Claims
- 1. The process for implanting a metal in a desired amount on the surface of a metal substrate subject to wear during use which comprises contacting to said substrate a wire comprising a metal core surrounded by a sheath of a conductive metal, said sheath of conductive metal having a thickness between about 0.0001 and 0.002 inch and a conductivity greater than that of said core, applying an electrical voltage across said wire and substrate to generate an electrical discharge in order to (a) form a pit on said substrate, (b) to weld the wire in said pit and (c) to evaporate a small portion of the conductive sheath adjacent said pit thereby to leave a portion of said core uncoated, and generating a second discharge through said wire in order to sever only a portion of the uncoated core adjacent said substrate.
- 2. The process of claim 1 wherein the wire comprises tungsten with tungsten 185 surrounded by a copper sheath.
- 3. The process of claim 1 wherein the voltage used to generate each spark is between about 20 and 80 volts.
- 4. The process of claim 1 wherein said metal core is radioactive.
BACKGROUND OF THE INVENTION
The Government has rights in this invention pursuant to Grant No. 7401015 and IPA-0010 awarded by the National Science Foundation. The Government has rights in this invention pursuant to Grant No. ENV-7401015 awarded by the National Science Foundation.
US Referenced Citations (5)