Claims
- 1. A process for providing hot melt adhesive masses with a tackless surface comprising the steps of:
- a) extruding the hot melt adhesive through an appropriate die orifice;
- b) spraying the surface of the extruded adhesive with a molten film forming polymeric material, the material being selected so that it will not detract from the properties of the adhesive composition when remelted therewith when such remelted adhesive is applied through narrow orifice spray equipment;
- c) heating the surface of the coated adhesive at a temperature and for a period of time sufficient to re-melt the film forming polymer so as to form a continuous coating thereof yet insufficient to melt the adhesive;
- d) cooling the thus coated adhesive mass to a temperature suitable for handling; and
- e) subsequently remelting the coated adhesive mass.
- 2. The process of claim 1 wherein the film-forming material is selected from the group consisting of cracked linear low desity polyethylene, high melt index ethylene vinyl acetate copolymers containing 8 to 28% vinyl acetate, and ethylene iso-butylene copolymers.
- 3. The process of claim 1 wherein the film-forming material is selected from the group consisting of A-B-A block copolymers, lower melt index ethylene vinyl acetate copolymers and higher molecular weight low melt index polyethylene and polyamides which polymers are further formulated with tackifying resins, waxes, plasticizers and other non-tacky agents which serve to lower the coating viscosity and improve the barrier function of the coating.
- 4. The process of claim 1 wherein the film-forming material is applied by spraying in an amount sufficient to provide a coating of 0.5 to 10 mils.
- 5. The process of claim 1 wherein the heating operation is carried out by flash heating at a temperature of 350.degree. to 500.degree. F. for 1 to 10 seconds.
- 6. A process for providing hot melt adhesive masses with a tackless surface comprising the steps of:
- a) extruding the hot melt adhesive through an appropriate die orifice;
- b) spraying the surface of the extruded adhesive with a molten film forming polymeric material, the material being such that it will not detract from the properties of the adhesive composition when remelted therewith and being selected from the group consisting of cracked linear low density polyethylene, high melt index ethylene vinyl acetate copolymers containing 8 to 28% vinyl acetate, ethylene iso-butylene copolymers, A-B-A block copolymers, lower melt index ethylene vinyl acetate copolymers and higher molecular weight low melt index polyethylene and polyamides which polymers are further formulated with at least one of a member selected from the group consisting of tackifying resins, waxes, and plasticizers;
- c) heating the surface of the coated adhesive at a temperature and for a period of time sufficient to re-melt the film forming polymer so as to form a continuous coating thereof yet insufficient to melt the adhesive when said remelted adhesive is applied through narrow orifice spray equipment;
- d) cooling the thus coated adhesive mass to a temperature suitable for handling; and
- e) subsequently remelting the coated adhesive mass.
Parent Case Info
This application is a continuation of application Ser. No. 08/269,462, filed Jun. 30, 1994, now abandoned.
US Referenced Citations (10)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0 258 086 |
Oct 1990 |
EPX |
0 469 564 |
Feb 1992 |
EPX |
0 557 573 A2 |
Feb 1992 |
EPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
269402 |
Jun 1994 |
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