This application is based on Japanese Patent Application No. 2014-175465 filed on Aug. 29, 2014, the contents of which are hereby incorporated by reference.
1. Field of the Invention
The present invention relates to probes for optoacoustic imaging devices.
2. Description of Related Art
Optoacoustic imaging is known whereby an optoacoustic wave which is an elastic wave generated as a result of light transmitted from a light source into a tested object being absorbed inside the tested object is detected and turned into an image through signal processing.
For example, Japanese patent application published No. 2013-233238 (hereinafter “Patent Document 1”) discloses a probe for an optoacoustic imaging device, and this probe comprises an optical fiber for transmitting laser light emitted from a laser light source and a light guide member for guiding the laser light transmitted across the optical fiber to a tested object.
Inconveniently, however, systems employing lasers are large in size, and solid-state lasers are expensive; thus systems employing LED light sources are sought. An LED light source may be applied to the probe disclosed in Patent Document 1, but then, to allow the use of different types of LED light sources (having different wavelengths, etc.), as many probes need to be built, which is disadvantageous in terms of cost, etc.
Incidentally, Japanese patent application published No. 2013-48892 (hereinafter “Patent Document 2”) discloses a probe provided with an attachment having a light guide member for guiding laser light emitted from a laser light source to a tested object. However, Patent Document 2 gives no consideration to using an LED light source.
An object of the present invention is to provide a probe for an optoacoustic imaging device which allows use of a plurality of kinds of light-emitting semiconductor element light sources without requiring an increased number of probes and which are thus advantageous in terms of cost, etc.
To achieve the above object, according to one aspect of the present invention, a probe for an optoacoustic imaging device includes: an irradiator including a light-emitting semiconductor element light source that irradiates a tested object with light; and a detector which detects an optoacoustic wave generated in the tested object as a result. Here, the irradiator is removably fitted to the detector.
The probe structured as described above may further include: a slide mechanism which enables the sliding of the irradiator relative to the detector; and a lock which locks at the slide position up to which the sliding enabled by the slide mechanism is limited.
The probe structured as described above may further include: a fastening mechanism which fastens the irradiator to the detector. The fastening mechanism includes two first hooks so biased as to come close together by an elastic member and a second hook. Here, inserting the second hook between the first hooks causes the first hooks to come apart and lock the second hook. The fastening mechanism may further include an elevation and a depression which engage with each other when the second hook is locked by the first hooks.
The probe structured as described above may further include: releasable clamps which in a closed state hold the detector from opposite sides, and a lock which locks the releasable clamps in the closed state.
The probe structured as described above may further include: an attachment which is removably fitted to the detector. Here, the irradiator is removably fitted to the attachment.
The probe structured as described above may further include: a slide mechanism which enables the sliding of the irradiator relative to the attachment; and a lock which locks at the slide position up to which the sliding enabled by the slide mechanism is limited.
The probe structured as described above may further include: a fastening mechanism which fastens the irradiator to the detector. The fastening mechanism includes two first hooks so biased as to come close together by an elastic member and a second hook. Here, inserting the second hook between the first hooks causes the first hooks to come apart and lock the second hook. The fastening mechanism may further include an elevation and a depression which engage with each other when the second hook is locked by the first hooks.
In the probe structured as described above, the irradiator may include: a first cover having an inner surface that, when the irradiator is fitted on a tip end part of the detector, makes close contact with the tip end portion; and a second cover having a lock that, when the irradiator is fitted on the tip end part of the detector, locks on the tip end portion. Here, the light-emitting semiconductor element light source is arranged around the circumference of the first cover while being enclosed by the first and second covers.
In any of the probes structured as described above, a cable for supplying electric power from the main body of the optoacoustic imaging device to the light-emitting semiconductor element light source may be connected to the irradiator.
In any of the probes structured as described above, the detector may have a first connector, and the irradiator may have a second connector which, when the irradiator is fitted to the detector, couples with the first connector. Here, electric power is supplied via the first and second connector to the light-emitting semiconductor element light source.
In any of the probes structured as described above, the irradiator may include: a memory which stores identification information based on which the light-emitting semiconductor element light source can be identified; a fitting detector which detects that the irradiator is fitted to the detector, and a transmitter which transmits the identification information based on the result of detection by the fitting detector.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, a first embodiment of the present invention will be described. An explosive perspective view of a probe for an optoacoustic imaging device (hereinafter “optoacoustic probe”) according to the first embodiment is shown in
The optoacoustic probe 1 shown in
The irradiation units 12A and 12B are each provided with an upper light source cover 121, an LED light source 122, and a lower light source cover 123. The LED light source 122 is mounted on the lower light source cover 123, and for the sake of protection, the lower light source cover 123 is sealed by the upper light source cover 121. That is, the LED light source 122 is housed inside a cover composed of the upper light source cover 121 and the lower light source cover 123. Each structured as described above, the irradiation units 12A and 12B are arranged on the front and rear sides, respectively, of the ultrasonic wave probe 11 so as to hold the ultrasonic wave probe 11 from opposite sides, and are fastened to the ultrasonic wave probe 11. How the fastening is achieved will be described in detail later.
As shown in
A block configuration of an optoacoustic imaging device embodying the present invention, provided with the optoacoustic probe 1, is shown in
In
The ultrasonic wave probe 11 (
The ultrasonic oscillating elements are piezoelectric elements which, when a voltage is applied to them, oscillate and generate an ultrasonic wave and which, when vibration (ultrasonic wave) is applied to them, generates a voltage. Between the acoustoelectric converter 111 and the surface of the tested object 150, an adjustment layer (unillustrated) is provided to allow adjustment of a difference in acoustic impedance. The adjustment layer serves to propagate the ultrasonic wave generated by the ultrasonic oscillating elements efficiently into the tested object 150, and also serves to propagate the ultrasonic wave (including an optoacoustic wave) from inside the tested object 150 to the ultrasonic oscillating elements.
The light source drive circuit 102 is supplied with electric power from the drive power supply 101. The LED element 122A emits pulsating light by being driven with a drive signal fed from the light source drive circuit 102, and irradiates the tested object 150 with LED light. The drive signal is fed from the light source drive circuit 102 to the LED light source 122 across the power cable 20 (
The pulsating light emitted from the LED element 122A passes through the lower light source cover 123 (
The ultrasonic oscillating elements (acoustoelectric converter 111) also generate an ultrasonic wave to transmit it into the tested object 150, and receives the ultrasonic wave reflected inside the tested object 150 to generate a voltage signal. Thus, the optoacoustic imaging device 100 embodying the present invention can perform not only optoacoustic imaging but also ultrasonic imaging.
The image generator 30 includes a reception circuit 301, an A/D converter 302, a reception memory 303, a data processor 304, an optoacoustic image reconstructor 305, a discriminator/logarithmic converter 306, an optoacoustic image constructor 307, an ultrasonic image reconstructor 308, a discriminator/logarithmic converter 309, an ultrasonic image constructor 310, a image merger 311, a controller 312, and a transmission control circuit 313.
The reception circuit 301 selects, out of the plurality of ultrasonic oscillating elements, a part of them, and amplifies the voltage signal (detection signal) with respect to the selected ultrasonic oscillating elements.
In optoacoustic imaging, for example, the plurality of ultrasonic oscillating elements are divided into two regions adjoining in the left-right direction as seen from in front (in
The A/D converter 302 converts the amplified detection signal from the reception circuit 301 into a digital signal. The reception memory 303 stores the digital signal from the A/D converter 302. The data processor 304 serves to branch the signal stored in the reception memory 303 between the optoacoustic image reconstructor 305 and the ultrasonic image reconstructor 308.
The optoacoustic image reconstructor 305 performs phase matching addition based on the detection signal of an optoacoustic wave, and reconstructs the data of the optoacoustic wave. The discriminator/logarithmic converter 306 performs logarithmic compression and envelope discrimination on the data of the reconstructed optoacoustic wave. The optoacoustic image constructor 307 then converts the data that has undergone the processing by the discriminator/logarithmic converter 306 into pixel-by-pixel luminance value data. Specifically, optoacoustic image data (grayscale data) is generated as data comprising the luminance value at every pixel on the XZ plane in
On the other hand, the ultrasonic image reconstructor 308 performs phase matching addition based on the detection signal of an ultrasonic wave, and reconstructs the data of the ultrasonic wave. The discriminator/logarithmic converter 309 performs logarithmic compression and envelope discrimination based on the data of the reconstructed ultrasonic wave. The ultrasonic image constructor 310 then converts the data that has undergone the processing by the discriminator/logarithmic converter 309 into pixel-by-pixel luminance value data. Specifically, ultrasonic image data (grayscale data) is generated as data comprising the luminance value at every pixel on the XZ plane in
The image merger 311 merges the optoacoustic image data and the ultrasonic image data together to generate composite image data. The image merging here may be achieved by superimposing the optoacoustic image on the ultrasonic image, or by putting together the optoacoustic image and the ultrasonic imaging side by side (or one on top of the other). The image display 40 displays an image based on the composite image data generated by the image merger 311.
The image merger 311 may output the optoacoustic image data or the ultrasonic image data as it is to the image display 40.
The controller 312 feeds a light trigger signal to the light source drive circuit 102 to make it transmit a drive signal.
In response to an instruction from the controller 312, the transmission control circuit 313 transmits the drive signal to the acoustoelectric converter 111 to make it generate an ultrasonic wave. The controller 312 also controls the reception circuit 301, etc.
Here, the emission wavelength of the LED element 122A can be set at a wavelength in a near-infrared region, examples including 750 nm, 850 nm, 930 nm, and 1210 nm. For example, oxidized hemoglobin in blood exhibits a high absorptance for light of a wavelength of 750 nm, and reduced hemoglobin in blood exhibits a high absorptance for light of a wavelength of 850 nm. The wavelength of the LED element 122A may be the same between the irradiation units 12A and 12B, or may be different between them. For example, the irradiation unit 12A can be set at 750 nm, and the irradiation unit 12B at 850 nm.
The LED element 122A may comprise a combination of elements of a plurality of wavelengths. In that case, the light source drive circuit 102 transmits separate drive signals to LED elements of different wavelengths.
The LED light source 122 also has a memory 122B, a connection detector 122C, and a transmitter 122D mounted on the substrate, and these will be described later.
Next, how the irradiation units 12A and 12B are fitted to the ultrasonic wave probe 11 will be described with reference to
As shown in
The structure of the upper light source cover 121 will now be described in detail with reference to
The upper light source cover 121 has a base 1211 and a wall 1212 protruding from the base 1211. In opposite end parts of the base 1211 in its longitudinal direction, holes 1211A are formed respectively for fastening to the lower light source cover 123 (
As shown in
The fitting of the irradiation unit 12A (or 12B) having the upper light source cover 121 structured as described above to the ultrasonic wave probe 11 can be achieved as follows. The elevation 11A is engaged with the depression 1212A starting at a side end of the ultrasonic wave probe 11, and the upper light source cover 121 (irradiation unit) is slid along. Meanwhile, the leaf spring-shaped hook 1212C, in a state raised against a biasing force, slides across the surface of the ultrasonic wave probe 11.
The sliding proceeds until an end of the elevation 11A hits a wall W (
As described above, according to this embodiment, the irradiation units 12A and 12B can be fitted to and removed from the ultrasonic wave probe 11 easily. Thus, a plurality of irradiation units having different types of LED light sources 122 (of different wavelengths, etc.) can be fitted to and removed from, and can thus interchangeably used with, a single ultrasonic wave probe 11. This is advantageous in terms of cost, etc.
As mentioned previously, in this embodiment, the memory 122B is mounted on the substrate of the LED light source 122. This memory 122B stores information on the characteristics of the LED element 122A; it stores, for example, information such as wavelength or combination of wavelengths, temperature coefficient, serial number, sealing resin thickness, presence or absence of a reflective plate, light intensity, forward voltage, rated current value, etc.
The connection detector (fitting detector) 122C can be configured, for example, to include a switch that is turned on when the upper light source cover 121 is slid until the hook 1212C engages with the depression 11B in the ultrasonic wave probe 11 and thus the irradiation unit is fastened. By detecting that the switch is on, the connection detector 122C can detect that an irradiation unit is connected to the optoacoustic probe 1.
In response to the detection of connection by the connection detector 122C, the transmitter 122D transits the information stored in the memory 122B to the controller 312. The transmission here may be achieved on a wired or wireless basis. Transmission on a wired basis can be achieved, for example, across the power cable 20.
Based on the information on the LED element 122A transmitted from the transmitter 122D, the controller 312 can perform various kinds of control. As one example, based on information on the intensity of the light transmitted from each of the irradiation units 12A and 12B, the controller 312 can control the amplification factor at the reception circuit 301 so as to compensate for a difference in light intensity.
The first embodiment described above allows for various modifications, of which some examples will be described below, starting with a second embodiment of the present invention. A roughly exploded perspective view of an optoacoustic probe according to the second embodiment is shown in
The optoacoustic probe 2 shown in
Now, the structure of the upper light source cover 221 will be described in detail.
The removal of the ultrasonic wave probe 21 is achieved by pushing the hooks H1 and H2 away from each other with fingers or the like (at the front face shown in
This embodiment provides similar effects as the first embodiment.
Next, a third embodiment of the present invention will be described. An explosive perspective view of an optoacoustic probe according to the third embodiment is shown in
The optoacoustic probe 3 shown in
The front and rear faces of the ultrasonic wave probe 31 are each provided with bosses 31A for positioning. The upper light source cover 321 includes a base 321A and clamps 321B and 321C, the latter being connected to the former so as to be pivotable about hinges H5 and H6.
A top view of the upper light source cover 321 is shown in
Here, the fitting of the ultrasonic wave probe 31 to the irradiation unit 32 is achieved as follows. First, as shown in
Then, as shown in
The removal of the ultrasonic wave probe 11 is achieved as follows. The tip end part of the lock 321D is held and turned as a screw to loosen screw-fastening, and is then swung 90 degrees as seen in a top view. Now the clamps 321B and 321C can be swung open so that the ultrasonic wave probe 11 can be removed.
This embodiment provides similar effects as the first embodiment.
Next, a fourth embodiment of the present invention will be described. A perspective view of a part of an optoacoustic probe according to the fourth embodiment is shown in
This embodiment is a modified example of the third embodiment described previously, and differs from it in the lock mechanism of the clamps. In the optoacoustic probe 3′ shown in
In one end part of the clamp 321C′, a lever 321D′ is pivotably connected, and to this lever 321D′, a hook 321E′ is pivotably connected.
The ultrasonic wave probe 31′ is mounted on the base 321A′, and the clamps 321B′ and 321C′ are swung closed. This state is assumed to be as shown in a top view in
This embodiment provides similar effects as the first embodiment.
Next, a fifth embodiment of the present invention will be described. An exploded perspective view of an optoacoustic probe according to the fifth embodiment is shown in
The front and rear faces of the ultrasonic wave probe 41 are each provided with bosses 41A. The attachment 42 has a structure similar to a part of the upper light source cover 321 (
The fitting of the attachment 42 to the ultrasonic wave probe 41 is achieved as follows. The clamps 42A and 42B are swung open, and are then swung closed so as to hold the ultrasonic wave probe 41 from opposite sides so that the bosses 41A engage the holes 421. Then, the clamps 42A and 42B are locked together with the lock 42D, and thus the ultrasonic wave probe 41 is fastened.
The lock on the attachment may instead be like the one described in connection with the fourth embodiment.
Moreover, the irradiation units 43A and 43B composed of an upper light source cover 431, an LED light source 432, and a lower light source cover 433, all structured as in the first embodiment, can be fitted to and removed from the attachment 42.
The fastening of the irradiation unit 43A (or 43B) to the attachment 42 is achieved in a similar manner as in the first embodiment. Specifically, with an elevation 422 formed on the clamp 42A (or 42B) engaged with the depression 431A formed in the upper light source cover 431, and the upper light source cover 431 is slid along. Then, a hook 431B on the upper light source cover 431 is engaged with a hole 423 formed in the clamp 42A (or 42B).
This embodiment provides similar effects as the first embodiment.
Next, a sixth embodiment of the present invention will be described. A roughly exploded perspective view of an optoacoustic probe according to the sixth embodiment is shown in
The structure for fastening the attachment 42′ to the ultrasonic wave probe 41′ is similar to that in the fifth embodiment (hence, the fastening is achieved in a similar manner). The irradiation units 43A′ and 43B′ structured in a similar manner as in the second embodiment can be fitted to and removed from the attachment 42′.
The fastening of the irradiation unit 43A′ (or 43B′) to the attachment 42′ is achieved in a similar manner as in the second embodiment. Specifically, a hook 421′ on the attachment 42′ is inserted in a fitting hole (unillustrated) formed in the rear face of the upper light source cover 431. Then, hooks H9 and H10 are displaced away from each other against the biasing forces of springs to allow the hook 421′ to be locked by the hooks H9 and H10. Now, a boss 422′ on the attachment 42′ engages with a positioning hole 431A.
This embodiment provides similar effect as the first embodiment.
Next, a seventh embodiment of the present invention will be described. An exploded perspective view of an optoacoustic probe according to the seventh embodiment is shown in
A perspective view of the irradiation unit 52 as seen from behind is shown in
A side view of the irradiation unit 52 fitted on the tip end part of the ultrasonic wave probe 51 is shown in
The lower light source cover 52C has a sleeve 522 (
Also this embodiment allows easy fitting and removal of the irradiation unit 52 to and from the ultrasonic wave probe 51, and thus provides similar effects as the first embodiment.
As a modified example of the third embodiment, as shown in
The attachments described in connection with the fifth and sixth embodiments may likewise be provided with a puncture guide.
In the second embodiment (
As a modified example of this structure, as shown in
In that case, the electric power supplied from the main body (unillustrated) of the optoacoustic imaging device via the power cable (unillustrated) to the optoacoustic probe 2′ is supplied via the second connector (unillustrated) and the first connector 224′ to the LED light source.
In a case where the optoacoustic probe 2′ is of a wireless type, since the LED light source consumes low electric power and can be battery-operated, the second connector may instead be connected to a battery incorporated in the ultrasonic wave probe.
An outline of the structure of an optoacoustic probe according to a tenth embodiment of the present invention is shown in
The irradiation unit 62 includes, at opposite sides of a base 62A respectively, LED light sources 62B and light guide members 62C for guiding the light emitted from the LED light sources 62B.
The irradiation unit 62 is removably fitted on the ultrasonic wave probe 61 such that a tip end part of the ultrasonic wave probe 61 is held between the light guide members 62C from opposite sides.
Other conceivable modified examples are as follows. In the first and other embodiments, the front and rear faces of the ultrasonic wave probe 11 are each fitted with an irradiation unit; in addition, any side face may be removably fitted with another irradiation unit.
Another irradiation unit may additionally be removably fitted to any irradiation unit that is fitted to the ultrasonic wave probe. For example, in the first embodiment (
It should be understood that the embodiments by way of which the present invention is described herein allow for various modifications without departing from the spirit of the present invention.
For example, although in the embodiments described above the light source comprises an LED light source, it may instead comprise a semiconductor laser element, an organic light-emitting diode element, or the like.
Number | Date | Country | Kind |
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2014-175465 | Aug 2014 | JP | national |