Process for forming a ceramic layer

Abstract
A process for forming a ceramic layer comprising a compound of a metal on a deposition surface of a workpiece comprises providing a reactive gas, selecting the amounts of a vapor of the metal and ions of the metal relative to each other, generating the metal vapor, and projecting an ion beam of the metal ions. The metal vapor, the metal ions, and the reactive gas form the ceramic layer with a desired structure. The process may include the step of controlling a deposition surface temperature. In one embodiment, the metal vapor comprises zirconium vapor and the ion beam comprises zirconium ions. The relative amounts of the zirconium vapor and the zirconium ions are selected to form a zirconia ceramic layer on the deposition surface. The zirconia may have multiple crystal phases that are formed according to a predetermined ratio.
Description
FIELD OF THE INVENTION

This invention relates to processes for forming ceramic layers, and, more particularly, to a process for forming a ceramic layer having a desired structure with a predetermined ratio of crystal phases.


BACKGROUND OF THE INVENTION

Ion beam assisted deposition (IBAD) is a process used to deposit thin, adherent coatings onto a surface of a substrate. In this process, the substrate is placed into a vacuum chamber and a vapor and an ion beam are simultaneously used to deposit the thin coating onto the substrate. Ion beam assisted deposition has been used to deposit many different materials, including, for example, zirconium dioxide.


Zirconium dioxide or zirconia has found application on orthopedic implants. Zirconia exhibits many of the preferred and desired attributes for use in vivo. For example, zirconia is biologically inert, hard, and can be formed as a smooth film on an articular surface of an orthopedic implant. Unfortunately, the use of zirconia is not without difficulty.


One difficulty is that zirconia, like many other oxide and nonoxide ceramics, has multiple phases. Zirconia has a monoclinic phase, a tetragonal phase, and a cubic phase. In particular, the difficulty with zirconia arises due to a volume expansion that a zirconia unit cell undergoes when it transforms from tetragonal to monoclinic. The volume expansion is approximately 4%. When zirconia transforms, the volume expansion results in an enormous stress increase within a product made of zirconia. In fact, the stresses that form in bulk components of pure zirconia will often cause spontaneous catastrophic failure of the component. In other applications, particularly in orthopedic implant applications, the phase transformation may result in surface roughening as isolated pockets of tetragonal zirconia transform into monoclinic zirconia, essentially causing the surface to buckle outward as it attempts to expand. Surface roughening on articular surfaces is unacceptable.


Therefore, what is needed in the art is a process for forming a ceramic layer where a particular crystal structure of the ceramic layer may be selected. In addition, what is needed in the art is a process that permits selection or adjustment of the relative amounts of the constituents according to a relationship between the constituents and the ceramic layer such that the ceramic layer is formed with a desired structure having a predetermined ratio of two or more crystal structures. Furthermore, what is needed is a process for forming a zirconia ceramic layer having a desired structure comprising two or more crystal phases, but that does not roughen due to tetragonal to monoclinic zirconia transformation.


SUMMARY OF THE INVENTION

The present invention provides a process for forming a ceramic layer comprising a compound of a metal on a deposition surface of a workpiece. An initial step of the process includes providing a reactive gas in fluid communication with the deposition surface. The process includes generating a vapor of the metal in fluid communication with the deposition surface. The process also includes projecting an ion beam comprising a plurality of ions of the metal on to the deposition surface. In addition, the process includes selecting an amount of the metal vapor relative to an amount of the metal ions. The process may include adjusting the ratio of the metal vapor to the metal ions. In summary, the deposition surface is in fluid communication with the reactive gas, the metal vapor, and the metal ions, which react at the selected amounts to form the ceramic layer with a desired structure on the deposition surface.


In another embodiment, the ceramic layer may comprise zirconia and the desired structure may be tetragonal, monoclinic, or cubic zirconia. In another embodiment of the invention, the desired structure may be formed in a predetermined ratio of at least two crystal phases by selecting the ratio of a zirconium vapor to a plurality of zirconium ions.


In another embodiment the workpiece is an orthopedic implant. The zirconia layer may be comprised of monoclinic, tetragonal, or cubic phases or a combination thereof formed on the orthopedic implant. In yet another embodiment, the zirconia layer may be formed in a predetermined ratio of the monoclinic phase to the tetragonal phase such that the monoclinic to tetragonal phase transformation is suppressed.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with a general description of the invention given above, and the detailed description given below, serve to explain the invention.



FIG. 1A is a process flow diagram of one embodiment of the process of the present invention;



FIG. 1B is an illustration of one embodiment of the process showing formation of a ceramic layer on a workpiece;



FIG. 2 is an illustration of an x-ray diffraction pattern taken of a ceramic layer comprising zirconia deposited according to one embodiment of the present invention;



FIG. 3 illustrates a relationship between a ratio of a beam power and an evaporator power (PB/PE) and a desired structure having a predetermined ratio (% Monoclinic);



FIG. 4 is another illustration of an x-ray diffraction pattern of a zirconia ceramic layer deposited according to one embodiment of the present invention;



FIG. 5 is another illustration of an x-ray diffraction pattern of a zirconia ceramic layer deposited according to one embodiment of the present invention;



FIG. 6 is a diagram of another embodiment of the process of the present invention;



FIG. 7 is a perspective view of one embodiment wherein the workpiece is a femoral hip ball; and



FIG. 8 is a cross-sectional view of the embodiment of FIG. 7, taken along section line 8-8.





DETAILED DESCRIPTION

One embodiment of a process for forming a ceramic layer 5 comprising a compound of a metal is illustrated by the process flow diagram of FIG. 1A and an apparatus 7 depicted in FIG. 1B. In an initial step of the process in 100, a workpiece 10 is positioned in a chamber 50 of the apparatus 7 and a reactive gas 20 is provided in fluid communication with a deposition surface 12 of the workpiece 10. The process further includes using an evaporator 30 to generate a vapor 32 of the metal and direct it to the workpiece 10, in 102, as depicted in FIG. 1B. The process further includes using an ion source 40 to form ions 42 of the metal. The metal ions 42 are projected, in 104, onto the deposition surface 12, generally in the form of an ion beam. The process further includes selecting the amount of the metal vapor 32 relative to the amount of the metal ions 42 in 106. The deposition surface 12 is thus exposed to the reactive gas 20, the metal vapor 32, and the metal ions 42, which react at selected amounts to form the ceramic layer 5 on the deposition surface 12. The process is not limited to the order as described herein. That is, the steps may be performed in other orders, including simultaneously.


In one embodiment, the process may also include adjusting the ratio of the metal vapor 32 to the metal ions 42 to deposit the ceramic layer 5 with another desired structure. Thus, in accordance with the inventive process, multiple desired structures may be interwoven or layered on the deposition surface 12 by adjusting the ratio of the metal vapor 32 to the metal ions 42 while forming the ceramic layer 5.


In another embodiment, the workpiece 10 and the reactive gas 20 are contained within the chamber 50 and the pressure, the flow rate, and the constituents of the reactive gas 20 are controlled through a supply port 52. The chamber 50 may also have a vacuum port 54 in fluid communication with a vacuum system (not shown) for reducing the pressure inside the chamber 50 prior to both generating the metal vapor 32 and forming the metal ions 42.


Selecting and adjusting the ratio of the metal vapor 32 to the metal ions 42, refers to choosing the ratio according to a relationship between the ratio of the metal vapor 32 to the metal ions 42 and the desired structure of the ceramic layers. The relationship being identified by prior variation of the ratio and quantification of the desired structure formed with each variation. For example, variations in the ratio of the metal vapor 32 to the metal ions 42 in conjunction with the reactive gas 20 are used to form a ceramic layer 5. The desired structure of the ceramic layer 5 for those variations is then quantified. The relationship between the ratio and the desired structure is thus established. Therefore, subsequent selection or adjustment of the ratio of the metal vapor 32 to the metal ions 42 forms the ceramic layer 5 having the desired structure. As the term is used herein, the desired structure is a crystal phase or phases deposited by the reaction of the metal vapor 32 and metal ions 42 and the reactive gas 20.


In one embodiment, the relationship between the ratio of the metal vapor 32 to the metal ions 42 is one that deposits a ceramic layer 5 having a desired structure containing at least two crystal phases. Furthermore, those crystal phases may be formed in a predetermined ratio. In other words, the amount of each crystal phase may be predicted. For example, the predetermined ratio may be represented by a volume of a first crystal phase to a volume of a second crystal phase. One skilled in the art will observe that adjusting or selecting another ratio of the metal vapor 32 to the metal ions 42 may produce a second ratio of the volumes of the first and second crystal phases. Therefore, the invention may permit layering multiple desired structures each having differing volumes of crystal phases. By way of example and not limitation, the crystal phases may comprise crystal phases for SiO2, ZrO2,TiO2, AS2O3, CaTiO3, Al2SiO5, BN, ZnS, FeS2, or other ceramic systems with polymorphic characteristics. As one skilled in the art will observe, a reactive gas 20 comprising oxygen will form oxides, while a reactive gas comprising sulfur or nitrogen will form sulfide compounds and nitride compounds, respectively.


In another embodiment, the deposition surface 12, illustrated in FIG. 1B, of the workpiece 10 has a deposition surface temperature. With reference now to FIG. 6, the process includes controlling the deposition surface temperature in 108. The deposition surface temperature may influence the desired structure. While FIG. 6 illustrates a process wherein the deposition surface temperature is set following selecting the ratio of the metal vapor 32 to the metal ions 42, the process may alternate between setting the deposition surface temperature and selecting the ratio of the metal vapor 32 to the metal ions 42. Furthermore, setting the deposition surface temperature may occur many times during the process.


In one embodiment of the invention, the impingement of the ion beam may produce a deposition surface temperature greater than room temperature. The deposition surface temperature is less than approximately 1000° C. and may be limited by the workpiece's 10 material properties, such as its melting point. Thus, controlling the deposition surface temperature may require a heating system or a cooling system to attain or maintain the deposition surface temperature. The heating system may be an electrical resistance heating system as is known in the art. With reference to FIG. 1B, the cooling system may be, for example, cooling fluid passing through a work stage 60 supporting the workpiece 10, or the cooling fluid may impinge upon the deposition surface 12 or pass through the workpiece 10 itself. In another embodiment, the deposition surface temperature is greater than approximately 200° C. to substantially prevent water or other tenacious molecules from adhering to the deposition surface 12. In yet another embodiment, the deposition surface temperature is less than approximately 600° C. to avoid inadvertent heat treatment of the workpiece 10 or possible reaction of the workpiece 10 with the metal vapor 32, the metal ions 42, or the reactive gas 20.


In one embodiment of the invention, with reference to FIG. 1B, the metal vapor 32 is zirconium vapor, the metal ions 42 are zirconium ions, and the reactive gas 20 is oxygen. The ceramic layer 5 formed is zirconium dioxide, referred to herein as zirconia. The oxidizing gas 20 may have a pressure of less than approximately 2×10−5 torr, or the partial pressure may be sufficient to oxidize substantially all of the zirconium ions 42 in the ion beam and the zirconium vapor 32 to form stoichiometric zirconia, i.e. ZrO2. In any case, the pressure of the oxidizing gas 20 does not substantially interfere with impingement of the ion beam onto the deposition surface 12. A relationship between a ratio of an amount of the zirconium vapor 32 to an amount of the zirconium ions 42 which thereby forms a zirconia ceramic layer 5 is illustrated in FIG. 3 and tabulated in TABLE 1.


With reference to TABLE 1 and FIG. 1B, the “Ion Beam” column tabulates an ion beam voltage and an ion beam current supplied to the ion source 40 for projecting the ion beam of zirconium ions 42 onto the deposition surface 12. The “Evaporator” column lists an evaporator voltage and an evaporator current supplied to the evaporator 30 for generating the zirconium vapor 32. The “PE/PB” column is a calculated ratio of an evaporator power to an ion beam power. Furthermore, the evaporator power (PE) is a product of the evaporator current and the evaporator voltage. Similarly, the ion beam power (PB) is a product of the ion beam current and the ion beam voltage. The “% Monoclinic” column in TABLE 1 represents the volume fraction of the desired structure that is monoclinic zirconia. The % Monoclinic of the desired structure may be determined by x-ray diffraction, as discussed below.



FIG. 3 is a plot of a portion of the data in TABLE 1. FIG. 3 illustrates a relationship between the ratio of the amount of the zirconium ions 42 to the amount of the zirconium vapor 32 and the desired structure of the zirconia ceramic layer 5. In one embodiment of the process, the evaporator power is related to the amount of the zirconium vapor 32 generated and projected onto the deposition surface 12, and the ion beam power is related to the amount of the zirconium ions 42 that impinge upon the deposition surface 12. As previously discussed, the PE/PB ratio is calculated from the ratio of the evaporator power and the ion beam power. Specifically, the PE/PB and % Monoclinic columns found in TABLE 1 are plotted as abscissa and ordinate in FIG. 3, respectively. Therefore, in general, as the evaporator power is increased relative to the ion beam power, the % Monoclinic in the desired structure approaches zero.














TABLE 1







Ion Beam

Evaporator


%












keV
μA
kV
mA
PE/PB
Monoclinic















60
500
9.5
450
142.5
48.6


60
500
9.5
450
142.5
46.3


60
500
9.5
450
142.5
41.9


60
500
9.5
450
142.5
50.5


50
500
9.5
450
171.0
23.8


40
500
9.5
450
213.8
20.0


30
250
9.5
450
570.0
5.6


30
250
9.5
450
570.0
0


20
250
9.5
450
855.0
6.9


20
250
9.5
450
855.0
4.8


20
250
9.5
450
855.0
3.1


20
250
9.5
450
855.0
0









Therefore, selection of a particular PE/PB ratio will form a zirconia ceramic layer 5. The zirconia ceramic layer 5 may have at least two crystal phases formed in a predetermined ratio. In other words, the zirconia ceramic layer 5 comprises, a monoclinic phase formed according to a known % Monoclinic, as shown in FIG. 3.


In accordance with one embodiment of the present invention, with reference to FIG. 3, by selecting PE/PB ratios of between approximately 50 and approximately 1000, the zirconia ceramic layer 5 is formed with a desired structure comprising two crystal phases, including tetragonal and monoclinic zirconia. The predetermined ratio may be selected as greater than approximately 0 and less than approximately 60% Monoclinic, per FIG. 3.


In another embodiment, during selecting and adjusting, the ion beam power may be adjusted by changing the ion beam current and/or the ion beam voltage. For example, referring to TABLE 1, the ion beam power increases when the ion beam voltage is increased from 30 keV to 40 keV and the ion beam current is increased from 250 μA to 500 μA. Thus, by adjusting the ion beam power or the evaporator power, or both, the PE/PB ratio may be selected to be between approximately 50 and approximately 1000. In another embodiment of the process, the ion beam power is selected such that the PE/PB ratio is between approximately 100 and approximately 900. As one skilled in the art will observe, the PE/PB may depend upon the type of metal vapor 32 and the metal ions 42. Therefore, the evaporator power and ion beam power may vary significantly for other types of metal. In another embodiment of the instant invention, during the step of adjusting the ion beam power, the ion beam voltage is adjusted to between approximately 20 keV and approximately 60 keV, and the ion beam current is adjusted to between approximately 250 μA and approximately 500 μA.


In another embodiment of the present invention, the monoclinic zirconia crystals may form with a preferred crystallographic orientation. FIGS. 2 and 5 are x-ray diffraction patterns of examples of the zirconia ceramic layer 5 formed according to one embodiment of the process. As shown in FIGS. 2 and 5, the (111) tetragonal and the (11 1) monoclinic peaks are present but the (111) monoclinic peak is absent from the x-ray diffraction pattern. As one skilled in the art will appreciate, the presence of the (11 1) monoclinic peak combined with the absence of the (111) monoclinic peak indicates a preferred orientation of the monoclinic crystals on the deposition surface. Therefore, during selecting or adjusting, the crystals may be formed with the preferred crystallographic orientation relative to the deposition surface 12.


In yet another embodiment, the predetermined ratio of monoclinic zirconia to tetragonal zirconia is selected to suppress the tetragonal to monoclinic phase transformation. As illustrated in FIGS. 1B, 7 and 8, the workpiece 10 is an orthopedic implant, and the process for forming the zirconia ceramic layer 5 is used to form the desired structure having a predetermined ratio of monoclinic zirconia to tetragonal zirconia on the deposition surface 12 of the orthopedic implant. By way of example and not limitation, the orthopedic implant may be a femoral hip ball implant or femoral knee implant, or other artificial joint. The zirconia ceramic layer 5 is formed as an articular surface on the orthopedic body. The predetermined ratio may be selected to suppress the tetragonal to monoclinic phase transformation such that the articular surface retains its smooth surface and does not roughen during use in vivo. In many of the embodiments, the zirconia ceramic layer 5 has a thickness 8 of less than approximately five microns for cost effective and efficient processing of orthopedic implants.


By way of example and not limitation, the desired structure was quantified with x-ray diffraction, as is known in the art. FIGS. 2, 4, and 5 are examples of x-ray diffraction data gathered from zirconia ceramic layers formed with one embodiment of the process of the present invention. A Scintag XDS 2000 x-ray diffractometer utilizing DMS 2000 software was used to gather the x-ray diffraction data. All scans were made in regular symmetric optics and a CuK-alpha radiation. An EG&G Ortec solid-state detector, model number GLP-10195/07-S was used to gather each x-ray diffraction pattern. Following phase identification, the relative volume of each crystal phase was determined by deconvoluting and peak fitting the x-ray diffraction patterns.


One method for quantifying the relative percentages of zirconia phases is with a method found in “Quantitative X-ray Diffraction Analysis of Polymorphic Mixes of Pure Zirconia,” P. A. Evans, R. Stevens and J. G. P. Binner, Br. Ceram. Trans. J., vol. 83, pp. 39-43, 1984, incorporated by reference herein. As detailed in the article, the method uses the following equation to estimate the volume percent of each phase within the ceramic layer.







f
t

=



I
t



(
111
)





I
m



(
111
)


+


I
m



(

11


1
_


)


+


I
t



(
111
)








Where:


ft is a volume fraction of tetragonal zirconia


It(111) is an integrated intensity of the tetragonal (111) peak


Im(111) is an integrated intensity of the monoclinic (111) peak


Im(11 1) is an integrated intensity of the monoclinic (11 1) peak


Ultimately, provided no cubic phase is detected, the fraction of monoclinic, fm, is derived from

fm=1−ft.


To determine the various integrated intensities (e.g. It(111), Im(111), Im(11 1)), background intensities were assumed to be linear over the narrow angular ranges used. The peaks were deconvoluted and fitted using a standard Pearson VII algorithm, as is known in the art.


As depicted in FIG. 2, in one exemplary x-ray diffraction pattern, the ceramic layer comprises both tetragonal and monoclinic zirconia. The ceramic layer has a (11 1) monoclinic diffraction peak and a (111) tetragonal diffraction peak indicating that the desired structure comprises two crystal phases of zirconia, i.e., a tetragonal zirconia and a monoclinic zirconia. Following peak fitting and deconvolution, the fraction of monoclinic, fm, may be calculated. In turn, fm may be used to calculate a percent monoclinic. As depicted in FIG. 3, the “% Monoclinic” represents the ratio of the monoclinic zirconia to the tetragonal zirconia. As shown in TABLE 1, the % Monoclinic calculated from the x-ray diffraction pattern, shown in FIG. 2, is 20.0.


While the present invention has been illustrated by the description of one or more embodiments thereof, and while the embodiments have been described in considerable detail, they are not intended to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. The invention is therefore not limited to the specific details, representative apparatus and process and illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the scope of the general inventive concept.

Claims
  • 1. A process for forming a ceramic layer comprising a compound of a metal on a deposition surface of an orthopedic implant, the process comprising: providing a reactive gas in fluid communication with the deposition surface of the orthopedic implant;generating a vapor of the metal in fluid communication with the deposition surface;projecting an ion beam comprising a plurality of ions of the metal onto the deposition surface; andselecting amounts of the vapor of the metal and the ions of the metal relative to each other, wherein the reactive gas, the vapor of the metal, and the ions of the metal react at the selected amounts to concurrently deposit two or more crystal phases of a ceramic material on the surface of the orthopedic implant to form a ceramic layer having the two or more crystal phases in a ratio that suppresses phase transformation between the monoclinic and tetragonal phases.
  • 2. The process of claim 1 wherein the deposition surface has a deposition surface temperature, and the process further comprises controlling the deposition surface temperature to between approximately 25° C. and approximately 1000° C.
  • 3. The process of claim 1 wherein the deposition surface has a deposition surface temperature, and the process further comprises controlling the deposition surface temperature to between approximately 200° C. and approximately 600° C.
  • 4. The process of claim 1 wherein the reactive gas has a partial pressure sufficient to react with substantially all of the vapor of the metal and the ions of the metal.
  • 5. The process of claim 1 wherein the reactive gas comprises oxygen having a partial pressure of less than approximately 2×10−5 torr, the vapor of the metal comprises zirconium vapor, and the ions of the metal comprises zirconium ions, and wherein the oxygen, the zirconium vapor, and the zirconium ions react to form the ceramic layer, wherein the ceramic layer is a zirconia ceramic layer having two or more crystal phases at a predetermined ratio.
  • 6. The process of claim 5 wherein the amounts of the zirconium vapor and the zirconium ions are selected relative to each other and the oxygen reacts with both the zirconium vapor and the zirconium ions to form the zirconia ceramic layer comprising two or more of a monoclinic phase, a tetragonal phase, or a cubic phase at the predetermined ratio on the deposition surface.
  • 7. The process of claim 5 wherein the amounts of the zirconium vapor and the zirconium ions are selected relative to each other and the oxygen reacts with both the zirconium vapor and the zirconium ions to form the zirconia ceramic layer wherein one of the crystal phases comprises a monoclinic phase, and wherein the monoclinic phase has a plurality of monoclinic crystals with a preferred crystallographic orientation on the deposition surface.
  • 8. The process of claim 5 wherein the amounts of the zirconium vapor and the zirconium ions are selected relative to each other and the oxygen reacts with both the zirconium vapor and the zirconium ions to form the zirconia ceramic layer wherein the crystal phases comprise a monoclinic phase and a tetragonal phase on the deposition surface.
  • 9. The process of claim 8 wherein the monoclinic phase and the tetragonal phase form in a predetermined ratio of a volume of the monoclinic phase to a volume of the tetragonal phase and the predetermined ratio is between greater than 0 and approximately 0.6.
  • 10. The process of claim 9 wherein the zirconium vapor is generated with an evaporator, an amount of the zirconium vapor is related to an evaporator power supplied to the evaporator, an amount of the zirconium ions in the ion beam is related to an ion beam power supplied to an ion source, and during selecting amounts of the zirconium vapor and the zirconium ions relative to each other, the ion beam power is selected such that a ratio of the evaporator power to the ion beam power is between approximately 50 and approximately 1000.
  • 11. The process of claim 10 wherein the ion beam power is determined by an ion beam voltage and an ion beam current, and during selecting the amount of the zirconium ions, the ion beam voltage is selected between approximately 20 keV and approximately 60 keV and the ion beam current is selected between approximately 250 μA and approximately 500 μA.
US Referenced Citations (333)
Number Name Date Kind
2987352 Watson Jun 1961 A
3605123 Hahn Sep 1971 A
3643658 Steinemenan Feb 1972 A
3677795 Bokros et al. Jul 1972 A
4004064 Kessler Jan 1977 A
4145764 Suzuki et al. Mar 1979 A
4487808 Lambert Dec 1984 A
4563489 Urist Jan 1986 A
4570271 Sump Feb 1986 A
4671824 Haygarth Jun 1987 A
4713076 Draenert Dec 1987 A
4923471 Morgan May 1990 A
5037438 Davidson Aug 1991 A
5084050 Draenert Jan 1992 A
5178201 Ahlers Jan 1993 A
5198308 Shetty Mar 1993 A
5258022 Davidson Nov 1993 A
5282861 Kaplan Feb 1994 A
5302414 Alkhimov Apr 1994 A
5316594 Kemp May 1994 A
5323954 Shetty Jun 1994 A
5324009 Kemp Jun 1994 A
5383934 Armini Jan 1995 A
5397796 Zoller Mar 1995 A
5399207 Kemp Mar 1995 A
5409703 McAnalley et al. Apr 1995 A
5447724 Helmus Sep 1995 A
5458653 Davidson Oct 1995 A
5464440 Johansson Nov 1995 A
5470829 Prisell Nov 1995 A
5492697 Boyan Feb 1996 A
5509899 Fan et al. Apr 1996 A
5529914 Hubbell Jun 1996 A
5534524 Bonewald Jul 1996 A
5535810 Compton Jul 1996 A
5543441 Rhee Aug 1996 A
5550178 Desai Aug 1996 A
5554594 Zoller Sep 1996 A
5565407 Southard Oct 1996 A
5569463 Helmus Oct 1996 A
5573934 Hubbell Nov 1996 A
5612052 Shalaby Mar 1997 A
5631011 Wadstrom May 1997 A
5658334 Caldarise Aug 1997 A
5658935 Kingler Aug 1997 A
5665118 LaSalle Sep 1997 A
5688855 Stoy Nov 1997 A
5713410 LaSalle Feb 1998 A
5714159 Shalaby Feb 1998 A
5736160 Ringeisen Apr 1998 A
5788979 Alt Aug 1998 A
5801033 Hubbell Sep 1998 A
5824651 Nanci Oct 1998 A
5834274 Hubbell Nov 1998 A
5843743 Hubbell Dec 1998 A
5866113 Hendriks Feb 1999 A
5893846 Bales Apr 1999 A
5925552 Keogh Jul 1999 A
5928916 Keogh Jul 1999 A
5932299 Katoot Aug 1999 A
5947893 Agrawal Sep 1999 A
5980974 Armini et al. Nov 1999 A
6004943 Shi Dec 1999 A
6080488 Hostettler et al. Jun 2000 A
6099562 Ding Aug 2000 A
6110483 Whitbourne et al. Aug 2000 A
6120536 Ding Sep 2000 A
6121027 Clapper Sep 2000 A
6153252 Hossainy Nov 2000 A
6166173 Mao Dec 2000 A
6176849 Yang et al. Jan 2001 B1
6177095 Swahney Jan 2001 B1
6179817 Zhong Jan 2001 B1
6197051 Zhong Mar 2001 B1
6238687 Mao May 2001 B1
6254634 Anderson Jul 2001 B1
6258121 Yang Jul 2001 B1
6284305 Ding Sep 2001 B1
6309660 Hsu Oct 2001 B1
6313119 Peyman Nov 2001 B1
6316522 Loomis Nov 2001 B1
6322797 Mao Nov 2001 B1
6368658 Schwarz Apr 2002 B1
6395023 Summers May 2002 B1
6395029 Levy May 2002 B1
6410044 Chudzik et al. Jun 2002 B1
6413539 Shalaby Jul 2002 B1
6451373 Hossainy Sep 2002 B1
6455541 Bonewald Sep 2002 B1
6461631 Dunn Oct 2002 B1
6486232 Wise Nov 2002 B1
6492356 Peyman Dec 2002 B1
6500481 Vanderlaan Dec 2002 B1
6506437 Harish Jan 2003 B1
6514515 Williams Feb 2003 B1
6514734 Clapper Feb 2003 B1
6528080 Dunn Mar 2003 B2
6540746 Buehler Apr 2003 B1
6544472 Compton Apr 2003 B1
6545097 Pinchuk Apr 2003 B2
6558734 Koulik May 2003 B2
6596402 Soerens Jul 2003 B2
6600010 Mao Jul 2003 B2
6613088 Babizhayev Sep 2003 B1
6620194 Ding Sep 2003 B2
6632446 Hubbell Oct 2003 B1
6656517 Michal Dec 2003 B2
6669980 Hansen Dec 2003 B2
6673385 Ding Jan 2004 B1
6692790 Liu Feb 2004 B2
6723350 Burrell Apr 2004 B2
6726725 Hunter et al. Apr 2004 B2
6730324 Troczynski May 2004 B2
6733768 Hossainy May 2004 B2
6743521 Hubbell Jun 2004 B2
6746685 Williams Jun 2004 B2
6749639 Lewallen Jun 2004 B2
6833192 Caruso Dec 2004 B1
6833363 Renier Dec 2004 B2
6855329 Shakesheff Feb 2005 B1
6866860 Nathan Mar 2005 B2
6869445 Johnson Mar 2005 B1
6872799 Nathan Mar 2005 B2
6881766 Hain Apr 2005 B2
6899107 Lewandrowski May 2005 B2
6899731 Li May 2005 B2
6921811 Zamora Jul 2005 B2
6923986 Pathak Aug 2005 B2
6923996 Epstein Aug 2005 B2
6945448 Medlin Sep 2005 B2
6946443 Blanchat Sep 2005 B2
6967234 Nathan Nov 2005 B2
6969400 Rhee Nov 2005 B2
6974625 Hunter et al. Dec 2005 B2
6986899 Hossainy Jan 2006 B2
6991681 Yoe Jan 2006 B2
6991802 Ahola Jan 2006 B1
6994883 Layrolle Feb 2006 B2
6998134 Schmidmaier Feb 2006 B2
7001421 Cheng Feb 2006 B2
7008979 Schottman Mar 2006 B2
7112361 Lynn Sep 2006 B2
7148209 Hoemann Dec 2006 B2
7157096 Zhang Jan 2007 B2
7163715 Kramer Jan 2007 B1
7185695 Santeler Mar 2007 B1
7186811 Lindholm Mar 2007 B2
7838083 Youchison et al. Nov 2010 B1
20020018798 Sewing Feb 2002 A1
20020041899 Chudzik Apr 2002 A1
20020082552 Ding Jun 2002 A1
20020084194 Redepenning Jul 2002 A1
20020087184 Eder Jul 2002 A1
20020103526 Steinke Aug 2002 A1
20020111590 Davilia Aug 2002 A1
20020119179 Rezania Aug 2002 A1
20020120333 Keogh Aug 2002 A1
20020131989 Brown Sep 2002 A1
20020151617 Mao Oct 2002 A1
20020165608 Llanos Nov 2002 A1
20020192182 Massia Dec 2002 A1
20030004568 Ken Jan 2003 A1
20030007991 Masters Jan 2003 A1
20030036794 Ragheb et al. Feb 2003 A1
20030083740 Pathak May 2003 A1
20030088307 Shulze May 2003 A1
20030099762 Zhang May 2003 A1
20030113478 Dang Jun 2003 A1
20030114937 Leatherbury Jun 2003 A1
20030117579 Morris Jun 2003 A1
20030118692 Wang Jun 2003 A1
20030124172 Lopez Jul 2003 A1
20030124368 Lynn Jul 2003 A1
20030129130 Guire Jul 2003 A1
20030157030 Davis Aug 2003 A1
20030185752 Nathan Oct 2003 A1
20030219562 Rypacek Nov 2003 A1
20030228364 Nathan Dec 2003 A1
20030229393 Kutryk Dec 2003 A1
20040033249 Sewing Feb 2004 A1
20040039441 Rowland Feb 2004 A1
20040044404 Stucke Mar 2004 A1
20040049265 Ding Mar 2004 A1
20040051201 Greenhalgh Mar 2004 A1
20040063654 Davis Apr 2004 A1
20040081745 Hansen Apr 2004 A1
20040086493 Hubbell May 2004 A1
20040086543 Keogh May 2004 A1
20040091462 Lin May 2004 A1
20040091603 Priewe May 2004 A1
20040093080 Helmus May 2004 A1
20040106985 Jang Jun 2004 A1
20040109892 Shalaby Jun 2004 A1
20040117007 Whitbourne Jun 2004 A1
20040120982 Diana Jun 2004 A1
20040126405 Sahatjian Jul 2004 A1
20040133271 Jang Jul 2004 A1
20040137066 Jayaraman Jul 2004 A1
20040138695 Li Jul 2004 A1
20040147999 Udipi Jul 2004 A1
20040157073 Burrell Aug 2004 A1
20040170752 Luthra Sep 2004 A1
20040172121 Eidenschink Sep 2004 A1
20040185086 Massia Sep 2004 A1
20040215313 Cheng Oct 2004 A1
20040215336 Udipi Oct 2004 A1
20040241202 Chluba Dec 2004 A1
20040241234 Vilkov Dec 2004 A1
20050015442 Eidenschink Jan 2005 A1
20050025752 Kutryk Feb 2005 A1
20050025799 Hossainy Feb 2005 A1
20050031689 Shults Feb 2005 A1
20050031793 Moeller Feb 2005 A1
20050036946 Pathak Feb 2005 A1
20050048121 East Mar 2005 A1
20050049694 Neary Mar 2005 A1
20050060028 Horres Mar 2005 A1
20050079200 Rathenow Apr 2005 A1
20050084515 Udipi Apr 2005 A1
20050085605 Nathan Apr 2005 A1
20050095267 Campbell May 2005 A1
20050101692 Sohier May 2005 A1
20050106204 Hossainy May 2005 A1
20050112170 Hossainy May 2005 A1
20050112172 Pacetti May 2005 A1
20050129731 Horres Jun 2005 A1
20050142393 Boutwell et al. Jun 2005 A1
20050147647 Glauser Jul 2005 A1
20050149171 McCullagh Jul 2005 A1
20050152955 Akhave Jul 2005 A1
20050153429 Liebmann-Vinson Jul 2005 A1
20050154450 Larson Jul 2005 A1
20050158359 Epstein Jul 2005 A1
20050159746 Grob et al. Jul 2005 A1
20050165128 Cohn Jul 2005 A1
20050169882 Lowe Aug 2005 A1
20050169969 Li Aug 2005 A1
20050180919 Tedeschi Aug 2005 A1
20050183259 Eidenschink Aug 2005 A1
20050187376 Pacetti Aug 2005 A1
20050187602 Eidenschink Aug 2005 A1
20050187611 Ding Aug 2005 A1
20050191333 Hsu Sep 2005 A1
20050208093 Glauser Sep 2005 A1
20050208100 Weber Sep 2005 A1
20050208200 Ding Sep 2005 A1
20050214339 Tang Sep 2005 A1
20050214916 Absar et al. Sep 2005 A1
20050215722 Pinchunk Sep 2005 A1
20050220837 Disegi Oct 2005 A1
20050220839 DeWitt Oct 2005 A1
20050220840 DeWitt Oct 2005 A1
20050220841 DeWitt Oct 2005 A1
20050220842 DeWitt Oct 2005 A1
20050220843 DeWitt Oct 2005 A1
20050244363 Hossainy Nov 2005 A1
20050244453 Stucke Nov 2005 A1
20050244459 DeWitt Nov 2005 A1
20050245637 Hossainy Nov 2005 A1
20050251250 Verhoeven Nov 2005 A1
20050255142 Chudzik Nov 2005 A1
20050266038 Glauser Dec 2005 A1
20050266077 Royer Dec 2005 A1
20050271700 DesNoyer Dec 2005 A1
20050271701 Cottone Dec 2005 A1
20050274478 Verner Dec 2005 A1
20050283224 King Dec 2005 A1
20050288229 Sindrey Dec 2005 A1
20060003008 Gibson Jan 2006 A1
20060008500 Chavan Jan 2006 A1
20060009839 Tan Jan 2006 A1
20060013850 Domb Jan 2006 A1
20060018948 Guire Jan 2006 A1
20060025848 Weber Feb 2006 A1
20060035854 Goldstein Feb 2006 A1
20060036311 Nakayama Feb 2006 A1
20060036316 Zeltinger Feb 2006 A1
20060039947 Schmidmaier Feb 2006 A1
20060039950 Zhou Feb 2006 A1
20060045901 Weber Mar 2006 A1
20060051978 Li et al. Mar 2006 A1
20060057277 Chappa Mar 2006 A1
20060067969 Lu Mar 2006 A1
20060093646 Cima May 2006 A1
20060105018 Epstein May 2006 A1
20060121081 Labrecque Jun 2006 A1
20060135652 Kasseh et al. Jun 2006 A1
20060165754 Ranade Jul 2006 A1
20060188541 Richelsoph Aug 2006 A1
20060198868 DeWitt Sep 2006 A1
20060204536 Shults Sep 2006 A1
20060204542 Zhang Sep 2006 A1
20060210598 Evans Sep 2006 A1
20060210602 Sehl Sep 2006 A1
20060216772 Grinstaff Sep 2006 A1
20060222681 Richard Oct 2006 A1
20060222756 Davila Oct 2006 A1
20060233801 Brunkow Oct 2006 A1
20060233841 Brodbeck Oct 2006 A1
20060233941 Olson Oct 2006 A1
20060233944 Popoola et al. Oct 2006 A1
20060240063 Hunter Oct 2006 A9
20060246103 Ralph Nov 2006 A1
20060246105 Molz Nov 2006 A1
20060246110 Brandon Nov 2006 A1
20060247793 Trieu Nov 2006 A1
20060251824 Boulais Nov 2006 A1
20060252981 Matsuda Nov 2006 A1
20060257377 Atala Nov 2006 A1
20060263830 Grinstaff Nov 2006 A1
20060263831 Grinstaff Nov 2006 A1
20060264531 Zhao Nov 2006 A1
20060286064 Turnell Dec 2006 A1
20060286071 Epstein Dec 2006 A1
20060293406 Bennett Dec 2006 A1
20070016163 Santini Jan 2007 A1
20070020308 Richard Jan 2007 A1
20070020469 Wood Jan 2007 A1
20070026043 Guan Feb 2007 A1
20070032882 Lodhi Feb 2007 A1
20070037737 Hoemmann Feb 2007 A1
20070038300 Bao Feb 2007 A1
20070041952 Guilak Feb 2007 A1
20070042017 Kutryk Feb 2007 A1
20070043374 Evans Feb 2007 A1
20070043433 Chandrasekaran Feb 2007 A1
20070045902 Brauker Mar 2007 A1
20070048291 Mang Mar 2007 A1
20070048292 Morita Mar 2007 A1
20070053963 Hotchkiss Mar 2007 A1
20070054127 Hergenrother Mar 2007 A1
20070055095 Chu Mar 2007 A1
20070055367 Kutryk Mar 2007 A1
Foreign Referenced Citations (17)
Number Date Country
657519 Sep 1986 CH
0372662 Jun 1990 EP
0616814 Mar 1994 EP
1055743 Nov 2000 EP
1273303 Jan 2003 EP
1144018 Mar 2004 EP
1806155 Jul 2007 EP
WO9307835 Apr 1993 WO
WO9628117 Sep 1996 WO
WO9738469 Oct 1997 WO
WO0139680 Jun 2001 WO
WO0182989 Nov 2001 WO
WO 03077772 Sep 2003 WO
WO2005120203 Dec 2005 WO
WO2007014279 Feb 2007 WO
WO2007038559 Apr 2007 WO
WO2007053022 May 2007 WO
Related Publications (1)
Number Date Country
20080312748 A1 Dec 2008 US