Process for finishing a wooden board and wooden board produced by the process

Abstract
A process for finishing a wood or wooden board, in particular an MDF or HDF board, with an upper side and an underside. The process includes applying a sealing layer of melamine resin to the upper side of the board and printing a decoration onto the sealing layer. A protective layer is applied of melamine resin to the decoration and the board is pressed under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the decoration printed on.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention


The invention generally relates to a wooden board and a process for finishing a wooden board, in particular an MDF or HDF board with an upper side and an underside. These boards may be used, for example, for furniture construction and panels, in particular flooring panels.


2. Background Description


Flooring panels with a substrate board made of wood are normally designated laminate panels and have been on the market for many years to substitute for parquet. The desired decoration (parquet, wood grain, tiles, and so on) is printed onto a paper web, which is subsequently coated with resin and rolled up on a roll or stacked as sheet goods. The decorative web prefabricated in this way is laid on the substrate board at the flooring manufacturer and is pressed.


As a result of printing the decoration onto the paper web, the later sealing of the paper web with synthetic resin and the subsequent connection of the decorative layer to the substrate board by means of pressure and temperature, the dimensions of the paper web are changed. Those skilled in the commonly refer to this phenomenon as paper growing. The paper grows both in length (lengthwise growth) and also in width (widthwise growth).


If this decorative board is then to be cut to size to form individual panels, the lengthwise and widthwise growth must be taken into account, since otherwise there would be an unequal distribution of the decoration on the individual panels. This would result in the floor assembled from an unequally distributed decorative layer having undulations in the decoration at the connecting edges of the panels. Even if such undulations in the decoration are only a few millimeters, they are striking when viewed, which has a detrimental influence on the esthetic impression and therefore reduces the quality of the laid floor.


In order to be able to produce in suitable quality, the paper growth must be registered and the saw which saws the panels out of the substrate board must be adjusted appropriately. Manual adjustment is very time-consuming. DE 100 19 054 C1 describes a method of cutting panels to size from a substrate board with which the saw can be matched automatically to the paper growth. For this purpose, cameras are needed which determine the actual position of defined decorative points. The actual position is then compared with the intended position and the deviation of the width or length dimension is determined, so that the saw can be adjusted appropriately.


In order to optimize the cutting, it is therefore necessary to expend a great deal of effort, which makes the production of high-quality panels expensive. In order further to match the visual quality of the laminate panel to the visual quality of a natural wood panel, in the press in which the decorative layer is pressed with the substrate board, a die plate having a relief can be provided, which impresses a relief corresponding to the wood grain into the synthetic resin layer. Since the paper growth is not reproducible, it is not possible to bring the relief completely into coincidence with the decoration. The joints of a tiled surface cannot be impressed into the surface, since deviations here would immediately be visible.


Starting from this problem, a process for finishing a wooden board is to be specified with which the disadvantages described above are avoided.


SUMMARY OF THE INVENTION

The problem is solved with a wooden board by means of the following steps:

    • a) applying a sealing layer of melamine resin to the upper side of the board,
    • b) printing a decoration onto the sealing layer,
    • c) applying a protective layer of melamine resin to the decoration, and
    • d) pressing the board under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the decoration printed on.


      The board is preferably further finished by means of the following steps:
    • e) applying a sealing layer of melamine resin to the underside of the board,
    • f) applying a colored layer to the sealing layer,
    • g) applying a protective layer of melamine resin to the colored layer,
    • h) pressing the board under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the colored layer.


In another aspect of the invention, a wooden board, in particular flooring panel, comprises an HDF or MDF substrate board with an upper side and an underside. The upper side has a decoration, wherein a sealing layer onto which a decoration is printed is applied to the substrate board. The decoration is covered by at least one wear-resistant layer.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows a flow chart of the method of finishing a board in accordance with the invention; and



FIG. 2 shows a cross sectional view of an embodiment of the board in accordance with the invention.





DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

Referring to FIG. 1, a flow chart of the method of finishing a board in accordance with the invention is shown. It should be understood that FIG. 1 is representative of the steps of the finishing process; however, FIG. 2 may equally represent some of the finishing processes as well as the resultant board or panel using the process of the invention. For example, the flow of FIG. 1 shows:

    • a) applying a sealing layer of melamine resin to the upper side of the board,
    • b) printing a decoration onto the sealing layer,
    • c) applying a protective layer of melamine resin to the decoration, and
    • d) pressing the board under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the decoration printed thereon.


The fact that the decoration is printed onto the board means that not only are the problems associated with the paper growth avoided but also the handling associated with laying the paper web on the upper side of the board. As a result of applying the sealing layer to the substrate board, the printing ink is prevented from being absorbed by the substrate board, which would be the case without the sealing layer, since the substrate board as such is absorbent.


By means of the sealing layer, the decorative color is kept on the surface and bonded, so that the decorative layer remains on the surface and forms a precise, clearly visible decoration. The protective layer of melamine resin replaces the known overlay which, in the known finishing processes, is laid on the decorative paper. By means of the subsequent pressing under the action of temperature until the protective layer and the sealing layer melt, the decoration is enclosed and the sealing layer and protective layer become a composite. With the aid of the press plate, the level of gloss of the surface can be adjusted. If a polished press plate is used, a highly glossy surface is achieved.


The board is preferably further finished by means of the following steps, as represented in FIG. 1, for example.

    • (i) applying a sealing layer of melamine resin to the underside of the board, and
    • (ii) applying a colored layer to the sealing layer.


      The protective layer of melamine resin may be applied to the colored layer, and the board may be pressed under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the colored layer.


By means of these steps, the otherwise usual undercoat in the case of a laminate panel is replaced. The individual layer thicknesses correspond to those on the upper side, so that distortion of the board is ruled out. It is particularly advantageous if the upper side and the underside are finished at the same time, which reduces the production time.


The finishing of the board can be carried out continuously, a continuous press preferably being used for the pressing. In this way, the production time is shortened further, which reduces the production costs.


The sealing layers 102 and/or the protective layers 104 are preferably applied in a plurality of individual layers, each individual layer drying out before the application of the next layer. The individual layers have a weight per unit area of 10-40 g/m.sup.2 in each case. The sealing layer 102 preferably includes two individual layers; the protective layer of four individual layers. In addition, the printing ink 106 can be applied in a plurality of layers.


In order that the decoration or the colored layer 106 does not melt or experience a color change during pressing, an appropriately heat-resistant color or heat-resistant varnish 107 can be applied in accordance with the invention. The varnish layer may be electron-beam cured or UV cured.


In order to obtain a smooth surface, the board 100 is preferably ground 108 before the first individual layer of the sealing layer is applied. Corundum 110 may be mixed into or scattered into at least one individual layer of the protective layer 104 in order to increase the abrasion resistance. Antibacterial and/or antistatic additives 112 can also be mixed into or scattered onto the protective layer 104. This can be carried out in the same or in another individual layer. All the individual layers are preferably treated correspondingly.


Fillers 116 can be introduced into the sealing layer 102 and/or the protective layer 104. Suitable fillers 116 are wood fibers, wood dust, metals, mineral substances (clay, sand), plastics, cellulose or ash. The fillers 116 can achieve a structure, which is applied so as to correspond with the decoration, so that fine reliefs can be produced. In the individual layers on the underside, the fillers are used, for example, for damping the sound of footfalls.


The finishing of the upper side of the board can also be carried out only in some regions. The finishing is preferably carried out on an area of the board running obliquely with respect to the upper side. For this purpose, a number of V joints 118 can be embossed into the upper side of the board. Following finishing, the board is sawed up centrally along the V joints, so that individual panels whose side edges have a chamfer are produced. These chamfers subsequently underline the visual impression of a joint between individual panels of a floor.


Since no paper layers are used, the boards are safe against distortion which could arise as a result of the inherent tensile force of the papers. Because of the thin layers, short process times can be implemented. The fillers introduced into the individual layers on the underside of the board can be provided in order to dampen the sound of foot steps, for example.


Instead of finishing a substrate board of high or medium density fibreboard (HDF or MDF), oriented strand board (OSB boards) or conventional chipboards with a correspondingly finely distributed top layer can also be used. It is also conceivable to form the sealing layer so thickly that irregularities in the board (OS) are compensated for. The boards can be used not only as flooring panels but can also be used in furniture construction.


Parts of the process according to the invention are suitable to impart laminate properties to a board with a real wood surface (wooden substrate board with veneer layer, solid wood), specifically high abrasion resistance, high impact resistance and an adjustable level of gloss. For this purpose, it is possible to dispense with the application of the decorative layer to the upper side or the colored layer to the underside. The subsequent sealing of the laid parquet can therefore be dispensed with. By printing on an appropriate decorative layer, inexpensive timbers can be increased in value. For example, an oak decoration can be printed onto a pine veneer and its color emphasized appropriately.


The press plate can be provided with a relief corresponding to the decoration, when the board is pressed, depressions are then produced in the protective layer, which for example correspond to a wood grain or to a tiled surface. The touch of the surface is then matched to a natural surface.


In particular, V joints running in the longitudinal direction and/or transverse direction of the board can be impressed into the protective layer. During the further processing, panels are then sawed from the board by sawing being carried out centrally along the V joints. As a result, the panels are then given a chamfered edge. These features are shown in FIG. 2, which can equally represent the process of finishing the boards.


While the invention has been described in terms of embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the appended claims.

Claims
  • 1. A wooden board comprising an HDF (high density fibreboard) or MDF (medium density fibreboard) substrate board with an upper side and an underside, the upper side having a decoration, wherein a sealing layer onto which the decoration is printed is applied to the substrate board, and in that the decoration is covered by at least one wear-resistant layer, wherein the sealing layer is melamine or urea resin, the sealing layer is between the decoration and the substrate board, and the decoration comprises heat-resistant colors.
  • 2. The wooden board according to claim 1, wherein the decoration is printed directly onto the sealing layer.
  • 3. The wooden board according to claim 1, wherein the wear-resistant layer is a varnish layer.
  • 4. The wooden board according to claim 3, wherein the varnish layer is electron-beam cured or UV cured.
  • 5. The wooden board according to claim 1, further comprising structuring means or corundum granules applied to the decoration in order to increase abrasion resistance.
  • 6. The wooden board according to claim 3, further comprising structuring means or corundum granules embedded in the varnish layer.
  • 7. The wooden board according to claim 1, wherein the substrate board is smooth on at least one of the upper side and underside.
  • 8. The wooden board according to claim 1, wherein the substrate board is ground on at least one of the upper side and underside.
  • 9. The wooden board according to claim 1, further comprising a structure or at least one V joint embossed into the wear-resistant layer.
  • 10. The wooden board according to claim 1, further comprising: an other sealing layer of melamine resin applied to the underside of the board; anda colored layer applied to the other sealing layer.
  • 11. The wooden board according to claim 1, further comprising at least one of antibacterial and antistatic additives mixed into or scattered onto the at least one wear-resistant layer.
  • 12. The wooden board according to claim 11, further comprising filler in at least one of the sealing layer and the at least one wear-resistant layer, wherein the filler comprises wood fibers, wood dust, metals, clay, sand, plastics, cellulose, or ash.
  • 13. The wooden board according to claim 12, wherein the filler is in the sealing layer and the at least one wear-resistant layer.
  • 14. The wooden board according to claim 12, wherein the filler achieves a structure so as to correspond with the decoration.
  • 15. The wooden board according to claim 12, further comprising: an other sealing layer of melamine resin applied to the underside of the board; anda colored layer applied to the other sealing layer.
  • 16. The wooden board of claim 1, wherein: the sealing layer includes two layers of melamine or urea resin, andthe at least one wear-resistant layer includes four layers.
  • 17. A wooden board, comprising: an HDF (high density fibreboard) or MDF (medium density fibreboard) substrate board with an upper side and an underside;a sealing layer of melamine or urea resin applied to the upper side of the substrate board;a decoration printed onto the sealing layer;a varnish layer applied over the decoration; anda protective layer of melamine or urea resin applied over the varnish,wherein the decoration is enclosed between the sealing layer and the protective layer, andthe sealing layer is arranged between the decoration and the substrate board.
  • 18. The wooden board of claim 16, further comprising: an other sealing layer of melamine resin applied on the underside of the substrate board;a color layer applied to the sealing layer; andan other protective layer of melamine resin applied to the color layer, wherein the other sealing layer and the other protective layer are bonded to each other with the color layer included there between.
  • 19. The wooden board of claim 16, wherein the sealing layer and the protective layer each have a weight per unit area in a range of 10-40 g/m2.
Priority Claims (2)
Number Date Country Kind
103 10 199 Mar 2003 DE national
03020230 Sep 2003 EP regional
CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Divisional Application of U.S. patent application Ser. No. 10/792,270, filed Mar. 4, 2004, which claims priority under 35 U.S.C. § 119 of German Patent Application No. 103 10 199.3 filed Mar. 6, 2003, and European Patent Application 03020230.3 filed Sep. 6, 2003, which the disclosures of all are expressly incorporated by reference herein in their entirety.

US Referenced Citations (304)
Number Name Date Kind
213740 Conner Apr 1879 A
623562 Rider Apr 1899 A
714987 Wolfe Dec 1902 A
753791 Fulghum Mar 1904 A
1124228 Houston Jan 1915 A
1407679 Ruthrauff Feb 1922 A
1454250 Parsons May 1923 A
1468288 Een Sep 1923 A
1477813 Daniels Dec 1923 A
1510924 Daniels et al. Oct 1924 A
1540128 Houston Jun 1925 A
1575821 Daniels Mar 1926 A
1602256 Sellin Oct 1926 A
1602267 Karwisch Oct 1926 A
1615096 Meyers Jan 1927 A
1622103 Fulton Mar 1927 A
1622104 Fulton Mar 1927 A
1637634 Carter Aug 1927 A
1644710 Crooks Oct 1927 A
1660480 Daniels Feb 1928 A
1714738 Smith May 1929 A
1718702 Pfiester Jun 1929 A
1734826 Pick Nov 1929 A
1764331 Moratz Jun 1930 A
1776188 Langb'aum Sep 1930 A
1778069 Fetz Oct 1930 A
1779729 Bruce Oct 1930 A
1787027 Wasleff Dec 1930 A
1823039 Gruner Sep 1931 A
1859667 Gruner May 1932 A
1898364 Gynn Feb 1933 A
1906411 Potvin May 1933 A
1921164 Lewis Aug 1933 A
1929871 Jones Oct 1933 A
1940377 Storm Dec 1933 A
1946648 Taylor Feb 1934 A
1953306 Moratz Apr 1934 A
1986739 Mitte Jan 1935 A
1988201 Hall Jan 1935 A
2023066 Curtis et al. Dec 1935 A
2044216 Klages Jun 1936 A
2065525 Hamilton Dec 1936 A
2123409 Elmendorf Jul 1938 A
2220606 Malarkey et al. Nov 1940 A
2276071 Scull Mar 1942 A
2280071 Hamilton Apr 1942 A
2324628 Kähr Jul 1943 A
2328051 Bull Aug 1943 A
2398632 Frost et al. Apr 1946 A
2430200 Wilson Nov 1947 A
2740167 Rowley Apr 1956 A
2894292 Gramelspacker Jul 1959 A
3045294 Livezey, Jr. Jul 1962 A
3100556 De Ridder Aug 1963 A
3125138 Bolenbach Mar 1964 A
3182769 De Ridder May 1965 A
3203149 Soddy Aug 1965 A
3204380 Smith et al. Sep 1965 A
3267630 Omholt Aug 1966 A
3282010 King, Jr. Nov 1966 A
3286006 Annand Nov 1966 A
3310919 Bue et al. Mar 1967 A
3347048 Brown et al. Oct 1967 A
3460304 Braeuninger et al. Aug 1969 A
3481810 Waite Dec 1969 A
3526420 Brancaleone Sep 1970 A
3538665 Gohner Nov 1970 A
3553919 Omholt Jan 1971 A
3555762 Costanzo, Jr. Jan 1971 A
3608258 Spratt Sep 1971 A
3694983 Couquet Oct 1972 A
3714747 Curran Feb 1973 A
3720027 Christensen Mar 1973 A
3731445 Hoffmann et al. May 1973 A
3759007 Thiele Sep 1973 A
3760548 Sauer et al. Sep 1973 A
3768846 Hensley et al. Oct 1973 A
3811915 Burrell et al. May 1974 A
3853578 Suzuki et al. Dec 1974 A
3859000 Webster Jan 1975 A
3878030 Cook Apr 1975 A
3902293 Witt et al. Sep 1975 A
3908053 Hettich Sep 1975 A
3912569 Kapral Oct 1975 A
3936551 Elmendorf et al. Feb 1976 A
3988187 Witt et al. Oct 1976 A
4006048 Cannady, Jr. et al. Feb 1977 A
4090338 Bourgade May 1978 A
4091136 O'Brian et al. May 1978 A
4099358 Compaan Jul 1978 A
4118533 Hipchen et al. Oct 1978 A
4131705 Kubinsky Dec 1978 A
4164832 Van Zandt Aug 1979 A
4169688 Toshio Oct 1979 A
4242390 Nemeth Dec 1980 A
4243716 Kosaka et al. Jan 1981 A
4245689 Grard et al. Jan 1981 A
4246310 Hunt et al. Jan 1981 A
4290248 Kemerer et al. Sep 1981 A
4299070 Oltmanns et al. Nov 1981 A
4426820 Terbrack et al. Jan 1984 A
4431044 Bruneau Feb 1984 A
4471012 Maxwell Sep 1984 A
4501102 Knowles Feb 1985 A
4520062 Ungar et al. May 1985 A
4561233 Harter et al. Dec 1985 A
4585685 Forry et al. Apr 1986 A
4612745 Hovde Sep 1986 A
4641469 Wood Feb 1987 A
4653242 Ezard Mar 1987 A
4654244 Eckert et al. Mar 1987 A
4703597 Eggemar Nov 1987 A
4715162 Brightwell Dec 1987 A
4738071 Ezard Apr 1988 A
4752497 McConkey et al. Jun 1988 A
4756951 Wang et al. Jul 1988 A
4769963 Meyerson Sep 1988 A
4819932 Trotter, Jr. Apr 1989 A
4831806 Niese et al. May 1989 A
4845907 Meek Jul 1989 A
4849768 Graham Jul 1989 A
4905442 Daniels Mar 1990 A
4947602 Pollasky Aug 1990 A
5029425 Bogataj Jul 1991 A
5103614 Kawaguchi et al. Apr 1992 A
5113632 Hanson May 1992 A
5117603 Weintraub Jun 1992 A
5136823 Pellegrino Aug 1992 A
5165816 Parasin Nov 1992 A
5179812 Hill Jan 1993 A
5205091 Brown Apr 1993 A
5216861 Meyerson Jun 1993 A
5251996 Hiller et al. Oct 1993 A
5253464 Nilsen Oct 1993 A
5283102 Sweet et al. Feb 1994 A
5295341 Kajiwara Mar 1994 A
5335473 Chase Aug 1994 A
5348778 Knipp et al. Sep 1994 A
5349796 Meyerson Sep 1994 A
5390457 Sjölander Feb 1995 A
5413834 Hunter et al. May 1995 A
5433806 Pasquali et al. Jul 1995 A
5474831 Nystrom Dec 1995 A
5497589 Porter Mar 1996 A
5502939 Zadok et al. Apr 1996 A
5540025 Takehara et al. Jul 1996 A
5567497 Zegler et al. Oct 1996 A
5570554 Searer Nov 1996 A
5597024 Bolyard et al. Jan 1997 A
5630304 Austin May 1997 A
5653099 MacKenzie Aug 1997 A
5671575 Wu Sep 1997 A
5694734 Cercone et al. Dec 1997 A
5706621 Pervan Jan 1998 A
5736227 Sweet et al. Apr 1998 A
5768850 Chen Jun 1998 A
5797175 Schneider Aug 1998 A
5797237 Finkell, Jr. Aug 1998 A
5823240 Bolyard et al. Oct 1998 A
5827592 Van Gulik et al. Oct 1998 A
5860267 Pervan Jan 1999 A
5935668 Smith Aug 1999 A
5943239 Shamblin et al. Aug 1999 A
5953878 Johnson Sep 1999 A
5968625 Hudson Oct 1999 A
5985397 Witt et al. Nov 1999 A
5987839 Hamar et al. Nov 1999 A
6006486 Moriau et al. Dec 1999 A
6023907 Pervan Feb 2000 A
6065262 Motta May 2000 A
6094882 Pervan Aug 2000 A
6101778 Martensson Aug 2000 A
6119423 Costantino Sep 2000 A
6134854 Stanchfield Oct 2000 A
6148884 Bolyard et al. Nov 2000 A
6168866 Clark Jan 2001 B1
6182410 Pervan Feb 2001 B1
6186703 Shaw Feb 2001 B1
6205639 Pervan Mar 2001 B1
6209278 Tychsen Apr 2001 B1
6216403 Belbeoc'h Apr 2001 B1
6216409 Roy et al. Apr 2001 B1
D442296 Külik May 2001 S
D442297 Külik May 2001 S
D442298 Külik May 2001 S
D442706 Külik May 2001 S
D442707 Külik May 2001 S
6224698 Endo May 2001 B1
6238798 Kang et al. May 2001 B1
6247285 Moebus Jun 2001 B1
D449119 Külik Oct 2001 S
D449391 Külik Oct 2001 S
D449392 Külik Oct 2001 S
6324803 Pervan Dec 2001 B1
6345481 Nelson Feb 2002 B1
6363677 Chen et al. Apr 2002 B1
6397547 Martensson Jun 2002 B1
6418683 Martensson et al. Jul 2002 B1
6421970 Martensson et al. Jul 2002 B1
6427408 Krieger Aug 2002 B1
6436159 Safta et al. Aug 2002 B1
6438919 Knauseder Aug 2002 B1
6446405 Pervan Sep 2002 B1
6449913 Shelton Sep 2002 B1
6449918 Nelson Sep 2002 B1
6453632 Huang Sep 2002 B1
6458232 Valentinsson Oct 2002 B1
6460306 Nelson Oct 2002 B1
6461636 Arth et al. Oct 2002 B1
6465046 Hansson et al. Oct 2002 B1
6490836 Moriau et al. Dec 2002 B1
6497961 Kang et al. Dec 2002 B2
6510665 Pervan Jan 2003 B2
6516579 Pervan Feb 2003 B1
6517935 Kornfalt et al. Feb 2003 B1
6519912 Eckmann et al. Feb 2003 B1
6521314 Tychsen Feb 2003 B2
6532709 Pervan Mar 2003 B2
6533855 Gaynor et al. Mar 2003 B1
6536178 Pålsson et al. Mar 2003 B1
6546691 Peopolder Apr 2003 B2
6553724 Bigler Apr 2003 B1
6558754 Velin et al. May 2003 B1
6565919 Hansson et al. May 2003 B1
6568148 Eisermann May 2003 B1
6569272 Tychsen May 2003 B2
6588166 Martensson et al. Jul 2003 B2
6591568 Palsson Jul 2003 B1
6601359 Olofsson Aug 2003 B2
6606834 Martensson et al. Aug 2003 B2
6617009 Chen et al. Sep 2003 B1
6635174 Berg et al. Oct 2003 B1
6641629 Safta et al. Nov 2003 B2
6646088 Fan et al. Nov 2003 B2
6647690 Martensson Nov 2003 B1
6649687 Gheewala et al. Nov 2003 B1
6659097 Houston Dec 2003 B1
6672030 Schulte Jan 2004 B2
6675545 Chen et al. Jan 2004 B2
6681820 Olofsson Jan 2004 B2
6682254 Olofsson et al. Jan 2004 B1
6685993 Hansson et al. Feb 2004 B1
6711864 Erwin Mar 2004 B2
6711869 Tychsen Mar 2004 B2
6715253 Pervan Apr 2004 B2
6723438 Chang et al. Apr 2004 B2
6729091 Martensson May 2004 B1
6745534 Kornfalt Jun 2004 B2
6761008 Chen et al. Jul 2004 B2
6761794 Mott et al. Jul 2004 B2
6763643 Martensson Jul 2004 B1
6766622 Thiers Jul 2004 B1
6769217 Nelson Aug 2004 B2
6769218 Pervan Aug 2004 B2
6769835 Stridsman Aug 2004 B2
6772568 Thiers et al. Aug 2004 B2
6786019 Thiers Sep 2004 B2
6803109 Qiu et al. Oct 2004 B2
6805951 Kornfält et al. Oct 2004 B2
6823638 Stanchfield Nov 2004 B2
6841023 Mott Jan 2005 B2
20010010839 Martino Aug 2001 A1
20010029720 Pervan Oct 2001 A1
20010034992 Pletzer et al. Nov 2001 A1
20020007608 Pervan Jan 2002 A1
20020007609 Pervan Jan 2002 A1
20020014047 Thiers Feb 2002 A1
20020020127 Thiers et al. Feb 2002 A1
20020046528 Pervan et al. Apr 2002 A1
20020056245 Thiers May 2002 A1
20020106439 Cappelle Aug 2002 A1
20020160680 Laurence et al. Oct 2002 A1
20030024200 Moriau et al. Feb 2003 A1
20030024201 Moriau et al. Feb 2003 A1
20030029115 Moriau et al. Feb 2003 A1
20030029116 Moriau et al. Feb 2003 A1
20030029117 Moriau et al. Feb 2003 A1
20030033777 Thiers et al. Feb 2003 A1
20030033784 Pervan Feb 2003 A1
20030115812 Pervan Jun 2003 A1
20030115821 Pervan Jun 2003 A1
20030159385 Thiers Aug 2003 A1
20030167717 Garcia Sep 2003 A1
20030196405 Pervan Oct 2003 A1
20030205013 Garcia Nov 2003 A1
20030233809 Pervan Dec 2003 A1
20040016196 Pervan Jan 2004 A1
20040035078 Pervan Feb 2004 A1
20040092006 Lindekens et al. May 2004 A1
20040105994 Lu et al. Jun 2004 A1
20040139678 Pervan Jul 2004 A1
20040159066 Thiers et al. Aug 2004 A1
20040177584 Pervan Sep 2004 A1
20040200165 Garcia et al. Oct 2004 A1
20040206036 Pervan Oct 2004 A1
20040237447 Thiers et al. Dec 2004 A1
20040237448 Thiers et al. Dec 2004 A1
20040241374 Thiers et al. Dec 2004 A1
20040244322 Thiers et al. Dec 2004 A1
20040250493 Thiers et al. Dec 2004 A1
20040255541 Thiers et al. Dec 2004 A1
20040258907 Kornfalt et al. Dec 2004 A1
20050003149 Kornfalt et al. Jan 2005 A1
20050016099 Thiers Jan 2005 A1
Foreign Referenced Citations (181)
Number Date Country
005566 Aug 2002 AT
713628 May 1998 AU
200020703 Jan 2000 AU
417526 Sep 1936 BE
557844 Jun 1957 BE
557844 Mar 1960 BE
09600527 Jun 1998 BE
09700344 Oct 1998 BE
991373 Jun 1976 CA
2226286 Dec 1997 CA
2252791 May 1999 CA
2289309 Jul 2000 CA
200949 Jan 1939 CH
211877 Jan 1941 CH
562377 May 1975 CH
314207 Sep 1919 DE
531989 Aug 1931 DE
740235 Oct 1943 DE
1089966 Sep 1960 DE
1534278 Feb 1966 DE
1212225 Mar 1966 DE
1212275 Mar 1966 DE
1534802 Apr 1970 DE
7102476 Jun 1971 DE
2007129 Sep 1971 DE
1534278 Nov 1971 DE
2252643 Oct 1972 DE
2238660 Feb 1974 DE
7402354 May 1974 DE
2454343 May 1976 DE
2616077 Oct 1977 DE
2917025 Nov 1980 DE
7911924 Mar 1981 DE
7928703 May 1981 DE
3041781 Jun 1982 DE
3214207 Nov 1982 DE
8226153 Jan 1983 DE
3343601 Jun 1985 DE
86040049 Jun 1986 DE
3512204 Oct 1986 DE
3246376 Feb 1987 DE
4004891 Sep 1990 DE
4002547 Aug 1991 DE
4134452 Apr 1993 DE
4242530 Jun 1994 DE
4011656 Jan 1995 DE
4324137 Jan 1995 DE
4107151 Feb 1995 DE
29517128 Feb 1996 DE
4242530 Sep 1996 DE
3544845 Dec 1996 DE
19532819 Mar 1997 DE
19532819 Mar 1997 DE
29710175 Sep 1997 DE
19616510 Mar 1998 DE
19651149 Jun 1998 DE
19709641 Sep 1998 DE
19718319 Nov 1998 DE
19751115 Mar 1999 DE
19751115 May 1999 DE
19735189 Jun 2000 DE
19903913 Aug 2000 DE
20001225 Aug 2000 DE
19925248 Dec 2000 DE
19941300 Mar 2001 DE
19941300 Mar 2001 DE
20017461 Mar 2001 DE
20018284 Mar 2001 DE
10012136 Sep 2001 DE
10019054 Dec 2001 DE
20206460 Aug 2002 DE
20218331 May 2004 DE
0248127 Dec 1987 EP
0574953 Dec 1993 EP
0623724 Nov 1994 EP
0652340 May 1995 EP
0667936 Aug 1995 EP
0690185 Jan 1996 EP
0849416 Jun 1998 EP
0698162 Sep 1998 EP
0903451 Mar 1999 EP
0855482 Dec 1999 EP
0877130 Jan 2000 EP
0969163 Jan 2000 EP
0969164 Jan 2000 EP
0974713 Jan 2000 EP
1026008 Aug 2000 EP
1026008 Aug 2000 EP
0843763 Oct 2000 EP
1200690 May 2002 EP
0958441 Jul 2003 EP
1026341 Aug 2003 EP
163421 Sep 1968 ES
460194 May 1978 ES
283331 May 1985 ES
1019585 Dec 1991 ES
1019585 Apr 1992 ES
2168045 May 2002 ES
843060 Aug 1984 FI
1293043 Apr 1962 FR
2691491 Nov 1983 FR
2568295 May 1986 FR
2623544 May 1989 FR
2630149 Oct 1989 FR
2637932 Apr 1990 FR
2675174 Oct 1991 FR
2691491 Nov 1993 FR
2697275 Apr 1994 FR
2712329 May 1995 FR
2776956 Oct 1999 FR
2781513 Jan 2000 FR
2785633 May 2000 FR
424057 Feb 1935 GB
585205 Jan 1947 GB
599793 Mar 1948 GB
636423 Apr 1950 GB
1237744 Jun 1968 GB
1127915 Sep 1968 GB
1275511 May 1972 GB
1399402 Jul 1975 GB
1430423 Mar 1976 GB
2117813 Oct 1983 GB
2126106 Mar 1984 GB
2152063 Jul 1985 GB
2238660 Jun 1991 GB
2243381 Oct 1991 GB
2256023 Nov 1992 GB
54-65528 May 1979 JP
57-119056 Jul 1982 JP
59-186336 Oct 1984 JP
3-169967 Jul 1991 JP
4-106264 Apr 1992 JP
5-148984 Jun 1993 JP
6-56310 May 1994 JP
6-146553 May 1994 JP
6-200611 Jul 1994 JP
6-320510 Nov 1994 JP
7-76923 Mar 1995 JP
7-180333 Jul 1995 JP
7-300979 Nov 1995 JP
7-310426 Nov 1995 JP
8-109734 Apr 1996 JP
8-270193 Oct 1996 JP
7601773 Feb 1976 NE
157871 Feb 1988 NO
305614 Jun 1999 NO
7114900-9 Sep 1974 SE
450411 Jun 1987 SE
450141 Sep 1987 SE
501014 Oct 1994 SE
501914 Jun 1995 SE
502994 Apr 1996 SE
506254 Nov 1997 SE
509059 Nov 1998 SE
509060 Nov 1998 SE
512290 Feb 2000 SE
512313 Feb 2000 SE
0000200-6 Aug 2001 SE
363795 Dec 1972 SU
8402155 Jun 1984 WO
8703839 Jul 1987 WO
8908539 Sep 1989 WO
9217657 Oct 1992 WO
9313280 Jul 1993 WO
9319910 Oct 1993 WO
9401628 Jan 1994 WO
9426999 Nov 1994 WO
9506176 Mar 1995 WO
9627719 Sep 1996 WO
9627721 Sep 1996 WO
9630177 Oct 1996 WO
9747834 Dec 1997 WO
9824495 Jun 1998 WO
9824994 Jun 1998 WO
9838401 Sep 1998 WO
9940273 Aug 1999 WO
9966151 Dec 1999 WO
9966152 Dec 1999 WO
0006854 Feb 2000 WO
0066856 Nov 2000 WO
0166876 Sep 2001 WO
Related Publications (1)
Number Date Country
20060182938 A1 Aug 2006 US
Divisions (1)
Number Date Country
Parent 10792270 Mar 2004 US
Child 11380597 US