Claims
- 1. A process for the activation of substate surfaces for the purpose of currentless metallization, consisting essentially of the steps in which the surface to be metallized is treated with an activator compound homogeneously distributed in a solvent, the solvent is removed and the activator compound adhering to the surface to be metallized is reduced by use of a reducing agent contained in the metallization bath wherein the treating of the substrate surface with activator compound and solvent removal are effected at 0.degree. to 80.degree. C. and the activator compound is a palladium dichloride complex which exhibits at least one ligand containing a group with C--C or C--N double or triple bond or a group capable of chelate formation selected from OH, SH, CO, CS, or COOH for binding the metal therein and at least one ligand containing a carboxylic acid group, carboxylic acid halide group, carboxylic acid anhydride group, carboxylic acid ester group, carboamide group, carbonimide group, aldehyde group, ketone group, ether group, sulphoamide group, sulphonic acid group, sulphonate group, sulphonic acid halide group, sulphonic acid ester group, halogen-containing heterocyclic group, activated double bond, amino group, hydroxyl group, isocyanate group, olefin group, acetylene group, mercapto group or epoxide group for fixing the activator compound to the substrate surface.
- 2. A process according to claim 1, wherein the additional functional groups are carboxylic acid and carboxylic acid anhydride groups.
- 3. A process according to claim 1, wherein the organometallic compound is dissolved or dispersed in the solvent in a quantity of from 0.01 to 10 g/liter.
- 4. A process according to claim 1, wherein the solvent is a pure organic solvent or mixtures or blends of several organic solvents.
- 5. A process according to claim 1, wherein the substrate is activated without prior etching.
- 6. A process according to claim 1, wherein the substrate surface is treated with a swelling agent.
- 7. A process according to claim 1, wherein the swelling agent is in the activating bath.
- 8. A process according to claim 1, wherein the swelling agent used is a O-solvent or mixtures thereof with precipitants.
- 9. A process according to claim 1, wherein the swelling agent additionally contain emulsifiers and/or water-soluble minerals or organic and/or inorganic acids such as HCl, CH.sub.3 COOH or CHO.sub.2 H.
- 10. A process according to claim 1 wherein the wetting is effected at 0.degree. to 80.degree. C.
- 11. A process according to claim 1, wherein the treating is effected at room temperature.
- 12. A process according to claim 1, wherein the activator compound exhibits at least one ligand containing a C--C double bond and at least one ligand containing a dicarboxylic acid anhydride group, a C--C double or an ether group.
- 13. A process according to claim 1, wherein the activator compound is cyclohexene-1,2-dicarboxylic acid anhydride palladium dichloride.
- 14. A process according to claim 1, wherein the activator compound is butadiene palladium dichloride.
- 15. A process according to claim 1, wherein the activator compound is isobutyl vinylether palladium dichloride.
- 16. A process according to claim 1, wherein the activator compound is bis-(allyl) palladium dichloride.
- 17. A process according to claim 3, wherein the activator compound is dissolved in the solvent.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3148280 |
Dec 1981 |
DEX |
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Parent Case Info
This is a continuation of application Ser. No. 779,192, filed 9/23/85, now abandoned, which is a continuation of Ser. No. 444,927, filed 11/26/82, now abandoned.
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Date |
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3560257 |
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Feb 1971 |
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3684534 |
Emerson |
Aug 1972 |
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4006047 |
Brummett et al. |
Feb 1977 |
|
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CHX |
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GBX |
Non-Patent Literature Citations (2)
Entry |
"Cyclohexadien-(1.3)-cyclopentadien-palladium(O)", Ernst ).Fischer und Helmut Werner, Chemishe Berichte Jahrg.93,1960, pp. 2075-2082. |
The Organic Chemistry of Palladium, Vol. II Catalytic Reactions 1971, pp. 8-9. |
Continuations (2)
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Number |
Date |
Country |
Parent |
779192 |
Sep 1985 |
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Parent |
444927 |
Nov 1982 |
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