Claims
- 1. A process of metallizing a body to provide on the surface thereof a codeposit-free metal coating comprising contacting the surface of said body with a metallizing bath having dispersed therein finely divided insoluble particles which are not codeposited with said metal coating, said metal coating having a surface morphology better than the morphology of a surface of a metal coating produced by said metallizing bath devoid of said insoluble particles.
- 2. The process according to claim 1 wherein said body is a memory member.
- 3. A plating bath for depositing on the surface of a body a codeposit-free metal coating, said bath comprising a solution of metal ions to be plated, and finely divided insoluble particles which are not codeposited with said metal ions dispersed within said solution, said insoluble particles being of a lubricating nature having a negative Zeta potential.
- 4. A plating bath for depositing on the surface of a body a codeposited free metal coating said bath comprising a solution of metal ions to be plated and finely divided insoluble particulate matter which are not codeposited along with said metal ions, wherein, said particles are dispersed within said solution and further wherein said insoluble particles selected from the group consisting of PTFE, FEP, boron nitride, graphite, MoS.sub.2, TaLc, Mica, WS.sub.2, AgS, WSe.sub.2, NbSe.sub.2, MoSe.sub.2, MoTe.sub.2, CaF.sub.2, FeS, and mixtures thereof.
- 5. The plating bath according to claim 4, wherein said insoluble particles have a negative zeta potential when measuring said potential in water alone in the presence of a dispersant.
- 6. An electrolytic plating bath for depositing on the surface of a body a codeposited free metal coating said bath comprising auxiliary electrodes a solution of metal ions to be plated and finely divided insoluble particulate matter which are not codeposited along with said metal ions, wherein said particles are dispersed within said solution and further wherein said insoluble particles selected from the group consisting of PTFE, FEP, boron nitride, graphite, MoS2, Talc, WS2, graphite fluoride, AgS, SWe2, NbSe2, MoSe2, MoTe2, CaF2, FeS, and mixtures thereof.
- 7. The plating bath according to claim 4, wherein said metal is deposited by electroless (chemical) method deposition.
- 8. The plating bath according to claim 4, wherein said insoluble particles are selected in quantity dependent upon the particle size and charge to eliminate their codeposition within said metal coating.
- 9. The plating bath according to claim 4, wherein said bath further comprises a dispersant.
- 10. The plating bath according to claim 4, further comprising a secondary insoluble particles which are codeposited during the deposition of said metal ions.
- 11. A process of metallizing a body to provide on the surface thereof a smooth metal coating comprising contacting the surface of said body with a metallizing bath having dispersed therein a quantity, particle size and charge that the insoluble particles are not co-deposited with the metal and metallizing said body so as to produce a metal coating thereon.
- 12. The process recited in claim 11 wherein said metallizing bath is a nickel electroless metallizing bath.
- 13. The process recited in claim 11 wherein said metallizing bath is an electroplating bath.
- 14. The process recited in claim 11 wherein the body to be metallized has a metal surface and functions as a cathode in the metallization process, said process further including the step of applying a voltage across an anode and a cathode, both placed in the metallizing bath.
- 15. The process according to claim 11 wherein the metal coating is smoother in comparison to the resulting smoothness for coating resulting from a metallized bath without the presence of the insoluble particles.
- 16. The process of metallizing the surface of a body with an improved surface finish metal coating, said process comprising providing a plating bath for metallizing said body with a metal coating, dispersing in said plating bath finely divided insoluble particles, selecting said particles having a nature, size and quantity whereby said particles are not co-deposited with said metal coating, and contacting the surface of said body with said plating bath to produce a metal coating thereon substantially free of said particles, wherein said metal coating has an improved surface finish in comparison to the surface finish of a metal coating produced in said plating bath devoid of said insoluble particles.
- 17. A process of metallizing the surface of a body with an improved metallic coating, said process comprising;
- 1. Selecting finely divided particulate matter having a nature, size and quantity so that the particles are not co-deposited within said metallic coating and dispersing said particulate matter within an electroless plating composition, and
- 2. Contacting said body with said electroless plating composition along with said particulate matter to deposit said metallic coating devoid of said particulate matter resulting in an improved metallic coating in comparison to a coating derived from the same electroless plating composition devoid of said particulate matter.
- 18. An improved process for metallizing the surface of a body, said process comprising contacting said body with a plating composition with finely divided insoluble particulate matter dispersed therein to provide a metallic coating substantially free of any codeposited particulate matter and having improved surface properties for said coating in comparison to the coating resulting from said process without said particulate matter dispersed within said plating composition and further said particulate matter is a lubricant.
- 19. The process according to claim 18 wherein said lubricant is having a negative zeta potential charge.
- 20. The process according to claim 14 wherein said insoluble particles are 1-micron and less in size and further having a negative zeta potential.
- 21. An electrolytic plating bath for depositing on a substrate a codeposit-free metal coating, said bath comprising auxiliary electrodes, a solution of metal ions to be plated, and finely divided insoluble particles dispersed within said solution, said insoluble particles are not codeposited with said metal ions.
- 22. A process of metallizing a substrate with an improved metallic coating, said process comprising;
- 1. Selecting finely divided insoluble particulate matter having a nature, size, charge and quantity so that said particulate matter are not co-deposited within said metallic coating and dispersing said particulate matter within an electrolytic plating composition, and
- 2. Contacting said substrate with said electrolytic plating composition along with said particulate matter to deposit said metallic coating devoid of said particulate matter resulting in an improved metallic coating in comparison to said metallic coating derived from said electrolytic plating composition devoid of said particulate matter.
- 23. The process according to claim 17 wherein said electroless plating composition is a low phosphorous bath.
- 24. The plating bath according to claim 6 further comprising a dispersant.
- 25. The plating bath according to claim 24 wherein said dispersant in combination with said particulate matter in water alone yield a negative Zeta potential.
- 26. The process according to claim 11 wherein said charge is a negative Zeta potential when measuring said insoluble particles in combination with an added dispersant in water alone.
- 27. The process according to claim 16 wherein said plating bath further comprises a dispersant.
- 28. The process according to claim 17 wherein said electroless plating composition further comprises a dispersant.
- 29. The process according to claim 20 wherein said plating composition further comprises a dispersant.
- 30. The plating bath according to claim 23 wherein said bath further comprises a dispersant.
REFERENCE TO PRIOR APPLICATION
This application is a continuation-in-part of application Ser. No. 08/270,622, filed Jul. 5, 1994, now abandoned, which is a continuation-in-part of application Ser. No. 07/824,655, filed Jan. 23, 1992, now abandoned.
US Referenced Citations (5)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
270622 |
Jul 1994 |
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Parent |
824655 |
Jan 1992 |
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