Claims
- 1. A process for collecting and analyzing the content of a liquid from at least one source of liquid, the process comprising:
bleeding the liquid continuously from said at least one source of liquid through a bleed line to a receptacle of a collector, the receptacle having an inlet for receiving liquid into the receptacle from the bleed line and an open top, the bleed line and collector being free of structure capable of stopping the flow of liquid from the at least one source of liquid to the receptacle; drawing a sample of the liquid from the receptacle by an automated sample collecting device, the open top of the receptacle being sized to permit reception of the sample collecting device into the receptacle; depositing the liquid from the sample collecting device into a liquid analysis device; and analyzing the liquid for its content.
- 2. The process as set forth in claim 1 wherein the collector further comprises a port for connection to the at least one source of liquid, the port being constructed for permanent open fluid communication with the receptacle and being free of structure capable of stopping the flow of liquid from the at least one source of liquid through the port to the receptacle.
- 3. The process as set forth in claim 2 wherein the collector further comprises an inlet connecting the port and the receptacle, the inlet being sized to control the rate of flow of liquid from said at least one source of liquid into the receptacle.
- 4. The process as set forth in claim 1 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
- 5. The process as set forth in claim 1 having a plurality of receptacles and spillways for sampling liquid from a plurality of sources of liquid, each spillway being associated with a respective receptacle.
- 6. The process as set forth in claim 5 having a waste trough in fluid communication with the spillways, for carrying away overflow liquid flowing down the spillways.
- 7. The process as set forth in claim 5 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
- 8. The process as set forth in claim 5 wherein the receptacles are arranged in a row spaced at intervals selected to facilitate the operation of the sample collection device.
- 9. The process as set forth in claim 8 having a waste trough in fluid communication with the spillways, for carrying away overflow liquid flowing down the spillways.
- 10. The process as set forth in claim 8 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
- 11. A process for collecting and analyzing the content of a liquid from at least one source of liquid, the process comprising:
bleeding the liquid continuously from said at least one source of liquid through a bleed line to a receptacle of a collector, the receptacle having an inlet at its bottom for receiving liquid into the receptacle from the bleed line and an open top; delivering the liquid into the receptacle continuously from the inlet to the open top of the receptacle, so that the liquid continuously flows from the bottom of the receptacle to the open top and continuously spills over the open top of the receptacle into a spillway of the collector, the bleed line and collector being free of structure capable of stopping the flow of liquid from the at least one source of liquid to the receptacle; drawing a sample of the liquid from the receptacle by an automated sample collecting device, the receptacle being sized to permit reception of the sample collecting device therein; depositing the liquid from the sample collecting device into a liquid analysis device; and analyzing the liquid for its content.
- 12. The process as set forth in claim 11 wherein the collector further comprises a port for connection to said at least one source of liquid, the port being free of structure capable of stopping the flow of water from the at least one source of liquid through the port to the receptacle.
- 13. The process as set forth in claim 12 wherein the collector further comprises an inlet connecting the port and the receptacle, the inlet being sized to control the rate of flow of liquid from said at least one source of liquid into the receptacle.
- 14. The process as set forth in claim 11 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
- 15. The process as set forth in claim 11 having a plurality of receptacles and spillways for sampling liquid from a plurality of sources of liquid, each spillway being associated with a respective receptacle.
- 16. The process as set forth in claim 15 having a waste trough in fluid communication with the spillways, for carrying away overflow liquid flowing down the spillways.
- 17. The process as set forth in claim 15 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
- 18. The process as set forth in claim 15 wherein the receptacles are arranged in a row spaced at intervals selected to facilitate the operation of the sample collection device.
- 19. The process as set forth in claim 18 having a waste trough in fluid communication with the spillways, for carrying away overflow liquid flowing down the spillways.
- 20. The process as set forth in claim 18 wherein the source of liquid is a semiconductor wafer cleaning bath and the liquid is a cleaning bath solution.
RELATED APPLICATIONS
1. This application is a divisional of prior application Ser. No. 09/093,520 filed Jun. 8, 1998.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09093520 |
Jun 1998 |
US |
Child |
09730172 |
Dec 2000 |
US |