Process for formation of three-dimensional photonic crystal

Abstract

A process for forming a three-dimensional photonic crystal comprises the steps of providing a base material having a first face and a second face adjoining to each other at a first angle, forming a first mask on the first face, dry-etching the first face in a direction at a second angle to the first face to remove a portion of the base material not protected by the first mask, forming a second mask on the second face, and dry-etching the second face in a direction at a third angle to the second face to remove a portion of the base material not protected by the second mask.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I and 1J are drawings for explaining an embodiment of production of the three-dimensional periodic structure of the present invention.

FIGS. 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, and 2I are drawings for explaining another embodiment of production of the three-dimensional periodic structure of the present invention.

FIG. 3 is a drawing for explaining examples of the shape of the cross-section of the rod of the three-dimensional periodic structure which can be produced by the present invention.

FIGS. 4A and 4B are drawings for explaining still another embodiment of production of the three-dimensional periodic structure of the present invention.

FIGS. 5A and 5B are drawings for explaining the shape of the mask for production of the three-dimensional periodic structure of the present invention.

FIGS. 6A and 6B are drawings for explaining the shape of the mask for production of the tree-dimensional structure of the present invention.

FIG. 7 is a schematic drawing of a three-dimensional photonic crystal having a woodpile structure.

Claims

1. A process for forming a three-dimensional photonic crystal, which comprises the steps of: providing a base material having a first face and a second face adjoining to each other at a first angle;forming a first mask on the first face;dry-etching the first face in a direction at a second angle to the first face to remove a portion of the base material not protected by the first mask;forming a second mask on the second face; anddry-etching the second face in a direction at a third angle to the second face to remove a portion of the base material not protected by the second mask.

2. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the base material of the three-dimensional crystal is a single crystal or a dielectric material in an amorphous state.

3. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the first mask and the second mask are respectively a patterned deposit formed on the first face or the second face by chemical vapor deposition induced by at least one energy beam selected from focused electromagnetic waves of electron beams, focused ion beams and laser beams.

4. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the first mask and the second mask are formed from at least one material selected from the group consisting of C, W, Mo, Ni, Au, Pt, GaN, Si, and SiO2, and contain impurity materials at a content not more than 50%.

5. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the process further comprises the steps of: forming a coating film on at least a part of the face of the base material before formation of the masks, andremoving selectively at least a part of the coating film by etching treatment after the formation of the masks.

6. The process for producing a three-dimensional photonic crystal according to claim 5, wherein the step of forming the coating film is conducted by heat-treating the base material in an environmental gas to allow the surface component of the base material to react with the environmental gas to form an oxide film or nitride film on at least a part of the surface of the base material.

7. The process for producing a three-dimensional photonic crystal according to claim 5, wherein, in the step of forming a coating film, the coating film is formed on at least a portion of the surface of the base material by chemical vapor deposition or atomic layer deposition.

8. The process for producing a three-dimensional photonic crystal according to claim 7, wherein the coating film is formed from at least one material selected from Cu, W, TiN, Si3N4, SiN and SiO2.

9. The process for producing a three-dimensional photonic crystal according to claim 5, wherein the etching treatment is conducted by any of reactive ion etching, directional accelerated particle beam etching, reactive gas etching, and corrosive liquid etching.

10. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the step of dry-etching is conducted by reactive ion etching, or directional accelerated particle beam etching.

11. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the first angle ranges from 10° to 170°.

12. The process for producing a three-dimensional photonic crystal according to claim 1, wherein the second angle and the third angle range respectively from 10° to 90°.