Claims
- 1. A process for analyzing, monitoring or controlling the internal structure of a non-conductive, moldable material, said process comprising the steps of:
- (a) pressing, injecting or extruding a non-conductive, moldable material which either has dipoles or other electrically-charged particles therein, or which is susceptible to the creation of dipoles or other electrically-charged particles therein when said material is subjected to an electrical field;
- (b) adjusting the temperature of the pressed, injected or extruded material until it is at a temperature of polarization (T.sub.p) which is at least about one half of the material's glass transition temperature (T.sub.g) for amorphous type materials when T.sub.g is given in degrees Kelvin, or at least about one half of the material's melting temperature (T.sub.m) for crystalline or semi-crystalline materials when T.sub.m is given in degrees Kelvin;
- (c) electrically treating the temperature-adjusted material by subjecting the same to a non time-varying, electrical field, said material is subjected to said electrical field either until at least some of the dipoles of or other charges within said material are oriented in the direction of the electrical field, or until dipoles or other electrically-charged particles are created thereby;
- (d) permitting at least particle relaxation of the electrically-treated material, wherein said relaxation results in the disorientation of or decrease in at least some of the dipoles of or other charges within said material which were oriented or created during the electrical treatment step, and wherein said disorientation of or said decrease in the dipoles or charges generates an electrical current;
- (e) measuring the electrical current generated from the at least partial relaxation of the electrically-treated material;
- (f) correlating a relationship between the measured electrical current and the internal physical state of the material;
- (g) cooling the relaxed, electrically-treated material to a temperature which is at least about 20% below the material's melting temperature (T.sub.m) expressed in degrees Kelvin; and
- (h) molding the cooled material to a desired shape.
- 2. A process as recited in claim 1 wherein said non-conductive, moldable material has dipoles or other electrically-charged particles therein.
- 3. A process as recited in claim 1 wherein said non-conductive, moldable material is substantially free of dipoles or other electrically-charged particles therein but is susceptible to the creation of dipoles or other electrically-charged particles when subjected to an electrical field.
- 4. A process as recited in claim 1 wherein, prior to said electrical treatment step, the temperature of said pressed, injected or extruded material is in the range of between about 0.5 T.sub.g to about 1.35 T.sub.g of said material when said material is amorphous, and when T.sub.g is given in degrees Kelvin, or in the range of between about 0.5 T.sub.m to below said material's melting temperature when said material is crystalline or semi-crystalline, and when T.sub.m is given in degrees Kelvin.
- 5. A process as recited in claim 4 wherein, prior to said electrical treatment step, the temperature of said pressed, injected or extruded material is in the range of between about 0.75 T.sub.g to about 1.25 T.sub.g of said material when said material is amorphous, and when T.sub.g is given in degrees Kelvin, or in the range of between about 0.5 T.sub.m to about 0.9 T.sub.m of said material when said material is crystalline or semi-crystalline, and when T.sub.m is given in degrees Kelvin.
- 6. A process as recited in claim 1 wherein the non time-varying, electrical field is a non-variable voltage ranging from between about 100 volts to about 10 Mega volts for each centimeter of thickness of said material being preconditioned.
- 7. A process as recited in claim 6 wherein the non time-varying, electrical field is a non-variable voltage ranging from between about 500 volts to about 5 Mega volts for each centimeter of thickness of said material being preconditioned.
- 8. A process as recited in claim 7 wherein the non time-varying, electrical field is a non-variable voltage ranging from between about 1000 volts to about 1 Mega volt for each centimeter of thickness of said material being preconditioned.
- 9. A process as recited in claim 1 wherein said non time-varying, electrical field is applied during said electrical treatment step to said temperature-adjusted material for a period of time ranging from between about 1 second to about 10 minutes.
- 10. A process as recited in claim 9 wherein said non time-varying, electrical field is applied during said electrical treatment step to said temperature-adjusted material for a period of time ranging from between about 5 seconds to about 5 minutes.
- 11. A process as recited in claim 10 wherein said non time-varying, electrical field is applied during said electrical treatment step to said temperature-adjusted material for a period of time ranging from between about 10 seconds to about 2 minutes.
- 12. A process as recited in claim 1 wherein, during step (g), said relaxed material is cooled to a temperature which is at least about 60.degree. C. below said material's minimum polarization temperature (T.sub.p).
- 13. A process as recited in claim 10 wherein, during step (g), said relaxed material is cooled to a temperature which is at least about 25% below said material's melting temperature (T.sub.m) expressed in degrees Kelvin.
- 14. A process as recited in claim 1 wherein during step (h), said cooled material is shaped by being subjected to a process selected from the group consisting essentially of: injection-molding, blow-molding, compression-molding, transfer molding, calendaring, laminating, cold molding, and extruding.
- 15. A process as recited in claim 1 wherein step (b) is performed simultaneously with step (a).
- 16. A process as recited in claim 1 wherein steps (b) and (c) are performed simultaneously with step (a).
- 17. A process as recited in claim 1 wherein steps (b), (c) and (d) are performed simultaneously with step (a).
- 18. A process as recited in claim 1 wherein steps (b), (c), (d) and (e) are performed simultaneously with step (a).
- 19. A process as recited in claim 1 wherein steps (b), (c), (d), (e) and (f) are performed simultaneously with step (a).
- 20. A process as recited in claim 1 wherein steps (b), (c), (d), (e), (f) and (g) are performed simultaneously with step (a).
- 21. A process as recited in claim 1 wherein step (c) results in the dipoles of or other charges within said material being oriented at right angles to said material's surface wall.
- 22. A process as recited in claim 1 wherein step (e) is performed while said at least partially relaxed material is at a temperature which is greater than about 20% below said material's melting temperature (T.sub.m) expressed in degrees Kelvin.
- 23. A process as recited in claim 22 wherein step (e) is performed while said at least partially relaxed material is at a temperature which is greater than about 15% below said material's melting temperature (T.sub.m) expressed in degrees Kelvin.
- 24. A process as recited in claim 23 wherein step (e) is performed while said at least partially relaxed material is at a temperature which is greater than about 10% below said material's melting temperature (T.sub.m) expressed in degrees Kelvin.
- 25. A process as recited in claim 1 wherein the current measured during step (e) is used to control a pre-molding, molding or post molding operation.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8616836 |
Dec 1986 |
FRX |
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CROSS REFERENCE INFORMATION
This application is a continuation-in-part of U.S. application Ser. No. 663,988, filed Mar. 4, 1991 and entitled "Process for Preconditioning a Plastic Material by Polarization before it is Molded", now abandoned, which is itself a continuation-in-part of U.S. application Ser. No. 245,413, filed Sep. 21, 1988, now abandoned.
US Referenced Citations (16)
Foreign Referenced Citations (6)
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
663988 |
Feb 1991 |
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Parent |
245413 |
Sep 1988 |
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