Analytical devices and instruments are used in a number of applications to quantitatively and/or qualitatively analyze a sample of interest. Analytical devices and instruments are often found in laboratories and are sometimes employed within processing operations. As used herein, an analytical device is any device, system or arrangement that is able to receive a sample of interest and provide an indication of some aspect of the sample of interest. Analytical devices include, without limitation, process gas analyzers, NO/NOx analyzers, hydrocarbon analyzers, continuous emission monitoring systems and process gas chromatographs.
Gas chromatographs (GC) rely on precise control of temperature of chromatographic columns, detectors, and support systems. One or more electrical heaters are used to heat a controlled oven, chamber or locally heated zone or substrate (hereinafter oven). Such heaters operate by cycling on/off in a closed loop control system with temperature feedback provided by one or more temperature sensors in or near the oven. Such state of the art oven temperature control systems provide adequate control of a temperature set point (typically +/−0.1° C. or less) for the oven when external ambient conditions are stable. However, it is common for process gas chromatographs to be installed without protection from the ambient environment. Such exposed process gas chromatographs may experience ambient temperature variations from −40° to +60° C. but are still expected to deliver consistent measurement performance across such wide ambient variations.
As the art of process analytic devices has progressed, there is increasing pressure to provide a more precise analytic output even when faced with significant ambient temperature fluctuations.
A process analytic device has an input to receive a sample of interest. An analytic detector is operably coupled to receive the sample of interest and to provide an analytic output relative to the sample of interest. A heat pipe is thermally coupled to the analytic detector.
In current state of the art gas chromatographs, an oven heater controls an average oven temperature driven by one or more measurements from temperature sensors within the oven. Examples of such sensors include thermocouples, resistance temperature devices (RTD's) and thermistors. Commonly, a single temperature sensor is used. The single point measurement leads to performance compromises when heat losses from the oven occur as a result of external ambient temperature variations. Typically, as the oven loses heat, there is a lag time before the control sensor indicates to the control system that the average oven temperature has dropped and the control system responds by applying power to the heater(s). The result is that some oven surfaces or areas may have cooled below the control set point before heating is commanded by the control system and that other areas of the oven will achieve temperatures higher than the set point before the control system senses that enough heat has been added to the oven to achieve the set point. Thus, significant variations may occur in current chromatograph ovens as a result of ambient influences.
Thermal Conductivity Detectors (TCD's) are commonly used in gas chromatographs and function by measuring minute deviations in thermal conductivity of gases flowing through the detector. Such detectors are extremely sensitive to temperature variations; affecting measurement stability and precision. Generally, the location of a TCD in the chromatograph oven is not thermally symmetrical. As the oven control system and heater(s) respond to external influences, localized temperature variations occur within the oven as described above. These oven variations allow for thermal losses or gains through the TCD mount and/or TCD body to cause the localized temperature of the TCD body to vary as a result. Any such temperature deviation of the TCD itself results in measurement variation.
Embodiments of present invention provide for improved measurement performance of temperature sensitive detectors within a process analytic device by significantly improving thermal control relative to such detectors. Embodiments of the present invention generally employ one or more heat pipes to provide additional heating to the TCD body to counteract thermal losses and reduce the effect of thermal variations within the oven.
A heat pipe is generally formed as conduit constructed from of a relatively high thermal conductivity metal, such as copper. The conduit is generally evacuated and then provided with working fluid after which the conduit is sealed. Examples of working fluids include water, ethanol, and acetone. The working fluid is selected such that when it contacts the hot (evaporator) side of the heat pipe it absorbs heat and turns into vapor. The vapor then flows to the cold side where it releases thermal energy (cools) and condenses back to a liquid. The liquid then returns to the hot side via a capillary action or gravity and the process repeats.
Heat pipes are known and used for conducting heat from the hot (evaporator) to the cold (condenser) zone. Heat pipes are commonly used to remove waste heat (e.g. cooling a microprocessor), or drive heat into a device from a remote heater. Heat pipe technology typically provides thermal conductivities 100-200 times that of copper. Heat pipe performance is such that significant heat flux can be moved across a small deviation in temperature between the evaporator and the condenser.
Embodiments of the present invention generally employ one or more heat pipes arranged in a manner that couple the thermal conductivity detector body with the temperature-controlled oven. A heat pipe is generally a passive device that provides a high level of thermal coupling between its evaporator and its condenser. One embodiment of the present invention locates the heat pipe evaporator such that it extends into the precisely controlled oven with the heat pipe condenser located on or proximate the thermal conductivity detector itself. This arrangement provides a very stable heat source to add supplemental heating (or cooling) to the thermal conductivity detector based on the temperature of the heat pipe evaporator, without the need to have any additional control system to control heat pipe operation. The heat pipe evaporator is ideally located in the area of the oven determined to be most precisely thermally controlled and most immune to external thermal influences; typically near the temperature sensor of the thermal control system for the oven. Thus, the heat source for the heat pipe is exceptionally stable and provides more precise control than a modulated supplemental heater. This stable passive heat source pumps heat from the most stable area of the oven to the thermal conductivity detector body. This, in turn, helps compensate for heat demand variation induced by external influences. Sourcing the heat from the most isothermal area of the oven provides supplemental heating to the thermal conductivity detector body at a constant temperature providing less actual deviation in practice than the oven control provides for. This arrangement eliminates the need for a supplemental heater and controller and/or additional insulation or thermal conductivity detector isolations. This steady state source of supplemental heat minimizes variation of the thermal conductivity detector body and thus provides for improved measurement performance in a varying environment.
Within cover 20, one or more heaters 22 maintain precise thermal control of the entire assembly 10. For example, for process gas chromatography, the entire assembly 10 is typically maintained at approximately 80° C. plus or minus a fraction of a degree C. Heaters 22 are coupled to a controller 24 that may be a component of the process gas chromatograph 10 or separate. Controller 24 is also coupled to one or more temperature sensors 26 in order to determine the temperature within cover 20. Controller 24 selectively applies power to heaters 22 based on the measured temperature in order to provide precise thermal control within cover 20. This precise thermal control allows controller 24 to maintain the temperature of the sample of interest and the analytic detector at a specified temperature. However, as set forth above, it is possible for small thermal fluctuations to occur based on heat flow, time lag, and the control regime.
As shown in
Heat pipe 30 is preferably constructed from tubing formed of a metal with high thermal conductivity such as copper or aluminum. Additionally, given the precise nature of thermal control around 80° C., it is preferred that the working fluid of the heat pipe have a boiling point close to that value. One suitable example of a working fluid with a boiling point, at standard pressure, near 80° is ethanol. However, water can also be a suitable working fluid for an 80° C. control point if the pressure inside the heat pipe is reduced sufficiently. In at least some embodiments, it is also preferred that the entire assembly illustrated in
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
Number | Name | Date | Kind |
---|---|---|---|
3828184 | Lupton | Aug 1974 | A |
4096908 | Lamy | Jun 1978 | A |
5043576 | Broadhurst et al. | Aug 1991 | A |
5588988 | Gerstel et al. | Dec 1996 | A |
5686656 | Amirav et al. | Nov 1997 | A |
5756878 | Muto et al. | May 1998 | A |
5778681 | Li et al. | Jul 1998 | A |
5808179 | Sittler et al. | Sep 1998 | A |
5954860 | Gordon | Sep 1999 | A |
6054683 | Bremer et al. | Apr 2000 | A |
6113722 | Hoffman et al. | Sep 2000 | A |
6134945 | Gerstel et al. | Oct 2000 | A |
6461515 | Safir et al. | Oct 2002 | B1 |
6465777 | Rache | Oct 2002 | B1 |
6907796 | Bremer et al. | Jun 2005 | B2 |
8378293 | Quimby et al. | Feb 2013 | B1 |
8726747 | Kennett et al. | May 2014 | B2 |
20050268693 | Hasselbrink et al. | Dec 2005 | A1 |
20070107675 | Kurano | May 2007 | A1 |
20110107816 | Barth | May 2011 | A1 |
20110108568 | Hogan | May 2011 | A1 |
20120141345 | Slaten | Jun 2012 | A1 |
20120149125 | Earley et al. | Jun 2012 | A1 |
20120285223 | Andrews et al. | Nov 2012 | A1 |
20130071867 | Fadgen | Mar 2013 | A1 |
20130078609 | Tverskoy | Mar 2013 | A1 |
20130256523 | Steiner et al. | Oct 2013 | A1 |
20150013430 | Black et al. | Jan 2015 | A1 |
Number | Date | Country |
---|---|---|
201314906 | Sep 2009 | CN |
3047601 | Jul 1982 | DE |
Entry |
---|
First Chinese Office Action for Application No. 201310254759.8, dated Apr. 3, 2015, 15 pages. |
Second Office Action from Chinese Application No. 201310254759.8, from Oct. 9, 2015, 7 pages. |
Number | Date | Country | |
---|---|---|---|
20140260532 A1 | Sep 2014 | US |