Patent Grant
11867721
Embodiments of the present invention relate to electrical test probes (e.g., for wafer level testing of semiconductors, socket testing of integrated circuits, burn in testing, or testing of other electronic components and assemblies), more particularly embodiments are directed to probes using multiple springs in series with one or more intermediate movable stops that engage fixed stops that may or may not be part of the probes (e.g., they may be part of array structures). In some embodiments the multiple springs are provided as flat springs laid side-by-side with distinct guide paths, in some embodiments the probes are provided with only compression springs, only extension springs, or a combination of compression and extension springs. In some embodiments the springs are configured in relation to one another to provide a decrease in rate of longitudinal biasing (e.g., a decrease in effective spring constant) after an initial compression of the probe at a higher rate of longitudinal biasing. Other embodiments are directed to methods of using such probes alone or as part of multi-probe arrays while still other methods are directed to methods of making such probes and/or arrays of probes.
Probes:
Numerous electrical contact probe and pin configurations have been commercially used or proposed, some of which may qualify as prior art and others of which do not qualify as prior art. Examples of such pins, probes, and methods of making are set forth in the following patent applications, publications of applications, and patents. Each of these applications, publications, and patents is incorporated herein by reference as if set forth in full herein as are any teachings set forth in each of their prior priority applications.
Electrochemical Fabrication:
Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, and are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, California under the process names EFAB and MICA FREEFORM®.
Various electrochemical fabrication techniques were described in U.S. Pat. No. 6,027,630, issued on Feb. 22, 2000 to Adam Cohen.
A related method for forming microstructures using electrochemical fabrication techniques is taught in U.S. Pat. No. 5,190,637 to Henry Guckel, entitled “Formation of Microstructures by Multiple Level Deep X-ray Lithography with Sacrificial Metal Layers”.
Electrochemical Fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, Electrochemical Fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical Fabrication opens the spectrum for new designs and products in many industrial fields. Even though Electrochemical Fabrication offers this capability, and it is understood that Electrochemical Fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for Electrochemical Fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.
A need exists in various fields for miniature devices having improved characteristics, improved operational capabilities, reduced fabrication times, reduced fabrication costs, simplified fabrication processes, greater versatility in device design, improved selection of materials, improved material properties, more cost effective and less risky production of such devices, and/or more independence between geometric configuration and the selected fabrication process.
It is an object of some embodiments of the invention to provide improved probes allowing at least one increase in compliance (e.g., decrease in spring constant) as compression of the probe occurs across one or more force thresholds.
It is an object of some embodiments of the invention to provide improved probes allowing at least two stages of compliance wherein an increase in compliance (e.g., reduced spring constant) occurs as compression reaches a particular level.
It is an object of some embodiments of the invention to provide improved longitudinally compressible probes having at least two stages of different compliance wherein increased compliance (e.g., reduced spring constant) occurs in association with an increased compression of the probe when compressing the probe from at least one side.
It is an object of some embodiments of the invention to provide improved longitudinally compressible probes having at least three stages of different compliance wherein increased compliance (e.g., reduced spring constant) occurs in association with more compression of the probe when compressing the probe from at least one side.
It is an object of some embodiments of the invention to provide improved probes allowing at least one preloading stop, that is functionally operational between at least two spring elements that are connected in series, such that upon loading of one end of the probe against a contact surface of a DUT (or other electrical component) an increase in compliance occurs after an initial compression at a lower compliance (e.g. a decrease in effective spring constant occurs at at least one point of increasing compression of the probe from at least one side).
It is an object of some embodiments of the invention to provide improved probes with at least one flat spring that provides a force resisting compression of the probe while the at least one spring operates in tension.
It is an object of some embodiments of the invention to provide improved probes with at least two flat springs that provide a force resisting compression of the probe while at least one spring operates in tension and at least one spring operates in compression.
It is an object of some embodiments of the invention to provide improved probes that include a preloading stop that is functionally located between two springs that are connected in series where (1) the functional stop is physically located between the two springs, or (2) where the two springs are physically located on the same side of the functional stop.
It is an object of some embodiments to the invention to provide improved probes with springs that have no preloading (i.e., upon contact of probe tips to DUTS or to other electronic circuit elements, such that no initial biasing force exists) while in other embodiments preloading of one or more springs may be provided (such that one or more springs already has a biasing force prior to contacting probe tips to DUTS or to other electronic circuit elements).
It is an object of some embodiments to the invention to provide improved probes with springs that provide more than one compliance change during compression of probe elements (tips) against DUT contact pads or bumps (e.g., using a probe with three springs and two intermediate stops that allow for two changes in compliance), four springs with three intermediate stops that allow for three changes in compliance, or N springs with N-1 intermediate stops that allow for N-1 changes in compliance.
It is an object of some embodiments of the invention to provide improved methods of fabricating probes. Some such methods may include use of only (i.e., be limited to) multi-layer, multi-material electrochemical fabrication methods that fabricate the entire probes in a fully assembled state. Other methods may use only electrochemical fabrication methods to fabricate entire probes in assembled but not fully configured states wherein additional post-layer formation steps (e.g., post sacrificial material removal steps) are used to locate one or more probe tips, or probe retention structures, within or relative to probe bodies. Other methods may include post layer steps or operations that provide for conformable coating of specialized materials over entire probes or selected portions of probes (e.g., dielectrics for isolation of probes from one another, dielectrics for electrical isolation of a portion of one probe from another portion of the same probe, e.g., for coaxial configurations, contact materials, bonding materials, adhesion enhancement materials, barrier materials, and the like). Other methods may include formation of intentionally extended single layer contact surfaces that allow uninhibited movement of slidable probe components even in the presence of unintended layer features (e.g., layer-to-layer offsets or non-perpendicular intra-layer wall configurations). Still other methods may include setting probe orientation relative to layer planes and layer stacking directions to allow optimal creation of probe features, to minimize layer count required to form probes, to minimize probe foot print to maximum probe count that can be formed in a batch fabrication process on a build surface of specified area; and/or formation of features of opposed slidable, or otherwise movable, probe elements in build locations that allow minimum feature size gaps to exist which are larger than gaps desired when the probes are in operational configurations along with formation of spring loaded stops, snap-together features, or other structures that allow enforcement of working locations or working regions that are distinct from build locations.
It is an object of some embodiments of the invention to provide improved methods of fabricating probe arrays.
It is an object of some embodiments of the invention to provide improved methods of using probes and/or probe arrays or putting probes or probe arrays to use while minimizing risk of damaging DUTS during testing. In some such methods contact between probes and non-DUT electronic components (e.g. tester PCBs and the like) and contact between probes and DUTs are temporally separated to allow initial loading of selected spring elements (e.g. those that control contact with non-DUT circuitry) such that the preloading allows intermediate movable and fixed stop structures to contact one another to create transition configurations that allow compliance enhancements when other probe features contact DUTs such that compliance initially has a first value (e.g. a first spring constant) but after some compression of the probe the compliance changes to a second value that is larger than the first value (e.g. changes from a higher spring constant to a lower spring constant).
Other objects and advantages of various embodiments of the invention will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the invention, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, may address none of these objects but other objects ascertained from the teachings herein. It is not intended that all objects be addressed by any single aspect or embodiment of the invention.
In a first aspect of the invention, a probe for making electrical connections, including: (a) a first tip having a distal end and a proximal end, wherein the proximal end is for making an electrical connection to a first circuit element, wherein the electrical connection is selected from the group consisting of: (1) a spring-loaded temporary contact connection, (2) an adhered connection, (3) a bonded connection, and (4) an attached connection; (b) a first spring having a proximal end and a distal end with the proximal end connected directly or indirectly to the distal end of the first tip; (c) a first movable stop connected directly or indirectly at the distal end of the first spring; (d) a second spring element having a proximal end and a distal end with the proximal end connected directly or indirectly to the first movable stop, (e) a second tip having a proximal end and a distal end, wherein the distal end is for making an electrical connection to a second circuit element, wherein the electrical connection is selected from the group consisting of: (1) a spring-loaded temporary contact connection, (2) an adhered connection, (3) a bonded connection, and (4) an attached connection, and wherein the proximal end of the second tip is connected directly or indirectly to the distal end of the second spring element, wherein the first movable stop is capable of movement based on an interaction selected from the group consisting of: (A1) loading applied directly by the first spring to the first movable stop, (A2) loading applied indirectly by the first spring to the first movable stop, (A3) loading applied directly by the second spring to the first movable stop, (A4) loading applied indirectly by the second spring to the first movable stop, (A5) engagement of the first movable stop with a first fixed stop that is part of the probe, (A6) engagement of the first movable stop with a first fixed stop where the first fixed stop is not part of the probe but is part of an assembly into which the probe is mounted, (A7) at least two of interactions (A1)-(A6), (A8) at least three of interactions (A1)-(A6), (A8) at least four of interactions (A1)-(A6), and (A9) at least five of interactions (A1)-(A6).
Numerous variations of the first aspect of the invention are possible and include, for example: (1) the first fixed stop inhibiting motion of the first movable stop in a direction selected the group consisting of: (a) from the first tip to the second tip and (b) from the second tip to the first tip; (2) the probe being configured to operate under a condition selected from the group consisting of: (a) the first spring and the second spring operate under compression, (b) the first spring operates under compression and the second spring operates under tension, (c) the first spring operates under tension and the second spring operating under compression, and (d) the first spring and the second spring operate under tension; (3) the first spring including a plurality of springs, with the plurality of springs connected in a manner selected from the group consisting of: (a) in series, (b) in parallel, and (c) in a combination of series and parallel connections; (4) the second spring including a plurality of springs with the plurality of springs connected in a manner selected from the group consisting of: (a) in series, (b) in parallel, and (c) in a combination of series and parallel connections; (5) the force exerted by a selected spring segment being selected from the group consisting of: (a) a linear change in length in response to force loading, (b) a substantially linear change in length in response to changes in force loading (i.e. within 10% of linear over a working range), (c) a largely linear change in length in response to changes in force loading (i.e. within 25% of linear over a working range), and (d) a non-linear change in length in response to changes in force loading (i.e. more than 25% variation from linear over at least part of a working range); (6) a ratio of spring force to change in length between two springs being selected from the group consisting of: (a) Fx/Δx=Fy/Δy; (b) Fx/Δx≠Fy/Δy; (c) Fx/Δx=constant=Fy/Δy; (d) constant1=Fx/Δx≠Fy/Δy=constant2; and (e) constant≠Fx/Δx and Fy/Δy≠constant; (7) at least one spring having a shape selected from the group consisting of: (a) flat with a plurality of straight arms connected by non−90° angular contacts, (b) flat with a plurality of straight arms connected by substantially 90° angular contacts prior to deflection, (c) flat with a plurality of connected S shaped arms, (d) flat with a plurality of C-shaped arms joined to one another by linear arms that extend perpendicular to a longitudinal axis of the probe prior to deflection, (e) a plurality of curved arms connected to one to another; (f) flat with a substantially uniform thickness (within 10%) and width (within 10%); (g) a plurality of arms connected serially to one another; (h) a flat spring segment with a plurality of arms connected serially together connected at one end to a second flat spring segment with a plurality of arms connected serially together; (i) a circular cylindrical configuration, (j) a circular cylindrical configuration with an inward spiral, (k) a rectangular cylindrical configuration with an inward spiral on at least one end; (l) a rectangular cylindrical configuration with an inward spiral on at least one end; (m) a flat spring with a plurality of sinusoidal oscillations; (n) a plurality of straight beams connected in a saw tooth pattern; (o) a plurality of straight beams connected in a pattern by acute angles; and (o) a plurality of straight beams connected in a pattern by obtuse angles; (8) the probe having at least one compression spring segment including a flat spring including a plurality of undulations extending serially along at least a portion of its longitudinal axis and undulating back and forth along a single lateral axis where the undulations take a form selected from the group consisting of: (a) a rectangular wave, (b) a rectangular wave with curved corners, (c) a triangular wave, (d) a sine wave, (e) a plurality of S-shaped curves, (f) a plurality of C-shaped curves, (g) some other angled repetitive form, (h) some other curved repetitive form, (i) a form that has at least one decrease or increase in lateral amplitude, and (j) one of the above forms with the form offset from a central line of the probe, and wherein the probe further includes a stabilizing structure or structures selected from the group consisting of: (i) a plurality of tabs on the spring segment extending in a lateral direction perpendicular to the direction of undulation that engage at least an edge of a guide, (ii) a guide inhibiting excessive movement of the spring segment in a direction parallel to a normal of a plane of undulation, (iii) a guide inhibiting excessive movement of the spring segment in a direction perpendicular to both a normal of a plane of undulation and perpendicular to a longitudinal axis of the probe, and (iv) at least one slot, in which the spring segment compresses, that bounds the sides and at least the upper and lower edges of the undulations; (9) the probe additionally including at least one additional spring in series with the first and second springs and at least one additional movable stop functionally connected wherein the first movable stop being intermediate to two of the first, second and the at least one additional spring and the second movable stop between intermediate to a different two of the first, second, and the at least one additional spring; (10) the ninth variation with the first spring, the second spring, the at least one additional spring, the first movable stop, and the at least one additional stop being configured to preload a middle spring such that bidirectional compression of the first tip and the second tip can lead to decreases in spring constant upon sufficient compression of the first tip and the second tip; (11) the ninth variation with the first spring, the second spring, the at least one additional spring, the first movable stop, and the at least one additional stop being configured for preloading such that movement in one direction of one of the first tip and the second tip involves a first decrease in effective spring constant upon a first compression force or compression distance being reached and a second decrease in spring constant upon a second, larger, compression force or compression distance being reached; (12) at least one of the first or second electrical connections being a spring-loaded temporary contact connection; (13) at least one of the first or second electrical connections being an adhered connection; (14) at least one of the first or second electrical connections being a bonded connection; (15) at least one of the first or second electrical connections being an attached connection; (16) both of the first and second electrical connections being spring-loaded temporary contact connections; (17) both of the first and second electrical connections being spring-loaded temporary contact connections; (18) both of the first and second electrical connections being adhered connections; (19) both of the first and second electrical connections being bonded connections; and (20) both of the first and second electrical connections being attached connections.
In a second aspect of the invention, a probe for making electrical connections, including: (a) a first tip having a distal end and a proximal end, wherein the proximal end is for making an electrical connection to a first circuit element, wherein the electrical connection is selected from the group consisting of: (1) a spring-loaded temporary contact connection, (2) an adhered connection, (3) a bonded connection, and (4) an attached connection; (b) a first spring having a proximal end and a distal end with the proximal end connected directly or indirectly to the distal end of the first tip; (c) a first movable stop connected directly or indirectly at the distal end of the first spring; (d) a second spring element having a proximal end and a distal end with the proximal end connected directly or indirectly to the first movable stop; (e) a second movable stop connected directly or indirectly at the distal end of the second spring; (f) a third spring element having a proximal end and a distal end with the proximal end connected directly or indirectly to the second movable stop; (g) a second tip having a proximal end and a distal end, wherein the distal end is for making an electrical connection to a second circuit element, wherein the electrical connection is selected from the group consisting of: (1) a spring-loaded temporary contact connection, (2) an adhered connection, (3) a bonded connection, and (4) an attached connection, and wherein the proximal end of the second tip is connected directly or indirectly to the distal end of the third spring element, wherein the first movable stop is capable of movement based on an interaction selected from the group consisting of: (A1) loading applied directly by the first spring to the first movable stop, (A2) loading applied indirectly by the first spring to the first movable stop, (A3) loading applied directly by the second spring to the first movable stop, (A4) loading applied indirectly by the second spring to the first movable stop, (A5) engagement of the first movable stop with a first fixed stop that is part of the probe, (A6) engagement of the first movable stop with a first fixed stop where the first fixed stop is not part of the probe but is part of an assembly into which the probe is mounted, (A7) at least two of interactions (A1)-(A6), (A8) at least three of interactions (A1)-(A6), (A8) at least four of interactions (A1)-(A6), and (A9) at least five of interactions (A1)-(A6), wherein the second movable stop is capable of movement based on an interaction selected from the group consisting of: (B1) loading applied directly by the second spring to the second movable stop, (B2) loading applied indirectly by the second spring to the second movable stop, (B3) loading applied directly by the third spring to the second movable stop, (B4) loading applied indirectly by the third spring to the second movable stop, (B5) engagement of the second movable stop with a second fixed stop that is part of the probe, (B6) engagement of the second movable stop with a second fixed stop where the second fixed stop is not part of the probe but is part of an assembly into which the probe is mounted, (B7) at least two of interactions (B1)-(B6), (B8) at least three of interactions (B1)-(B6), (B8) at least four of interactions (B1)-(B6), and (B9) at least five of interactions (B1)-(B6).
Numerous variations of the second aspect of the invention are possible and include, for example: (1) a first fixed stop inhibiting motion of the first movable stop in a direction selected the group consisting of: (a) from the first tip to the second tip and (b) from the second tip to the first tip and wherein a second fixed stop inhibits motion of the second movable stop in a direction selected the group consisting of: (a) from the first tip to the second tip and (b) from the second tip to the first tip; (2) the probe being configured to operate under a condition selected from the group consisting of: (a) each of the springs operates under compression, (b) each spring operates under tension, (c) at least one of the springs operates under compression and at least one of the springs operates under tension, (d) at least two of the springs operate under tension and at least one spring operates under compression, (e) at least two of the springs operate under compression and at least one spring operates under tension; (3) the at least one of the springs including a plurality of springs, with the plurality of springs connected in a manner selected from the group consisting of: (a) in series, (b) in parallel, (c) in a combination of series and parallel connections; (4) at least two of the springs including a plurality of springs, with the plurality of springs connected in a manner selected from the group consisting of: (a) in series, (b) in parallel, (c) in a combination of series and parallel connections; (5) each of the first-third springs including a plurality of springs, with the plurality of springs connected in a manner selected from the group consisting of: (a) in series, (b) in parallel, (c) in a combination of series and parallel connections; (6) the force exerted by a selected spring segment being selected from the group consisting of: (a) a linear change in length in response to force loading, (b) a substantially linear change in length in response to changes in force loading (i.e. within 10% of linear over a working range), (c) a largely linear change in length in response to changes in force loading (i.e. within 25% of linear over a working range), (d) a non-linear change in length in response to changes in force loading (i.e. more than 25% variation from linear over at least part of a working range); (7) the sixth variation with the selected spring including at least two springs; (8) the seventh variation with the selected spring including each of the first, second, and third springs; (9) a ratio of spring force to change in length between two selected springs being selected from the group consisting of: (a) Fx/Δx=Fy/Δy, (b) Fx/Δx≠Fy/Δy, (c) Fx/Δx=constant=Fy/Δy, (d) constant1=Fx/Δx≠Fy/Δy=constant2, and (e) constant≠Fx/Δx and Fy/Δy t constant; (10) a ratio of spring force to change in length between the first, second, and third springs being selected from the group consisting of: (a) Fx/Δx=Fy/Δy=Fz/Δz, (b) Fx/Δx≠Fy/Δy=Fz/Δz, (c) Fx/Δx≠Fy/Δy #Fz/Δz, (d) Fx/Δx=Fy/Δy=Fz/Δz=constant, (e) constant1=Fx/Δx, Fy/Δy=constant2, Fz/Δz=constant3, and (f) constant≠Fx/Δx, Fy/Δy t constant, and Fz/Δz≠constant; (11) at least one spring having a shape selected from the group consisting of: (a) flat with a plurality of straight arms connected by non−90° angular contacts, (b) flat with a plurality of straight arms connected by substantially 90° angular contacts prior to deflection, (c) flat with a plurality of connected S shaped arms, (d) flat with a plurality of C-shaped arms joined to one another by linear arms that extend perpendicular to a longitudinal axis of the probe prior to deflection, (e) a plurality of curved arms connected to one to another; (f) flat with a substantially uniform thickness (within 10%) and width (within 10%); (g) a plurality of arms connected serially to one another; (h) a flat spring segment with a plurality of arms connected serially together connected at one end to a second flat spring segment with a plurality of arms connected serially together; (i) a circular cylindrical configuration, (j) a circular cylindrical configuration with an inward spiral, (k) a rectangular cylindrical configuration with an inward spiral on at least one end; (l) a rectangular cylindrical configuration with an inward spiral on at least one end; (m) a flat spring with a plurality of sinusoidal oscillations; (n) a plurality of straight beams connected in a saw tooth pattern; (o) a plurality of straight beams connected in a pattern by acute angles; and (p) a plurality of straight beams connected in a pattern by obtuse angles; (12) the eleventh variation with each of the springs having a shape selected from the group; (13) the twelfth variation with each of the spring having a shape selected from the same member of the group; (14) the probe having at least one compression spring segment including a flat spring including a plurality of undulations extending serially along at least a portion of its longitudinal axis and undulating back and forth along a single lateral axis where the undulations take a form selected from the group consisting of (a) a rectangular wave, (b) a rectangular wave with curved corners, (c) a triangular wave, (d) a sine wave, (e) a plurality of S-shaped curves, (f) a plurality of C-shaped curves, (g) some other angled repetitive form, (h) some other curved repetitive form, (i) a form that has at least one decrease or increase in lateral amplitude, and (j) one of the above forms with the form offset from a central line of the probe, and wherein the probe further includes a stabilizing structure or structures selected from the group consisting of (i) a plurality of tabs on the spring segment extending in a lateral direction perpendicular to the direction of undulation that engage at least an edge of a guide, (ii) a guide inhibiting excessive movement of the spring segment in a direction parallel to a normal of a plane of undulation, (iii) a guide inhibiting excessive movement of the spring segment in a direction perpendicular to both a normal of a plane of undulation and perpendicular a longitudinal axis of the probe, and (iv) at least one slot, in which the spring segment compresses, that bounds the sides and at least the upper and lower edges of the undulations; (15) the probe additionally including at least one additional spring in series with the first, second, and third springs and at least one additional movable stop functionally connected, wherein the first movable stop is intermediate to two of the first, second, third, and the at least one additional spring, the second movable stop is intermediate to a different two of the first, second, third and at least one additional spring, and the at least one additional movable stop is located intermediate to a different two of the first, second, third and at least one additional spring; (16) the fifteenth variation with the first spring, the second spring, the third spring, the at least one additional spring, the first movable stop, the second movable stop, and the at least one additional stop being configured to preload at least one intermediate spring such that bidirectional compression of the first tip and the second tip can lead to decreases in spring constant upon sufficient compression of the first tip and the second tip; (17) the fifteenth variation with the first spring, the second spring, the third spring, the at least one additional spring, the first movable stop, the second movable stop and the at least one additional stop being configured for preloading such that movement in one direction of one of the first tip and the second tip involves a first decrease in effective spring constant upon a first compression force or compression distance being reached and a second decrease in spring constant upon a second, larger, compression force or compression distance being reached and such that movement in the other direction of one of the first tip and the second tip involves a first decrease in effective spring constant upon a first compression force or compression distance being reached and a second decrease in spring constant upon a second, larger, compression force or compression distance being reached; (18) at least one of the first or second electrical connections being a spring-loaded temporary contact connection; (19) at least one of the first or second electrical connections being an adhered connection; (20) at least one of the first or second electrical connections being a bonded connection; (21) at least one of the first or second electrical connections being an attached connection; (22) both of the first and second electrical connections being spring-loaded temporary contact connections; (23) both of the first and second electrical connections being adhered connections; (24) both of the first and second electrical connections being bonded connections; (25) both of the first and second electrical connections being attached connections.
In a third aspect of the invention, a probe array for making electrical connections, including: (a) at least one first array frame structure; (b) at least one second array structure functioning in combination with the first array structure forming an assembly for holding the probes; (c) a plurality of probes with each inserted into an opening in the first array frame structure, wherein each of the plurality of probes includes a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2, wherein the first array structure, the at least one second array structure and the probes are configured to provide the probes in a lateral distribution pattern for making electrical connections to the first and second circuit elements.
In a fourth aspect of the invention, a probe array for making electrical connections, including: (a) at least one first array frame structure; (b) a plurality of probes with each inserted into an opening in the first array frame structure, wherein each of the plurality of probes includes a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2, wherein the first array structure and the probes are configured to provide the probes in a lateral distribution pattern for making electrical connections to the first and second circuit elements.
In a fifth aspect of the invention, a probe array making electrical connections, including: (a) at least one first array frame structure; (b) a plurality of first probes and second probes with each probe of the plurality of first probes connected directly or indirectly to a single side of the first array frame structure and the plurality of the second probes connected directly or indirectly to a second side of the first array frame, where the first and second sides are different, and wherein each of the probes includes a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2, wherein the first array structure and the probes are configured to provide the probes in a lateral distribution pattern for making electrical connections to the first and second circuit elements.
In a sixth aspect of the invention, a method for using a probe, including: (a) providing a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2; (b) pressing the first tip against the contact location on the first circuit element and relatively moving the first probe tip to a location in closer proximity to the second tip so as to locate the movable stop against a fixed stop and biasing the first spring with a first force; (c) pressing the second tip against the contact location on the second circuit element, which is different from the first circuit element, and relatively moving the second probe tip to a location in closer proximity to the first tip so as to bias the second spring under a biasing force that exceeds the first force such that prior to the biasing force exceeding the first force the rate of change of biasing force with distance in moving the second tip has a first value and after exceeding the first force the rate of change of biasing force with distance in moving the second tip has a second value that is less than the first value; (d) providing at least one electrical quantity between the first and second circuit elements via the probe wherein the at least one quantity is selected from the group consisting of: (1) electrical power, (2) an incoming digital electrical signal, (3) an outgoing digital electrical signal, (4) an incoming analog electrical signal, (5) an outgoing analog electrical signal, (6) an electrical current, and (7) an electrical potential.
In a seventh aspect of the invention, a method for using a probe, including: (a) providing a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2; (b) preloading the second spring between a first fixed stop and a second stop with a first biasing force; (c) pressing the first tip against the contact location on the first circuit element and relatively moving the first probe tip to a location in closer proximity to the second fixed stop so as to bias the second spring under a biasing force that exceeds the first force such that prior to the biasing force exceeding the first force, the rate of change of biasing force with distance in moving the first tip has a first value and after exceeding the first force, the rate of change of biasing force with distance in moving the first tip has a second value that is less than the first value; and (d) providing at least one electrical quantity between the first circuit element and a second circuit element via the probe wherein the at least one quantity is selected from the group consisting of: (1) electrical power, (2) an incoming digital electrical signal, (3) an outgoing digital electrical signal, (4) an incoming analog electrical signal, (5) an outgoing analog electrical signal, (6) an electrical current, and (7) an electrical potential.
In an eighth aspect of the invention, a method of using a probe, including: (a) providing a probe of aspect 2; (b) compressing the first and second probe tips toward one another according to a configuration and set of steps selected from the group consisting of: (i) Set 1—Configuration Steps (e.g., both fixed stops face up): (1) a first fixed stop is positioned in a region between the first movable stop and the second tip and provides a limit to the longitudinal movement of the first movable stop toward the second fixed stop, (2) a second fixed stop is positioned in a region between the second movable stop and the second tip and limits motion of the second movable stop away from the first fixed stop, (3) pressing the first tip against a contact location on the first circuit element and relatively moving the first probe tip to a location in closer proximity to the second tip so as to locate the second movable stop against the second fixed stop at a first biasing force (e.g. compressive or tensive) and then upon continued movement of the first tip bringing the first movable stop against the first fixed stop at a second biasing force (e.g. compressive or tensive) and then upon further first tip movement increasing the biasing force (e.g. compressive or tensive) on the first spring to a third biasing force; (4) pressing the second tip against a contact location on the second circuit element, which is different from the first circuit element and relatively moving the second probe tip to a location in closer proximity to the first tip so as to initially cause biasing (e.g. compressive or tensive) of the third spring but not further biasing of the second spring until a force (e.g. compressive or tensive) equal to the second biasing force is obtained and then continuing to move the second tip closer to the first tip under a reduced rate of change of force (e.g. spring constant due to the movement of the third spring and the second springs) until a force (e.g. compressive or tensive) equal to the third biasing force is obtained and then continuing to move the second tip closer to the first tip under a further reduced rate of change (e.g. further reduced effective spring constant due to continued movement of the third, second, and first springs); (ii) Set 2—Configuration and Steps (e.g., both fixed stops face inward): (1) a first fixed stop is positioned in a region between the first movable stop and the first tip and provides a limit to the longitudinal movement of the first movable stop away from the second fixed stop, (2) a second fixed stop is positioned in a region between the second movable stop and the second tip and limits motion of the second movable stop away from the first fixed stop, (3) the first and second stops are further positioned as necessary and the second spring is provided with a preloaded biasing force (e.g. a compressive or tensive biasing force created prior to contacting the first and second tips to the first and second circuit elements) equal to a first force which presses the first movable stop against the first fixed stop and presses the second movable stop against the second fixed stop; (4) pressing the first tip against a contact location on the first circuit element, and relatively moving the first probe tip to a location in closer proximity to the second tip so as to initially cause biasing (e.g. compressive or tensive) of the first spring but not further biasing of the second spring until a force (e.g. compressive or tensive) equal to the first biasing force is obtained and then continuing to move the first tip closer to the second tip under a reduced rate of change of force (e.g. effective spring constant due to the movement of the first spring and the second spring) until a second biasing force (e.g. compressive or tensive) is obtained; (5) pressing the second tip against a contact location on the second circuit element, which is different from the first circuit element and relatively moving the second probe tip to a location in closer proximity to the first tip so as to initially cause biasing (e.g. compressive or tensive) of the third spring but not further biasing of the second spring until a force (e.g. compressive or tensive) equal to the second biasing force is obtained and then continuing to move the second tip closer to the first tip under a reduced rate of change of force (e.g. effective spring constant due to the movement of the third spring and the second springs) until a force (e.g. compressive or tensive) equal to a third biasing force is obtained; (iii) Set 3: Configuration and Steps (both stops face outward): (1) a first fixed stop is positioned in a region between the first movable stop and the second movable stop and provides a limit to the longitudinal movement of the first movable stop toward the second fixed stop, (2) a second fixed stop is positioned in a region between the second movable stop and the first fixed stop and limits motion of the second movable stop toward the first fixed stop, (3) the first and second stops are further positioned as necessary relative to one another and the second spring is provided with a preloaded biasing force (e.g., a compressive or tensive biasing force created prior to contacting the first and second tips to the first and second circuit elements) equal to a first force which presses the first movable stop against the first fixed stop and presses the second movable stop against the second fixed stop; (4) pressing the first tip against a contact location on the first circuit element, and relatively moving the first probe tip to a location in closer proximity to the second tip so as to initially cause biasing (e.g. compressive or tensive) of the first spring but not further biasing of the second spring until a force (e.g. compressive or tensive) equal to the first biasing force is obtained and then continuing to move the first tip closer to the second tip under a reduced rate of change of force (e.g. effective spring constant due to the movement of the first spring and the second spring) until a second biasing force (e.g. compressive or tensive) is obtained; (5) pressing the second tip against a contact location on the second circuit element, which is different from the first circuit element and relatively moving the second probe tip to a location in closer proximity to the first tip so as to initially cause biasing (e.g. compressive or tensive) of the third spring but not further biasing of the second spring until a force (e.g. compressive or tensive) equal to the second biasing force is obtained and then continuing to move the second tip closer to the first tip under a reduced rate of change of force (e.g. effective spring constant due to the movement of the third spring and the second springs) until a force (e.g. compressive or tensive) equal to a third biasing force is obtained.
In a ninth aspect of the invention, a method for using a probe array for making electrical connections, including: (a) providing a probe array, selected from the group consisting of: (1) the array of aspect 3; and (2) the array of aspect 4; (b) pressing the first tips of the plurality of probes against respective contact locations on the first circuit element and relatively moving the first probe tips to a location in closer proximity to their respective second tips so as to locate their respective movable stops against respective fixed stops and biasing the first springs with respective first forces; (c) pressing the second tips against respective contact locations on the second circuit element, which is different from the first circuit element, and relatively moving the second probe tips to locations in closer proximity to the first tips so as to bias the second springs under biasing forces that exceed the first respective forces such that prior to the biasing forces exceeding the first forces, the rate of change of biasing forces with distance in moving the second tips have first values and after exceeding the first forces, the rate of change of biasing forces with distance in moving the second tips have second values that are less than the first values; (d) providing at least one electrical quantity between the first and second circuit elements via the plurality of probes wherein the at least one quantity is selected from the group consisting of: (1) electrical power, (2) an incoming digital electrical signal, (3) an outgoing digital electrical signal, (4) an incoming analog electrical signal, (5) an outgoing analog electrical signal, (6) an electrical current, and (7) an electrical potential.
In a tenth aspect of the invention, a method of using a probe array, including: (a) providing a probe array, including the features of Aspect 5; (b) compressing the first and second probe tips toward one another according to a configuration and set of steps selected from the group consisting of: (i) Set 1 (both fixed stops face up): (1) first fixed stops are positioned in regions between the first movable stops and the second tips and provide limits to the longitudinal movements of the first movable stops toward the second fixed stops, (2) second fixed stops are positioned in region between the second movable stops and the second tips and limit motions of the second movable stops away from the first fixed stops, (3) pressing the first tips against contact locations on the first circuit elements and relatively moving the first probe tips to locations in closer proximity to the second tips so as to locate the second movable stops against the second fixed stops at first biasing forces (e.g. compressive or tensive) and then upon continued movement of the first tips, bringing the first movable stops against the first fixed stops at second biasing forces (e.g. compressive or tensive) and then upon further first tip movements, increasing the biasing forces (e.g. compressive or tensive) on the first springs to third biasing forces; (4) pressing the second tips against contact locations on the second circuit elements, which are different from the first circuit elements and relatively moving the second probe tips to locations in closer proximity to the first tips so as to initially cause biasing (e.g. compressive or tensive) of the third springs but not further biasing of the second springs until forces (compressive or tensive) equal to the second biasing forces have been obtained and then continuing to move the second tips closer to the first tips under reduced rates of change of force (e.g. spring constant due to the movement of the third springs and the second springs) until forces (e.g. compressive or tensive) equal to the third biasing forces are obtained and then continuing to move the second tips closer to the first tips under further reduced rates of change (e.g. further reduced effective spring constants due to continued movements of the third, second, and first springs); (ii) Set 2 (both fixed stops face inward): (1) the first fixed stops are positioned in regions between the first movable stops and the first tips and provide limits to the longitudinal movement of the first movable stops away from the second fixed stops, (2) the second fixed stops are positioned in regions between the second movable stops and the second tips and limit motions of the second movable stops away from the first fixed stops, (3) the first and second stops are further positioned as necessary and the second springs are provided with preloaded biasing forces (e.g. compressive or tensive biasing forces created prior to contacting the first and second tips to the first and second circuit elements) equal to first forces which press the first movable stops against the first fixed stops and press the second movable stops against the second fixed stops; (4) pressing the first tips against contact locations on the first circuit elements, and relatively moving the first probe tips to locations in closer proximity to the second tips so as to initially cause biasing (e.g. compressive or tensive) of the first springs but not further biasing of the second springs until forces (e.g. compressive or tensive) equal to the first biasing forces are obtained and then continuing to move the first tips closer to the second tips under reduced rates of change of force (e.g. reduced effective spring constants due to the movements of the first springs and the second springs) until second biasing forces (e.g. compressive or tensive) are obtained; (5) pressing the second tips against contact locations on the second circuit elements, which are different from the first circuit elements and relatively moving the second probe tips to locations in closer proximity to the first tips so as to initially cause biasing (e.g. compressive or tensive) of the third springs but not further biasing of the second springs until forces (e.g. compressive or tensive) equal to the second biasing forces are obtained and then continuing to move the second tips closer to the first tips under reduced rates of change of force (e.g. reduced effective spring constants due to the movements of the third springs and the second springs) until forces (e.g. compressive or tensive) equal to third biasing forces are obtained; (iii) Set 3 (both stops face outward): (1) the first fixed stops are positioned in regions between the first movable stops and the second movable stops and provide limits to the longitudinal movements of the first movable stops toward the second fixed stops, (2) the second fixed stops are positioned in regions between the second movable stops and the first fixed stops and limit motions of the second movable stops toward the first fixed stops, (3) the first and second stops are further positioned as necessary relative to one another and the second springs are provided with preloaded biasing forces (e.g. a compressive or tensive biasing forces created prior to contacting the first and second tips to the first and second circuit elements) equal to first forces which press the first movable stops against the first fixed stops and press the second movable stops against the second fixed stops; (4) pressing the first tips against contact locations on the first circuit elements, and relatively moving the first probe tips to locations in closer proximity to the second tips so as to initially cause biasing (e.g. compressive or tensive) of the first springs but not further biasing of the second springs until forces (e.g. compressive or tensive) equal to the first biasing forces are obtained and then continuing to move the first tips closer to the second tips under reduced rates of change of force (e.g. reduced effective spring constants due to the movement of the first springs and the second springs) until second biasing forces (e.g. compressive or tensive) are obtained; (5) pressing the second tips against contact locations on the second circuit elements, which is different from the first circuit elements and relatively moving the second probe tips to locations in closer proximity to the first tips so as to initially cause biasing (e.g. compressive or tensive) of the third springs but not further biasing of the second springs until forces (e.g. compressive or tensive) equal to the second biasing forces are obtained and then continuing to move the second tips closer to the first tips under reduced rates of change of force (e.g. reduced effective spring constants due to the movement of the third springs and the second springs) until forces (e.g. compressive or tensive) equal to third biasing forces are obtained; and (c) providing at least one electrical quantity between the first and second circuit elements via the plurality of probes wherein the at least one quantity is selected from the group consisting of: (1) electrical power, (2) an incoming digital electrical signal, (3) an outgoing digital electrical signal, (4) an incoming analog electrical signal, (5) an outgoing analog electrical signal, (6) an electrical current, and (7) an electrical potential.
In an eleventh aspect of the invention, a batch method of forming a plurality of multi-layer three-dimensional structures, including: (A) forming a plurality of successive multi-material layers with each successive multi-material layer adhered to a previously formed multi-material layer and with each successive multi-material layer including at least two materials, at least one of which is at least one structural material and at least one other of which is at least one sacrificial material, and wherein each successive multi-material layer defines a successive cross-section of the plurality of three-dimensional structures, and wherein the forming of each of the plurality of successive multi-material layers includes: (i) depositing at least a first of the at least two materials; (ii) depositing a second of the at least two materials; (iii) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; and (B) after the forming of the plurality of successive multi-material layers, removing at least a portion of the at least one sacrificial material from the at least one structural material to reveal the plurality of three-dimensional structures formed from the at least one structural material; wherein the plurality of structures includes a plurality of probes selected from the group consisting of: (1) aspect 1 and (2) aspect 2.
Numerous variations of the eleventh aspect of the invention are possible and include, for example: (1) each probe having a longitudinal axis extending from the first tip to the second tip and first and second substantially perpendicular (e.g. within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) lateral axes that are also substantially perpendicular (e.g. within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) to the longitudinal axes, wherein at least a portion of at least one of the first and second springs of the plurality of probes have configurations selected from the group consisting of: (a) a flat configuration that extends perpendicular to a first lateral axis and has a plurality of undulations extending in a plane parallel to the second lateral axis and the longitudinal axis, wherein the longitudinal axis and the second lateral axis are perpendicular to an axis of layer stacking; (b) a flat configuration that extends perpendicular to a first lateral axis and has a plurality of undulations extending in a plane that is substantially parallel (e.g. within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) to the second lateral axis and the longitudinal axis, wherein the longitudinal axis is substantially parallel to a layer stacking axis; (c) spiral configuration having an axis that is substantially parallel to the longitudinal axis that extends in a direction substantially parallel to an axis of layer stacking; (d) spiral configuration having an axis that is substantially parallel to the longitudinal axis that extends in a direction substantially perpendicular to an axis of layer stacking; (2) the probe further including at least one sheath that extends over at least a portion of at least one of the first and second springs, wherein prior to the removing, the probe has a configuration selected from the group consisting of: (a) at least one of the first and second tips extends from the sheath by an excessive amount compared to an operational tip-to sheath range wherein the at least one tip is moved to within the operational range in a post-removing step; (b) both of the first and second tips extend from the sheath by an excessive amount compared to an operational tip-to sheath range wherein both tips are moved to within the operational range in a post-removing step; (c) at least one of the first and second tips extends from the sheath by an amount within an operational tip-to sheath range; (d) both of the first and second tips extend from the sheath by an amount within an operational tip-to sheath range; (e) the movable stop is not located within a working range of a fixed stop and is moved to within the working range of the fixed stop in a post removal step; and (f) the movable stop is located within a working range of a fixed stop; and (3) the plurality of probes being of aspect 2, and the probe having a configuration selected from the group consisting of: (a) the second movable stop is not located within a working range of a second fixed stop and is moved to within the working range of the second fixed stop in a post removal step; and (b) the second movable stop is located within a working range of a second fixed stop.
In a twelfth aspect of the invention, a method of forming a probe array, including: (A) forming a plurality of multi-layer probes, including: (i) forming a plurality of successive multi-material layers with each successive multi-material layer adhered to a previously formed multi-material layer and with each successive multi-material layer including at least two materials, at least one of which is at least one structural material and at least one other of which is at least one sacrificial material, and wherein each successive multi-material layer defines a successive cross-section of the plurality of three-dimensional structures, and wherein the forming of each of the plurality of successive multi-material layers includes: (a) depositing at least a first of the at least two materials; (b) depositing a second of the at least two materials; (c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; and (ii) after the forming of the plurality of successive multi-material layers, removing at least a portion of the at least one sacrificial material from the at least one structural material to reveal the plurality of three-dimensional structures formed from the at least one structural material; wherein the plurality of structures includes a plurality of probes, wherein each of the plurality of probes includes a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2; (B) providing at least one first array frame structure; (C) providing at least one second array structure; (D) inserting the probes into openings in a structure selected from the group consisting of: (1) the at least one first array structure and thereafter joining the combined first array structure and plurality of probes with the at least one second array structure, (2) the at least one second array structure and thereafter joining the combined second array structure and plurality of probes with the at least one first array structure; and (3) a combination of the at least one first array structure and the at least one second array structure; and (E) preloading the probes with first biasing forces; wherein the at least one first array structure, the at least one second array structure, and the plurality of probes are configured to provide the probes in a lateral distribution pattern for connecting first circuit elements to second circuit elements.
Numerous variations of the twelfth aspect of the invention are possible and include, for example: (1) each probe having a longitudinal axis extending from the first tip to the second tip and first and second substantially perpendicular (e.g., within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) lateral axes that are also substantially perpendicular (e.g. within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) to the longitudinal axes, wherein at least a portion of at least one of the first and second springs of the plurality of probes have configurations selected from the group consisting of: (a) a flat configuration that extends perpendicular to a first lateral axis and has a plurality of undulations extending in a plane parallel to the second lateral axis and the longitudinal axis, wherein the longitudinal axis and the second lateral axis are perpendicular to an axis of layer stacking; (b) a flat configuration that extends perpendicular to a first lateral axis and has a plurality of undulations extending in a plane that is substantially parallel (e.g. within an angle selected from the group consisting of 2°, 4°, 6°, 8°, and 10°) to the second lateral axis and the longitudinal axis, wherein the longitudinal axis is substantially parallel to a layer stacking axis; (c) spiral configuration having an axis that is substantially parallel to the longitudinal axis that extends in a direction substantially parallel to an axis of layer stacking; (d) spiral configuration having an axis that is substantially parallel to the longitudinal axis that extends in a direction substantially perpendicular to an axis of layer stacking; (2) the probes including probes of Aspect 1, and wherein the probes further include at least one sheath that extends over at least a portion of at least one of the first and second springs of each probe, wherein prior to the removing, the probe has a configuration selected from the group consisting of: (a) at least one of the first and second tips extends from the sheath by an excessive amount compared to an operational tip-to sheath range wherein the at least one tip is moved to within the operational range in a post-removing step; (b) both of the first and second tips extend from the sheath by an excessive amount compared to an operational tip-to-sheath range wherein both tips are moved to within the operational range in a post-removing step; (c) at least one of the first and second tips extends from the sheath by an amount within an operational tip-to sheath range; (d) both of the first and second tips extend from the sheath by an amount within an operational tip-to sheath range; (e) the movable stop is not located within a working range of a fixed stop and is moved to within the working range of the fixed stop in a post removal step; and (f) the movable stop is located within a working range of a fixed stop; (3) prior to assembly of the plurality of probes with the at least one first array structure and the at least one second array structure, transitioning the probes from a build configuration to at least one of an assembly configuration and a working configuration; (4) during assembly of the plurality of probes into the at least one first array structure and the at least one second array structure, transitioning the probes to a working configuration; and (5) probes of Aspect 2 wherein the probe further includes at least one sheath that extends over at least a portion of at least one of the first, second, and third springs, wherein prior to the removing, the probe has a configuration selected from the group consisting of: (a) at least one of the first and second tips extends from the sheath by an excessive amount compared to an operational tip-to sheath range wherein the at least one tip is moved to within the operational range in a post-removing step; (b) both of the first and second tips extend from the sheath by an excessive amount compared to an operational tip-to-sheath range wherein both tips are moved to within the operational range in a post-removing step; (c) at least one of the first and second tips extends from the sheath by an amount within an operational tip-to-sheath range; (d) both of the first and second tips extend from the sheath by an amount within an operational tip-to-sheath range; (e) the first movable stop is not located within a working range of a first fixed stop and is moved to within the working range of the first fixed stop in a post removal step; and (f) the first moving stop is located within a working range of a first fixed stop; (g) the second movable stop is not located within a working range of a second fixed stop and is moved to within the working range of the second fixed stop in a post removal step; and (h) the second movable stop is located within a working range of a second fixed stop.
In a thirteenth aspect of the invention, a method of forming a probe array, including: (A) forming a plurality of multi-layer probes, including: (i) forming a plurality of successive multi-material layers with each successive multi-material layer adhered to a previously formed multi-material layer and with each successive multi-material layer including at least two materials, at least one of which is at least one structural material and at least one other of which is at least one sacrificial material, and wherein each successive multi-material layer defines a successive cross-section of the plurality of three-dimensional structures, and wherein the forming of each of the plurality of successive multi-material layers includes: (a) depositing at least a first of the at least two materials; (b) depositing a second of the at least two materials; (c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; and (ii) after the forming of the plurality of successive multi-material layers, removing at least a portion of the at least one sacrificial material from the at least one structural material to reveal the plurality of three-dimensional structures formed from the at least one structural material; wherein the plurality of structures includes a plurality of probes, wherein each of the plurality of probes includes a probe selected from the group consisting of: (1) the probe of aspect 1, and (2) the probe of aspect 2; (B) providing at least one first array frame structure; (C) combining the probes directly or indirectly to the at least one first array structure; (D) preloading the probes with first biasing forces; wherein the at least one first array structure and the plurality of probes are configured to provide the probes in a lateral distribution pattern for connecting first circuit elements to second circuit elements.
In a fourteenth aspect of the invention, a method of forming a probe array, including: (A) forming a plurality of multi-layer probes, including: (i) forming a plurality of successive multi-material layers with each successive multi-material layer adhered to a previously formed multi-material layer and with each successive multi-material layer including at least two materials, at least one of which is at least one structural material and at least one other of which is at least one sacrificial material, and wherein each successive multi-material layer defines a successive cross-section of the plurality of three-dimensional structures, and wherein the forming of each of the plurality of successive multi-material layers includes: (a) depositing at least a first of the at least two materials; (b) depositing a second of the at least two materials; (c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; and (ii) after the forming of the plurality of successive multi-material layers, removing at least a portion of the at least one sacrificial material from the at least one structural material to reveal the plurality of three-dimensional structures formed from the at least one structural material; wherein the plurality of structures includes a plurality of probes, wherein each of the plurality of probes includes a probe selected from the group consisting of: (1) the probe of Aspect 1, and (2) the probe of Aspect 2; (B) providing at least one first array frame structure; (C) connecting a plurality of first probes directly or indirectly to a single side of the first array frame structure and then connecting a plurality of second probes directly or indirectly to a second side of the first array frame, where the first and second sides are different, wherein the at least one first array structure and the plurality of first and second probes are configured to provide the probes in a lateral distribution pattern for connecting first circuit elements to second circuit elements.
Numerous variations of the first to fourteenth aspects of the invention are possible some of which have been presented above with regard to selected aspects. Many of these previously presented variations may be applied to the other aspects presented above with appropriate changes made.
Other aspects of the invention will be understood by those of skill in the art upon review of the teachings herein. Other aspects of the invention may involve combinations or sub combinations of the above noted aspects of the invention. These other aspects of the invention may provide various combinations of the aspects presented above as well as provide other configurations, structures, functional relationships, and fabrication processes, methods of use, or the like that have not been specifically set forth above but are taught by other teachings set forth herein, combinations of teachings set forth herein or by the teachings set forth herein as a whole (including teachings incorporated herein by reference.
Electrochemical Fabrication in General
In some variations, the structure may be separated from the substrate. For example, release of the structure (or multiple structures if formed in a batch process) from the substrate may occur when releasing the structure from the sacrificial material particularly when a layer of sacrificial material is positioned between the first layer of the structure and the substrate. Alternative methods may involve, for example, the use of a dissolvable substrate that may be separated before, during or after removal of the sacrificial material, machining off the substrate before or after removal of the sacrificial material, or use of a different intermediate material that can be dissolved, melted or otherwise used to separate the structure(s) from the substrate before, during, or after removal of the sacrificial material that surround the structure(s).
Various embodiments of various aspects of the invention are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in
The various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e. masks and operations based on masks whose contact surfaces are not significantly conformable), adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it), and/or selective patterned deposition of materials (e.g. via extrusion, jetting, or controlled electrodeposition) as opposed to masked patterned deposition. Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e. the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e. the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse. Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material. In some embodiments, adhered mask material may be used as a sacrificial for the layer or may be used only as a masking material which is replaced by another material (e.g., dielectric or conductive material prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer. Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.
Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material. Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material. In some embodiments, the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom boundary levels that define a different layer's geometric configuration). Such use of selective etching and/or interlaced material deposition in association with multiple layers is described in U.S. patent application Ser. No. 10/434,519, by Smalley, filed May 7, 2003, which is now U.S. Pat. No. 7,252,861, and which is entitled “Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids”. This referenced application is incorporated herein by reference.
Temporary substrates on which structures may be formed may be of the sacrificial-type (i.e. destroyed or damaged during separation of deposited materials to the extent they cannot be reused) or non-sacrificial-type (i.e. not destroyed or excessively damaged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed). Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., by replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.
Definitions of various terms and concepts that may be used in understanding the embodiments of the invention (either for the devices themselves, certain methods for making the devices, or certain methods for using the devices) will be understood by those of skill in the art. Some such terms and concepts are discussed herein while other such terms are addressed in the various patent applications to which the present application claims priority and/or which are incorporated herein by reference (e.g., U.S. patent application Ser. No. 16/584,818).
Probes of the various embodiments of the invention can take on a variety of forms. Each probe includes multiple spring elements with at least two springs configured to operate functionally in series with a movable intermediate stop located functionally between the at least two springs where the movable stop can directly or indirectly engage a fixed stop (which may or may not be part of an individual probe) to hinder further motion in a one direction while still allowing motion in the opposite direction under appropriate application of force to one or both of the springs. In usage the springs, the at least one movable stop, and at least one fixed stop can be used to change the compliance on at least one probe tip from a lower value to a higher value upon increased force and movement of the tip so that a given compression of the spring system causes a smaller increase in force per unit of movement of the tip relative to what occurred upon initial displacement of the probe tip. In some embodiments, probe deformation is limited to a compression along the axis of the probe (e.g., substantially longitudinal compression as the tips move to more proximal positions).
Numerous variations of the probe embodiments are possible, including for example: (1) use, or inclusion, of only compression springs or spring segments; (2) use, or inclusion, of only extension springs or spring segments; (3) use, or inclusion, of a combination of compression springs and extension springs; (4) use, or inclusion, of a single spring on either side of a movable stop; (5) use, or inclusion, of multi-segment springs as a single effective spring on either side of a movable stop; (6) use, or inclusion, of multi-segment springs including springs in series with interconnecting bars, plates, or the like as necessary; (7) use, or inclusion, of multi-segment springs including springs in parallel with interconnecting bars, plates, or the like as necessary; (8) use, or inclusion, of multi-segment springs grouped in a combination of parallel and series connections with interconnecting bars, plates, or the like as necessary; (9) use, or inclusion, of individual springs having substantially linear behavior (e.g. F=K*Δx) or having non-linear behaviors; (10) use, or inclusion, of individual springs having common or different spring constants; (11) use, or inclusion, of springs or spring segments that are flat; (12) use, or inclusion, of springs that lay in the same plane one beside the other; (13) use, or inclusion, of springs or spring segments that lay in different parallel but offset planes (e.g. each formed within a single layer or from a series of adjacent layers) with connection elements extending from one spring segment to another through one or more intermediate layers; (14) use, or inclusion, of individual probes that include a fixed stop, or more than one fixed stop, which interact with one or more movable stops; (15) use, or inclusion, of individual probes that are configured to interact with a fixed stop that is part of an array mounting structure or array assembly which can engage the movable stop or stops once probes are loaded or final assembly is completed; (16) use, or inclusion, of individual probes that include two fixed stops that are used to bias one spring of two or more springs such that the one spring is pre-biased by both movable stops being on the inside (spring side) of their respective fixed stops for a spring that is compressed or both being on the outside of their respective stops for a spring that is operated as an extension spring (i.e. biased in an extended state); (17) use, or inclusion, of individual probes that include three springs, or more, and two or more movable stops that contact fixed stops when their respective springs are made to compress or extend in the same direction such that a multi-stage increase in compliance occurs as each moveable stop moves away from its fixed stop; (18) use, or inclusion, of multiple springs or spring segments that are connected via flat, T-shaped, angled, or other bar or plate configurations that run between the springs or spring segments on a single layer or via one or more intermediate layers that separate at least one spring or spring segment from another spring or spring segment; (19) use, or inclusion, of guide elements (e.g. sheaths, rails, fixed or movable plates, or the like) that are provided to ensure that compression springs do not bulge laterally during compression in an excessive manner (e.g. where unintended contact or interference with an adjacent spring or spring segment or with a neighboring probe could occur); (20) use, or inclusion, of probe tips that have a form selected from the group consisting of: (1) flat surfaces, (2) knife edge or blade-like structures, (3) multi-contact crown-like configurations, (4) single point contacts, and (5) single or multiple curved contact structures; (21) use, or inclusion, of tips that include the same material as the springs; (22) use, or inclusion, of tips that include a different material from that forming part of a spring, (23) use, or inclusion, of current that flows form one probe tip to another probe tip via one or more spring elements; (24) use, or inclusion, of tips, tip extensions, springs, connection bars, sheaths, and/or the like that provide movable or non-movable (e.g., sliding) contacts between element of a single probe to shunt part, most, or all of the current around spring elements; (25) use, or inclusion, of probes that incorporate dielectric elements to provide individual probes with isolated conductive regions (e.g., for coaxial or other multi-path probe structures) or to ensure electrically isolation of some probes from other probes; (26) use, or inclusion, of probes that are selectively electrically or dielectrically connected to guide plates or electrically or dielectrically connected to other structures to provide desired lateral or longitudinally spacing, alternate current flow paths, and/or to provide electrical shielding; (27) use, or inclusion, of probe end regions or intermediate probe regions that include sliding components or surfaces through which probe shaft elements slide as shunting contact surfaces; (28) use, or inclusion, of probe end regions or intermediate regions that engage sliding components or surfaces of array or mounting structures against which probe shaft elements slide as shunting contact surfaces; (29) use, or inclusion, of probes that are formed using multi-layer, multi-material electrochemical fabrication methods in whole or in part; (30) use, or inclusion, of probes that are formed with separated components or as partly connected or aligned components that need at least some assembly after formation of components; (31) use, or inclusion, of probes that are formed in their entirety with all components formed together where their build configurations are similar to their working configurations with possible exceptions of additional biasing existing during use; (32) use, or inclusion, of probes that are formed with all components together but in build configurations that are different from working configurations such that assembly is not required but where movement of components from one configuration to another is required prior to use (e.g., relocation of components, compression or expansion of spring elements, snapping together of separated but aligned component features, sliding together or interlocking components, and the like); or (33) use, or inclusion, of probes that include stop features that do not engage movable stops upon probe formation but instead are made to engage movable stops upon compression or extension of their respective springs, or probes tips, by longitudinal sliding of engagement elements, lateral movement of engagement elements, rotational movement of engagement elements, or the like, where engagement may occur automatically upon initial spring movement, tip movement, or may be made to occur independently of spring or probe tip movement.
Numerous other variations are possible some of which are explicitly or implicitly set forth herein while others will be apparent to those of skill in the art after review of the teachings herein.
In addition to having two compression spring and an intermediate movable stop, probes of the first embodiment may take on a variety of different forms and different functionalities. Such implementations, alternatives, or variations may include for example, one or more of: (1) the springs having different lengths, (2) the springs having different biasing rates (e.g. spring constants), (3) the springs having the same biasing rate, (4) the springs having reversed biasing rates such that of the top spring has a higher biasing rate than that of the bottom spring, (5) the springs having different compressible structures or patterns that allow a particular amount of compression without exceeding elastic distortion limits of the material and their structural configuration (e.g. rectangular wave shaped spring elements, rectangular spring elements connected by standoffs, sine wave shaped spring elements, S-shaped spring elements, C-shaped spring elements, planar spring elements, non-planar spring elements, helical shaped spring elements, helical spring elements with inward or outward spirals, and the like), (6) the fixed stop being part of the probe, (7) the fixed stop being part of an assembly structure the probe is fitted into, (8) probes tips having the same or different configurations such as those that might be useful for a flat pad, useful for engaging a solder bump, or useful for scratching through an oxide barrier covering a contact surface, (9) probe tips may be formed of different materials than that of the spring or elements, (10) probe tips may be formed of different materials than that of the stop elements, (11) probes may include regions that provide for shunting contact between tips, stops, or springs and framing, sheath, or assembly structures, (12) probe may include regions of contact dielectric materials for inhibiting electrical connections between probe elements or between a probe element and another structure, (13) probes may include bonding materials or bonding enhancement materials that aid in attaching probe elements to one another or enable attachment of probe elements to other structures, (14) individual springs may be made up of multiple spring segments that are connected by standoffs, spacers, bars, and the like to provide configurations that are serial, parallel, or a combination thereof, where the individual segments are spaced from one another but are located side-by-side, flat-surface-to-flat surface, or end-to-end, and (15) spring segments may operate in compression or extensions modes. In some variations, one of the probe tips may be replaced with a fixed stop feature or may be bonded to another structure so as to function as a permanent or semi-permanent connection. In still other variations, the springs may have longitudinal lengths (e.g. tip-to-tip) appropriate for a selected application, e.g. 1 mm or less to 10 mm or more, the probes may have perpendicular lateral dimensions that are approximately the same or of different sizes, e.g. from about 1-to-1 to about 10-to-1 or more, lateral dimensions of the probe may allow arrays to be formed with pitches (probe-to-probe center spacings) as small as 50 ums or smaller and as large as 1 mm or larger with probe lateral dimensions ranging from tens of microns or smaller to hundreds of microns or larger, flat springs may have segment thicknesses as small as 10 microns or smaller or as large as 100 microns or larger, segment widths as small as 30 microns or smaller and as large as 200 microns or larger, and segments lengths as short as 100 microns or smaller and as large as 2 mm or larger. Other variations may provide the probe with structural elements such as frames, guides, sheaths, and assembly engagement features that allow for spring protection, limit unintended spring movement or deflection, provide for controlled spring compression, provide for probe-to-probe spacing, retention of elements within working range or biasing range requirements. Other variations are possible and may include features associated with other embodiments or variations or those features explicitly discussed elsewhere herein, implicit from the teachings provided herein, or ascertainable by those of skill in the art after review of the teachings herein.
During probe use, a combination of structural configuration, probe materials, and operational parameters for a probe are generally selected to provide the probe with long elastic operational life. Thus, in general it is preferred that stress of probe element be maintained below yield strength limits of the materials and even substantially below those limits, e.g. at below 80% of yield strength, or even below 50%, or even below 30%.
Probes of the second group of embodiments have first and second springs that are extension, tensional, or tensive springs. The springs also support a movable stop that interacts with a fixed stop to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
The stages shown include: (1) both probe tips being unbiased—i.e. springs being un-tensioned (
Probes of the third group of embodiments have a first spring that is operate under tension and a second spring that operates under compression, with both spring on the same side of a movable stop. The springs together also support a movable stop and each spring separately supports a probe tip arm which in turn supports a tip. The movable stop interacts with a fixed stop to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
The stages of operation illustrated include: (1) the probe tips being uncompressed—i.e. springs being un-tensioned and uncompressed (
Probes of the fourth group of embodiments have a first two part (or two segment) compression spring that is operate under and a second compression spring that is separated from the first spring by a movable stop. The springs also individually support a probe tip arm which in turn supports a tip. The movable stop interacts with a fixed stop that may or may not be part of the probe (e.g., it could be part of a mounting structure or guide plate that the probe may engage with) to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
The stages illustrated include: (1) the probe tips being uncompressed—i.e. springs being uncompressed (
Probes of the fifth group of embodiments have a first two-part (or two segment) spring that includes a compression spring operating in series with an extension spring tension which are separated from a second compression spring by a movable stop. The springs also individually support a probe tip arm which in turn supports a tip. The movable stop interacts with a fixed stop that may or may not be part of the probe to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
The probe of
Numerous variations of this embodiment are possible and include for example: (1) adding to the present embodiment features associated other embodiments or replacing some of the features of the present embodiment with those from one or more other embodiments, (2) using or including a different number of stabilizing guides, (3) using or including a different configuration of stabilizing guides, (4) using or including a different number of springs and with different configurations, including different numbers of segments and/or types of segments and/or positional relationships between segments, and/or different connection relationships between segments and other segments or between segments and coupling structures, (5) using or including different tip configurations. (6) using or including different connecting elements that join the spring segments where the connecting elements may or may not provide guide features, (7) using or including fixed stop features, (8) using or including different or additional movable stop features, (9) using or including interface features that aid in aligning with and engaging fixed stop features that are part of array structures, (10) using or including interface features that aid in array loading and retention, and (11) using or including additional features for aiding in the pre-biasing of spring segments.
Still other embodiments may be created by combining the various embodiments and their alternatives with other embodiments and their alternatives as set forth herein
Probes of the sixth group of embodiments have a first two-part (or two segment) spring that includes two compression spring segments operating in series which are separated from a second compression spring by a movable stop. The springs also individually support probe tip arms which in turn support a tips. The movable stop interacts with a fixed stop that may or may not be part of the probe to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
Still other embodiments may be created by combining the various embodiments and their alternatives which have been set forth herein with other embodiments and their alternatives which have been set forth herein.
Probes of the seventh group of embodiments have a first two-part (or two segment) spring that includes an extension spring operating in series with a compression spring which connects to a second extension spring on the same side of a movable stop. The tension spring segment and the second spring also individually support a probe tip arm which in turn supports a tip. The movable stop interacts with a fixed stop that may or may not be part of the probe to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
Probes of the eighth group of embodiments have first and second two-part (or two segment) springs that connect together via a movable stop with both of the two-part spring including a compression spring segment connected to the movable stop and an extension segment connected to the other end of the compression segment. On opposite end of each extension segment connects to a tip arm which ends in a tip. The movable stop interacts with a fixed stop that may or may not be part of the probe to provide one of several functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
Probes of the ninth group of embodiments have three springs in series separated by two movable stops. The two outermost springs also individually support a probe arm which in turn end in a tip. The movable stops interact with respective fixed stops with both stops facing in the same direction with a first fixed stop located between the two movable stops and the other located behind the first fixed stop and the behind its respective movable stop. The fixed stops may or may not be part of the probe. The combination provides at least one of several possible functionalities related to varying probe compliance with increased compression of probe tips, and more particularly to increasing compliance with increased compression of probe tips. Numerous variations of the probes of this group of embodiments are possible and include those listed in association with the first group of embodiments as well as others that will be apparent to those of skill in the art upon review of the teachings herein.
As with all other figures herein, other elements in
More generally embodiments similar to those of
In other variations, probes with three or more springs such as some of those shown in
Other embodiments may be created by combining features from the various embodiments and their alternatives as set forth herein with the other embodiments and their alternatives which have also been set forth herein. Other embodiments may extend the embodiments set forth herein. As a first example, such embodiments may provide more than two compliance changes (i.e., three or more changes, i.e. four or more compliances with each increased relative to the previous one) when compressing a second tip (e.g. against a DUT) after initially compressing a first tip to bias N springs (N>3) which are connected by N-1 intermediate movable stops which engage respective fixed stops in order from last to first as initial loading occurs. In some array usage embodiments, due to (1) assembly tolerances, (2) fabrication tolerances, (3) planarity tolerances on probe tips in the probe array, and/or (4) planarity tolerance of the contact surfaces on a DUT, not all probes may undergo all N-1 compliance increments but due to the configuration of such an array the force increase experienced by each DUT contact pad or bump will be limited after an initial contact and compression at an initially relative low compliance provides an adequate force to ensure good electrical contact between the probe and the DUT contact.
Other extended embodiments, can provide for more than one compliance reduction (i.e. more than two compliances) during compression of both probe tips when a single probe includes 5 or more springs separated by intermediate movable stops with the center spring pre-biased at a first force level, the remaining two intermediate springs biased at a second force level which is less than the first force level and the two outer springs having no initial bias or a bias that is less than the second force level such that upon usage a compression of a tip provides for initial increased biasing of the outer most spring only, then a combination of the outermost spring and the next spring, and finally from a combination of the all three springs from the center to the outer most spring, with a similar result occurring upon compression of the other tip with a possible difference being that the transition forces will be higher when compressing the second tip if the two tips are not being compressed simultaneously.
Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. For example, some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickel-cobalt as a structural material while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu) in combination with one or more materials, beryllium copper (BeCu), nickel phosphorous (Ni—P), tungsten (W), aluminum copper (Al—Cu), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr—Cu), and combinations of these. Some embodiments may use copper as the structural material with or without a sacrificial material.
Structural or sacrificial dielectric materials may be incorporated into embodiments of the present invention in a variety of different ways. Such materials may form a third material or higher deposited material on selected layers or may form one of the first two materials deposited on some layers. Additional teachings concerning the formation of structures on dielectric substrates and/or the formation of structures that incorporate dielectric materials into the formation process and possibility into the final structures as formed are set forth in a number of patent applications filed Dec. 31, 2003: (1) U.S. Patent Application No. 60/534,184 (P-US032-A-SC), which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (2) U.S. Patent Application No. 60/533,932 (P-US033-A-MF), which is entitled “Electrochemical Fabrication Methods Using Dielectric Substrates”; (3) U.S. Patent Application No. 60/534,157 (P-US041-A-MF), which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials”; (4) U.S. Patent Application No. 60/533,891 (P-US052-A-MF), which is entitled “Methods for Electrochemically Fabricating Structures Incorporating Dielectric Sheets and/or Seed layers That Are Partially Removed Via Planarization”; and (5) U.S. Patent Application No. 60/533,895 (P-US070-B-MF), which is entitled “Electrochemical Fabrication Method for Producing Multi-layer Three-Dimensional Structures on a Porous Dielectric”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.
Additional patent filings that provide, intra alia, teachings concerning incorporation of dielectrics into electrochemical fabrication processes include: (1) U.S. patent application Ser. No. 11/139,262 (P-US144-A-MF), filed May 26, 2005, now U.S. Pat. No. 7,501,328, by Lockard, et al., and which is entitled “Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers that are Partially Removed Via Planarization”; (2) U.S. patent application Ser. No. 11/029,216 (P-US128-A-MF), filed Jan. 3, 2005 by Cohen, et al., now abandoned, and which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (3) U.S. patent application Ser. No. 11/028,957 (P-US127-A-SC), by Cohen, which was filed on Jan. 3, 2005, now abandoned, and which is entitled “Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (4) U.S. patent application Ser. No. 10/841,300 (P-US099-A-MF), by Lockard et al., which was filed on May 7, 2004, now abandoned, and which is entitled “Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers that are Partially Removed Via Planarization”; (5) U.S. patent application Ser. No. 10/841,378 (P-US106-A-MF), by Lembrikov et al., which was filed on May 7, 2004, now U.S. Pat. No. 7,527,721, and which is entitled “Electrochemical Fabrication Method for Producing Multi-layer Three-Dimensional Structures on a Porous Dielectric”; (6) U.S. patent application Ser. No. 11/325,405 (P-US152-A-MF), filed Jan. 3, 2006 by Dennis R. Smalley, now abandoned, and which is entitled “Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings”; (7) U.S. patent application Ser. No. 10/607,931 (P-US075-A-MG), by Brown, et al., which was filed on Jun. 27, 2003, now U.S. Pat. No. 7,239,219, and which is entitled “Miniature RF and Microwave Components and Methods for Fabricating Such Components”, (8) U.S. patent application Ser. No. 10/841,006 (P-US104-A-MF), by Thompson, et al., which was filed on May 7, 2004, now abandoned, and which is entitled “Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures”; (9) U.S. patent application Ser. No. 10/434,295 (P-US061-A-MG), by Cohen, which was filed on May 7, 2003, now abandoned, and which is entitled “Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry”; and (10) U.S. patent application Ser. No. 10/677,556 (P-US081-A-MG), by Cohen, et al., filed Oct. 1, 2003, now abandoned, and which is entitled “Monolithic Structures Including Alignment and/or Retention Fixtures for Accepting Components”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.
Some embodiments may employ diffusion bonding or the like to enhance adhesion between successive layers of material or to reduce stress. Various teachings concerning the use of diffusion bonding in electrochemical fabrication processes are set forth in U.S. patent application Ser. No. 10/841,384 (P-US103-A-SC), which was filed May 7, 2004 by Cohen et al., now abandoned, which is entitled “Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion” and which is hereby incorporated herein by reference as if set forth in full.
The patent applications and patents set forth below are hereby incorporated by reference herein as if set forth in full. The teachings in these incorporated applications can be combined with the teachings of the instant application in many ways: For example, enhanced methods of producing structures may be derived from some combinations of teachings, enhanced structures may be obtainable, enhanced apparatus may be derived, enhanced methods of using may be implemented, and the like.
Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. Some method of making embodiments may not use any blanket deposition process and/or they may not use a planarization process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments, for example, may use nickel, nickel-phosphorous, nickel-cobalt, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.
It will be understood by those of skill in the art that additional operations may be used in variations of the above presented method of making embodiments. These additional operations may, for example, perform cleaning functions (e.g. between the primary operations discussed herein or discussed in the various materials incorporated herein by reference, they may perform activation functions and monitoring functions, and the like.
It will also be understood that the probe elements of some aspects of the invention may be formed with processes which are very different from the processes set forth herein, and it is not intended that structural aspects of the invention need to be formed by only those processes taught herein or by processes made obvious by those taught herein.
Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment are intended to apply to all embodiments to the extent that the features of the different embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment. Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings set forth herein with various teachings incorporated herein by reference.
It is intended that any aspects of the invention set forth herein represent independent invention descriptions which Applicant contemplates as full and complete invention descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements, from other embodiments or aspects set forth herein, for interpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or added as dependent claims to further define an invention being claimed by those respective dependent claims should they be written.
In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant invention will be apparent to those of skill in the art. As such, it is not intended that the invention be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.
The below table sets forth the priority claims for the instant application along with filing dates, patent numbers, and issue dates as appropriate. Each of the listed applications is incorporated herein by reference as if set forth in full herein including any appendices attached thereto. ContinuityWhich wasIssuedDkt No.App. No.TypeApp. No.FiledWhich is nowonFragmentThis applicationclaims benefit of62/961,6752020 Jan. 15pending—382-BThis applicationclaims benefit of62/956,1242019 Dec. 31pending—382-AThis applicationclaims benefit of62/956,0162019 Dec. 31pending—381-AThis applicationclaims benefit of62/961,6722020 Jan. 15pending—381-BThis applicationclaims benefit of62/956,1222019 Dec. 31pending—383-AThis applicationclaims benefit of62/961,6782020 Jan. 15pending—383-B
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| Number | Date | Country | |
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| 62961678 | Jan 2020 | US | |
| 62961675 | Jan 2020 | US | |
| 62961672 | Jan 2020 | US | |
| 62956122 | Dec 2019 | US | |
| 62956016 | Dec 2019 | US | |
| 62956124 | Dec 2019 | US |
