Claims
- 1. A process for the electrolytic formation of a deposit on a group of electrodes of a support chosen from among a multiplicity of electrodes on the support, wherein the support used has on its surface the multiplicity of electrodes and comprises an electrically conductive plate respectively forming with the multiplicity of electrodes a multiplicity of capacitors, comprising:
- selectively charging a group of capacitors corresponding to the group of chosen electrodes by depositing electric charges on the group of electrodes; and
- placing the support in contact with an electrolyte to cause electrolytic depositing on the electrodes corresponding to the charged capacitors, the electric charges deposited on the electrodes and stored in the corresponding capacitors respectively providing an electrolysis current for each of the chosen electrodes.
- 2. A process in accordance with claim 1, comprising:
- using an electrolysis counter-electrode in electrical contact with the plate.
- 3. A process in accordance with claim 1, comprising:
- using the plate as a counter-electrode for electrolysis.
- 4. A process in accordance with claim 1, comprising:
- in order to selectively charge said group of capacitors, using a polarizing head having a multiplicity of contact pads able to come into contact respectively with the multiplicity of electrodes, positioning the polarizing head on the electrolysis support in such manner as to bring each electrode of the electrolysis support into contact with a corresponding contact pad of the polarizing head, and bringing the electrically conductive plate into contact with at least one contact pad of the polarizing head, the charges being deposited selectively on the chosen electrodes via contact pads.
- 5. A system, comprising:
- an electrolysis support having a multiplicity of electrodes and an electrically conductive plate, electrically insulated from the multiplicity of electrodes, the electric plate forming with said multiplicity of electrodes a multiplicity of capacitors;
- a front plate fitted with a multiplicity of contact pads, placed in such manner that they may be placed in contact respectively with the multiplicity of electrodes on the electrolysis support, and with at least one contact pad positioned so that it can be brought into contact with a contact connection of the plate; and
- addressing means to selectively apply a polarizing voltage to a group of contact pads chosen from among the multiplicity of contact pads.
- 6. A system in accordance with claim 5, in which, in the electrolysis support, the electrodes and/or the plate are formed of an electric conducting material.
- 7. A system of claim 5, wherein said support comprises a support plate, said electrically conductive plate comprising a layer of electric conducting material placed on the support plate forming an earth shield, a layer of electric insulating material placed on the layer of conducting material, and the multiplicity of electrodes comprising an electric conductor material placed on the layer of insulating material.
- 8. A system in accordance with claim 7, in which the layer of insulating material comprises at least one opening in the areas without the electrodes to expose the earth shield in these areas.
- 9. A system in accordance with claim 8, wherein the opening is a groove surrounding each of the electrodes.
- 10. A system in accordance with claim 5, in which the electrodes and/or the plate are doped zones of a semiconductor support.
- 11. A system in accordance with claim 10, comprising a semiconductor substrate of a first conductivity and zones set in the substrate having a second conductivity, opposed to the first conductivity.
- 12. A system in accordance with claim 5, in which the contact pads comprise contact beads.
- 13. The system of claim 5, wherein the plate comprises an earth shield.
- 14. A polarizing head, comprising:
- an electrolysis support having a multiplicity of electrodes and an electrically conductive plate;
- a front plate fitted with a multiplicity of contact pads, placed in such manner that they may be placed in contact respectively with the multiplicity of electrodes on the electrolysis support, and with at least one contact pad positioned so that it can be brought into contact with a contact connection of the plate;
- addressing means to selectively apply a polarizing voltage to a group of contact pads chosen from among the multiplicity of contact pads; and
- a compression chamber, the front plate forming one portion of a wall of the compression chamber, and in which the compression chamber may be placed under pressure to produce slight deformation of the front plate when the polarizing head is placed on the electrolysis support, so that the contact pads may be firmly applied against the electrodes.
- 15. The system of claim 14, wherein the plate comprises an earth shield.
Priority Claims (1)
Number |
Date |
Country |
Kind |
96 12060 |
Oct 1996 |
FRX |
|
Parent Case Info
This is a national stage application of PCT/FR97/10735, filed Oct, 1, 1997.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/FR97/01735 |
10/1/1997 |
|
|
6/18/1998 |
6/18/1998 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO98/14637 |
4/9/1998 |
|
|
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|
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Dec 1991 |
|
5776791 |
Caillat et al. |
Jul 1998 |
|
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Date |
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9305384 |
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BRX |
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EPX |
419804 |
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EPX |
WO 9422889 |
Oct 1994 |
WOX |
Non-Patent Literature Citations (2)
Entry |
Patrice Caillat, et al., Leti (CEA-Technologies avancees-), pp. 12 to 5, "Fluxless Flip-Chip Technology"--date unavailable. |
G. C. Fiaccabrino, et al., Sensors and Actuators B, vol. 18-19, pp. 675 to 677, "Array of Individually Addressable Microelectrodes", 1994--month unavailable. |