Claims
- 1. In a process for electrolyzing brine into chlorine, hydrogen and caustic in an electrolytic cell using a hydrogen-evolution cathode with an active porous nickel surface, the improvement comprising employing as the cathode an electrode having a porous Raney nickel layer of between 100 and 400 microns, an average porosity of at least 11%, and an average agglomerate size of at least 35 microns, thereby lowering hydrogen overvoltage.
- 2. In a process for preparing an electrode having a continuous surface layer of active porous nickel in electrical contact with a conductive metal core by interdiffusing a nickel-aluminum alloy layer on the core and then selectively leaching aluminum from the interdiffused layer, the improvement comprising:
- providing the core with a nickel-bearing surface layer having a thickness of at least 100 microns and containing at least 15 percent by weight of nickel;
- interdiffusing aluminum and at least a portion of the nickel in the surface layer of the core at a temperature of at least 660.degree. C. for a time sufficient to provide the interdiffused nickel-aluminum alloy layer with a thickness of at least 85 microns; and
- selectively leaching, with an aqueous base, sufficient aluminum from the interdiffused alloy layer to provide an electrode having a continuous surface layer of active porous Raney nickel in electrical contact with, and metallurgically bonded to, the conductive metal core, said Raney nickel layer having a thickness of between 100 and 400 microns, an average porosity of at least 11%, and an averge agglomerate size of at least 35 microns.
- 3. The process of claim 2, comprising providing the nickel-bearing surface layer of the core with at least 18 percent by weight of nickel.
- 4. The process of claim 3, comprising providing the nickel-bearing surface layer with substantially pure nickel.
- 5. The process of claim 4, comprising providing the core of mild steel with a coating of nickel.
- 6. The process of claim 5, comprising coating the nickel-coated core with a layer of aluminum of at least 100 microns in thickness.
- 7. The process of claim 4, comprising forming an interdiffused layer containing Ni.sub.2 Al.sub.3 grains having an average size between 3 and 75 microns.
- 8. The process of claim 7, comprising adjusting the temperature and time of interdiffusion to provide the interdiffused layer with a thickness between 100 and 400 microns in which the Ni.sub.2 Al.sub.3 grains have an average size between 5 to 60 microns, and controlling leaching, temperature, time and base concentration to provide a porous Raney nickel layer with a thickness between 100 to 400 microns and an average porosity between 15 and 25%.
- 9. The process of claim 2, comprising employing a temperature of interdiffusion no greater than 1000.degree. C.
- 10. The process of claim 9, comprising employing a temperature between 750.degree. C. and 875.degree. C.
- 11. The process of claim 2, comprising selectively leaching at least 60% of the aluminum from the interdiffused nickel-aluminum alloy layer.
- 12. The process of claim 11, comprising selectively leaching 75 to 95% of the aluminum from the interdiffused layer.
- 13. The process of claim 2, comprising treating the electrode to prevent pyrophoricity of the porous nickel layer in air, by immersing the electrode for one to four hours in a dilute aqueous inorganic solution of an inorganic salt selected from the group consisting of NaNO.sub.3, K.sub.2 Cr.sub.2 O.sub.7 and mixtures of NaClO.sub.3 and NaOH.
- 14. The process of claim 2, comprising the additional step of covering the Raney nickel surface with a coating of nickel of 5 to 10 microns in thickness.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a division of copending application bearing Ser. No. 742,615, filed on Nov. 17, 1976, now U.S. Pat. No. 4,116,804.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3407231 |
Dickinson et al. |
Oct 1968 |
|
3846344 |
Larson et al. |
Nov 1974 |
|
4086149 |
Martinsons et al. |
Apr 1978 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
742615 |
Nov 1976 |
|