Claims
- 1. An improved method for bonding a heat curable silicone rubber composition to a substrate which comprises applying a heat curable silicone rubber composition to a substrate and thereafter curing the silicone rubber composition at an elevated temperature, the improvement which comprises coating the substrate prior to the application of the silicone rubber composition with an aqueous primer composition consisting essentially of from 0.5 to 20 percent by weight based on the weight of the primer composition of an 1 alkenyltrihydrocarbonoxysilane having the formula
- RSi[(OR").sub.n OR'].sub.3
- where R is an alkenyl radical having from 2 to 6 carbon atoms, R' is a monovalent hydrocarbon radical having from 1 to 10 carbon atoms, R" is a divalent hydrocarbon radical having from 1 to 6 carbon atoms and n is a number of from 0 to 4, an aqueous miscible solvent which is present in an amount of from 10 to 25 percent by weight based on the weight of the aqueous primer composition and having a boiling point up to 180.degree. C., water in an amount of from 55 to 82 percent based on the weight of the aqueous primer composition and an organic acid in an amount sufficient to provide a pH below 7, and thereafter drying the coated substrate.
- 2. The improved method of claim 1, wherein n is equal to 0.
- 3. The improved method of claim 1, wherein the aqueous miscible solvent is selected from aliphatic alcohols having from 1 to 4 carbon atoms, glycol ethers, ketones and esters.
- 4. The improved method of claim 1, wherein the heat curable silicone rubber composition contains an organopolysiloxane gum, filler and a peroxide curing agent.
- 5. The improved method of claim 1, wherein the silicone rubber composition contains an organopolysiloxane having at least two SiC-bonded aliphatically unsaturated groups per molecule, an organosilicon compound having at least three Si-bonded hydrogen atoms per molecule and a catalyst which promotes the addition of the Si-bonded hydrogen to the SiC-bonded aliphatically unsaturated groups.
Parent Case Info
This is a continuation of application Ser. No. 491,158 filed May 4, 1983, now abandoned.
US Referenced Citations (4)
Continuations (1)
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Number |
Date |
Country |
| Parent |
491158 |
May 1983 |
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