A New Framework for Part Failure-Rate Prediction Models”, IEEE Transactions on Reliability, vol. 14, No. 1, Mar. 1995, pp. 139-146. |
Young et al., “Failure Mechanism Models for Electromigration”, IEEE Transactions on Reliability, vol. 43, No. 2, Jun. 1994, pp. 186-192. |
Zhang et al., “A Hybrid Prognostics and Health Management Approach for Condition-Based Maintenance”, IEEE International Conference on Industrial Engineering and Engineering Management, 2009, pp. 1-5. |
Zhang et al., “Model uncertainty and Bayesian updating in reliability-based inspection”, Structural Safety, 2000, pp. 145-160. |
Lall et al., “Influence of Temperature on Microelectronics and System Reliability”, CRC Press, New York, NY, 1997, pp. 1-12, 13-100, 101-154, 155-168, 169-182, Chapters 7 and 8, and 257-292. |
Pecht et al., “Guidebook for Managing Silicon Chip Reliability”, CRC Press, Boca Raton, FL, 1999, pp. 3-6, 7-12, 13-18, 19-24, 25-30, 31-36, 37-40, 41-44, 49-60, 183-194 and 199-212. |
Number | Date | Country | |
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20150167454 A1 | Jun 2015 | US |