Process for making contained layers and devices made with same

Abstract

There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy;treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy;exposing the treated first layer with radiation; andforming the second layer. There is also provided an organic electronic device made by the process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated in the accompanying figures to improve understanding of concepts as presented herein.

FIG. 1 includes a diagram illustrating contact angle.

FIG. 2 includes an illustration of an organic electronic device.

FIG. 3 includes an illustration of a substrate with anode lines.

FIG. 4 includes an illustration of the substrate of FIG. 3 coated with a buffer material.

FIG. 5 includes an illustration of the substrate of FIG. 4 further coated with a reactive surface-active composition.

FIG. 6 includes an illustration of the substrate of FIG. 5 after exposure and development.

Claims

1. A process for forming a contained second layer over a first layer, said process comprising: forming the first layer having a first surface energy;treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy;exposing the treated first layer with radiation; andforming the second layer.

2. The process of claim 1, wherein the reactive surface-active composition is a fluorinated material.

3. The process of claim 1, wherein the reactive surface-active composition is a radiation-hardenable material.

4. The process of claim 1, wherein the reactive surface-active composition is a crosslinkable fluorinated surfactant.

5. The process of claim 1, wherein the reactive surface-active composition is deposited with the first layer.

6. The process of claim 1, wherein the reactive surface-active composition is applied as a separate layer over the first layer.

7. The process of claim 1, wherein the radiation is applied in a pattern to form exposed regions and unexposed region of the reactive surface-active composition.

8. The process of claim 7, further comprising removing either the exposed or unexposed regions of the reactive surface-active composition.

9. The process of claim 8, wherein the regions are removed by treating with a liquid.

10. The process of claim 8, wherein the regions are removed by heating.

11. The process of claim 8, wherein the regions are removed by contacting an outermost surface of the with an absorbent surface to absorb or wick away the softer regions.

12. A process for making an organic electronic device comprising a first organic active layer and a second organic active layer positioned over an electrode, said process comprising forming the first organic active layer having a first surface energy over the electrodetreating the first organic active layer with a reactive surface-active composition to form a treated first organic active layer,exposing the treated first organic active layer with radiation, thereby reducing the first surface energy, andforming the second organic active layer.

13. An organic electronic device comprising a first organic active layer and a second organic active layer positioned over an electrode, and further comprising a reactive surface-active composition between the first organic active layer and the second organic active layer.