Claims
- 1. A process for the removal of H.sub.2 S present at low concentration in a gas also containing 5 to 60% by volume of water vapor, which comprises the steps of:
- a) cooling the H.sub.2 S-containing gas to a temperature below the dew point of the water, thereby condensing the water vapor, separating substantially all of the water and forming a cooled H.sub.2 S-containing gas substantially free of the water,
- b) scrubbing the cooled H.sub.2 S-containing gas substantially free of the water at a temperature below the dew point of the water present in the gas to be treated with an H.sub.2 S-absorbent liquid which is free of the condensed water of step a), forming (i) an absorbent liquid charged with H.sub.2 S and (ii) a purified gas substantially free of water and H.sub.2 S, and
- c) contacting the (ii) purified gas with an excess of water including heated condensed water from step a), the temperature of the heated condensed water being such that the purified gas is rehydrated, so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas before cooling said gas and removing excess water not necessary for the adjustment of the water to correspond to that of the water present in the H.sub.2 S containing gas before cooling said gas, and
- d) incinerating the rehydrated purified gas prior to discharge into the atmosphere.
- 2. The process of claim 1, wherein substantially all of said condensed water from step a) contacts and rehydrates the purified gas in step c).
- 3. The process of claim 1, wherein the heated water contacting and rehydrating the purified gas in step c) comprises other waste waters, so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas before cooling said gas and of the added waste waters.
- 4. The process of claim 1, wherein the rehydrated purified gas has a water dew point substantially equal to the water dew point of the H.sub.2 S-containing gas before cooling of said gas in step a).
- 5. The process of claim 1, wherein the H.sub.2 S-containing gas has a H.sub.2 S content ranging from 10 v.p.m. to 10% by volume.
- 6. The process of claim 5, wherein the H.sub.2 S-containing gas is a residual gas produced by hydrogenation and hydrolysis of the residual gas from a sulphur plant, wherein all the sulphur compounds are formed into H.sub.2 S.
- 7. The process of claim 1, wherein the H.sub.2 S-containing gas also contains CO.sub.2.
- 8. The process of claim 1, wherein the scrubbing of the cooled H.sub.2 S-containing gas with the H.sub.2 S-absorbent liquid is performed at a temperature below 70.degree. C.
- 9. The process of claim 1, wherein the scrubbing of the cooled H.sub.2 S-containing gas with the H.sub.2 S-absorbent liquid is performed at a temperature between 5.degree. C. and 55.degree. C.
- 10. The process of claim 1, wherein the absorbent liquid charged with H.sub.2 S, is regenerated and reemployed for scrubbing of the cooled H.sub.2 S-containing gas in step b).
- 11. The process of claim 10, wherein the H.sub.2 S-absorbent liquid selectively absorbs H.sub.2 S.
- 12. The process of claim 11, wherein the H.sub.2 S-absorbent liquid selectively absorbing H.sub.2 S, is an aqueous solution of an amine selected from the group consisting of alkanolamines and sterically-hindered amines.
- 13. The process of claim 12, wherein the alkanolamines are selected from the group consisting of methyldiethanolamine, triethanolamine and diisopropanolamine.
- 14. The process of claim 12, wherein the amine concentration of said aqueous solution is between 1N and 8N.
- 15. The process of claim 12, wherein the amine concentration of said aqueous solution is between 3N and 6N.
- 16. The process of claim 1, wherein the H.sub.2 S-containing gas is cooled to a temperature below about 70.degree. C.
- 17. The process of claim 1, wherein the cooled H.sub.2 S-containing gas substantially free of water is scrubbed at a temperature below about 70.degree. C.
- 18. The process of claim 1, wherein the H.sub.2 S-containing gas is cooled to a temperature below about 70.degree. C. and the cooled H.sub.2 S-containing gas substantially free of water is scrubbed at a temperature below about 70.degree. C.
- 19. An apparatus for removing H.sub.2 S present at low concentration in a gas also containing 5 to 60% by volume of water vapor, which comprises in combination:
- a) means for cooling the H.sub.2 S-containing gas and for condensing the water vapor by cooling to a temperature below the dew point of the water, wherein substantially all of the water is condensed and separated, thereby forming a cooled H.sub.2 S-containing substantially free of the water,
- b) means for scrubbing the cooled H.sub.2 S-containing gas with an H.sub.2 -absorbent liquid which is free of the condensed water of step a), so that (i) an absorbent liquid charged with H.sub.2 S is formed and (ii) a purified gas substantially free of the water and H.sub.2 S is formed,
- c) means for maintaining the temperature of the absorbent liquid which is supplied to the scrubbing means below the dew point of the water present in the gas to be treated,
- d) means for contacting the purified gas with excess water including heated condensed water from a), said water heated by heating means wherein the heated condensed water is at a temperature for rehydrating the purified gas, so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas, before cooling said gas, and
- e) means for removing excess water not necessary for adjustment of the water to correspond to the water present in the H.sub.2 S-containing gas before cooling said gas.
- 20. The apparatus of claim 19, wherein substantially all the water condensed and separated by the cooling means is delivered to the contacting means for rehydrating the purified gas.
- 21. The apparatus of claim 19, wherein the means for contacting the purified gas are waste waters heated to a temperature for rehydrating the purified gas, so that the heated water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas, before cooling said gas and of the added waste waters from other sources.
- 22. The apparatus of claim 19, wherein the cooling means and the contacting means form two superposed and independent sections of a single column.
- 23. The apparatus of claim 19, wherein the cooling means, scrubbing means and contacting means form three superposed sections of a single column, forming a lower cooling column, an intermediate scrubbing column and an upper rehydration column, so that the gas exit of the cooling column and the gas entry of the scrubbing column form a passage for the gases and the gas exit of the scrubbing column and the gas entry of the rehydration column form a passage for the gases.
- 24. The apparatus of claim 19, wherein the means for cooling the H.sub.2 S-containing gas and for condensing the water vapor by cooling to a temperature below the dew point of the water, comprises a cooling column having, in its upper part, an exit for the cooled H.sub.2 S-containing gas, substantially free of the water, and an entry for liquids in its upper part, and in its lower part, a conduit for delivering the H.sub.2 S-containing gas and an exit for separating the condensed water.
- 25. The apparatus of claim 24, wherein the cooling column is mounted in a rehydration water circuit between said contacting zone of step c) and the cooling and condensing zone of step a) by the entry for the liquids in its upper part, and the exit for separating the condensed water in its lower part.
- 26. The apparatus of claim 25, wherein the cooling column is equipped with an indirect heat exchanger apparatus mounted between the entry and the exit of the rehydration water circuit.
- 27. The apparatus of claim 19, wherein the means for scrubbing the cooled H.sub.2 S-containing gas with the H.sub.2 S-absorbent liquid comprises a scrubbing column having an entry for a regenerated H.sub.2 S-absorbent liquid in its upper part and an exit for the absorbent liquid charged with H.sub.2 S in its lower part, and an entry for the cooled H.sub.2 S-containing gas in its lower part and an exit for the purified gas in its upper part.
- 28. The apparatus of claim 19, wherein the means for contacting the purified gas with the heated water, comprises a rehydration column mounted in a rehydration water circuit between said contacting zone of c) and the condensing zone of a) with a cooling column, having an entry for said purified gas in its lower part, an overhead exit for the rehydrated purified gas, extended by a conduit for removing said gas, an entry for the heated water, condensed and separated from the cooling column in its upper part, and an exit for the rehydration water in its lower part, so that the rehydration water is circulated to the cooling column for cooling the H.sub.2 S-containing gas.
- 29. The apparatus of claim 19, which further comprises means for regenerating and reemploying the absorbent liquid charged with H.sub.2 S, so that the H.sub.2 S-absorbent liquid is regenerated and reemployed for the scrubbing of the cooled H.sub.2 S-containing gas.
- 30. The apparatus of claim 29, wherein the means for regenerating and reemploying the absorbent liquid charged with H.sub.2 S, so that the H.sub.2 S-absorbent liquid is regenerated and reemployed for the scrubbing of the cooled H.sub.2 S-containing gas, comprises a regeneration column, having an overhead exit for an acidic gas, an entry for the absorbent liquid charged with H.sub.2 S in its upper part and an exit for the regenerated H.sub.2 S-absorbent liquid at its bottom.
- 31. The apparatus of claim 30, further comprising means for connecting the regeneration column in its lower part to a reboiler heated by indirect heat exchange by circulating steam.
- 32. The apparatus of claim 31, further comprising means for connecting the overhead exit of the regeneration column to a condenser, so that a conduit in the upper part of the condenser removes acidic gas and a conduit in the lower part of the condenser circulates condensates to the upper part of the regeneration column.
- 33. The apparatus of claim 30, wherein the means for scrubbing the cooled H.sub.2 s-containing gas with the H.sub.2 S-absorbent liquid, comprises a scrubbing column having an entry for a regenerated H.sub.2 S-absorbent liquid in its upper part and an exit for the absorbent liquid charged with H.sub.2 S in its lower part, and an entry for the cooled H.sub.2 S-containing gas in its lower part and an exit for the purified gas in its upper part.
- 34. The apparatus of claim 33, wherein the regeneration column and the scrubbing column are connected, so that the entry of the regeneration column is connected to the exit of the scrubbing column by a conduit, on which is mounted a cold circuit of an indirect heat exchanger, and the exit in the lower part of the regeneration column is connected to the entry of the scrubbing column by a conduit on which a hot circuit of the indirect heat exchanger is mounted.
- 35. The apparatus of claim 19, wherein the H.sub.2 S-containing gas is cooled to a temperature below about 70.degree. C.
- 36. The apparatus of claim 19, wherein the cooled H.sub.2 S-containing gas substantially free of water is scrubbed at a temperature below about 70.degree. C.
- 37. An apparatus for removing H.sub.2 S present at low concentration in a gas also containing 5 to 60% by volume of water vapor, which comprises, in combination:
- a) means for cooling the H.sub.2 S-containing gas and for condensing the water vapor by cooling to a temperature below the dew point of the water, wherein substantially all of the water is condensed and separated, thereby forming a cooled H.sub.2 S-containing gas substantially free of the water, said cooling means provided with a delivery conduit for the H.sub.2 S-containing gas in its lower part and having an exit for the gas in it upper part and an exit for the condensed water at the bottom,
- b) means for scrubbing the cooled H.sub.2 S-containing gas with an H.sub.2 S-absorbent liquid which is free of the condensed water in step a), so that (i) an absorbent liquid charged with H.sub.2 S is formed and (ii) a purified gas, substantially free of the water and H.sub.2 S is formed, which has an overhead exit for (ii) the purified gas, an entry for the H.sub.2 S-absorbent liquid in its upper part and, in its lower part, an exit for (i) the absorbent liquid charged with H.sub.2 S and a gas entry in its lower part for the cooled gas, said gas entry being connected to the gas exit of the cooling means,
- c) means for maintaining the temperature of the absorbent liquid which is supplied to the scrubbing means below the dew point of the water present in the gas to be treated,
- d) means for contacting the purified gas with excess water including the heated condensed water from a), said water heated by heating means wherein the heated condensed water is at a temperature for rehydrating the purified gas, and so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas, before cooling said gas, which has an overhead exit for the rehydrated purified gas, an entry in its upper part for the condensed water from the cooling means and, in its lower part, an exit for the condensed water for cooling the H.sub.2 S-containing gas, and a gas entry in its lower part being in communication with the gas exit of the scrubbing means,
- e) means for removing excess water not necessary for the adjustment of the water to correspond to the water present in the H.sub.2 S-containing gas before cooling said gas, and
- f) means for regenerating and remploying (i) the absorbent liquid charged with H.sub.2 S, so that the H.sub.2 S-absorbent liquid is regenerating and reemploying for the scrubbing of the cooled H.sub.2 S-containing gas, having an overhead exit for an acidic gas, an entry for (i) the absorbent liquid charged with H.sub.2 S in its upper part and an exit for the regenerated H.sub.2 S-absorbent liquid at its bottom, and means for connecting the overhead exit of the regenerating means to a condenser, so that a conduit in the upper part of the condenser removes acidic gas and a conduit in the lower part of the condenser circulates that condensates to the upper part of the regenerating means, and means for connecting the regenerating means and the scrubbing means, so that the entry in the upper part of the regenerating means is connected to the exit in the lower part of the scrubbing means by a conduit on which is mounted a cold circuit of an indirect heat exchanger, and the exit in the lower part of the regenerating means is connected to the entry in the upper part of the scrubbing means by a conduit on which a hot circuit of the indirect heat exchanger is mounted.
- 38. The apparatus of claim 37, wherein substantially all the water condensed and separated by the cooling means is delivered to the contacting means for rehydrating the purified gas.
- 39. An apparatus for removing H.sub.2 S present at low concentration in a gas also containing 5 to 60% by volume of water vapor, which comprises, in combination:
- a) means for cooling the H.sub.2 S-containing gas and for condensing the water vapor by cooling to a temperature below the dew point of the water, wherein substantially all of the water is condensed and separated, thereby forming a cooled H.sub.2 S-containing gas substantially free of the water.
- b) means for scrubbing the cooled H.sub.2 S-containing gas at a temperature below about 70.degree. C. with an H.sub.2 S-absorbent liquid which is free of the condensed water of step a), so that (i) an absorbent liquid charged with H.sub.2 S is formed and (ii) a purified gas substantially free of the water and H.sub.2 S is formed,
- c) means for contacting the purified gas with excess water including heated condensed water from a), said water heated by heating means wherein the heated condensed water is at a temperature for rehydrating the purified gas, so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of water present in the H.sub.2 S-containing gas, before cooling said gas, and
- d) means for removing excess water not necessary for the adjustment of the water to correspond to the water present in the H.sub.2 S-containing gas before cooling said gas.
- 40. A process for the removal of H.sub.2 S present at low concentration in a gas also containing 5 to 60% by volume of water vapor, which comprises the steps of:
- a) cooling the H.sub.2 S-containing gas to a temperature below the dew point of the water, thereby condensing the water vapor, separating substantially all of the water and forming a cooled H.sub.2 S-containing gas, substantially free of the water,
- b) scrubbing the cooled H.sub.2 S-containing gas, substantially free of the water, at a temperature below about 70.degree. C. with an H.sub.2 S-absorbent liquid which is free of the condensed water of step a), forming (i) an absorbent liquid charged with H.sub.2 S and (ii) a purified gas, substantially free of water and H.sub.2 S,
- c) contacting the (ii) purified gas with an excess of water including heated condensed water from step a), the temperature of the heated condensed water being such that the purified gas is rehydrated, so that the water content as water vapor corresponds to a mass flow rate of water substantially equal to the mass flow rate of the water present in the H.sub.2 S-containing gas before cooling said gas and removing excess water not necessary for the adjustment of the water to correspond to that of the water present in the H.sub.2 S containing gas before cooling said gas, and
- d) incinerating the rehydrated purified gas prior to discharge into the atmosphere.
Parent Case Info
This is a division of application Ser. No. 07/465,067, filed Jan. 19, 1990, which was issued as U.S. Pat. No. 5,133,949.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
8911326 |
Nov 1989 |
WOX |
Divisions (1)
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Number |
Date |
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Parent |
465067 |
Jan 1990 |
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