Claims
- 1. A process for the preparation of microporous films of ultrahigh molecular weight polyethylene (UHMWPE) by forming a film from a solution of ultrahigh molecular weight polyethylene in an evaporable and dissolving solvent and removing that solvent from the film, wherein the solution of UHMWPE in the evaporable and dissolving solvent is formed into a film and the solvent is evaporated from the film at a temperature below the dissolution temperature and the shrinkage which can then occur in the film during evaporation is prevented in at least one direction in the plane of the film or the film is stretched in one or more directions in the plane of the film, such that porosity of the film is effected by the shrinkage prevention or by the stretching, the stretching occurring during evaporation of the solvent, after evaporation of the solvent, or a combination thereof.
- 2. A process according to claim 1, wherein said solvent has a boiling point under atmospheric pressure of at most 300.degree. C.
- 3. A process according to claim 1, wherein said solvent has a boiling point under atmospheric pressure of at most 250.degree. C.
- 4. A process according to claim 1, wherein said solvent has a boiling point under atmospheric pressure of at most 225.degree. C.
- 5. A process according to claim 1, wherein the solution is a 2-30 wt. % solution of ultrahigh molecular weight polyethylene.
- 6. A process according to claim 1, wherein after the solvent is evaporated from the film, the film is stretched in one or more directions at a temperature below the melting point of the UHMWPE.
- 7. A process according to claim 1, wherein the solvent is selected from the group consisting of toluene, xylenes, monochlorobenzene, nonane, undecane and dodecane.
- 8. A process according to claim 1, wherein said solvent is a halogenated hydrocarbon having a boiling point below 300.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8900078 |
Jan 1989 |
NLX |
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Parent Case Info
This is a continuation of application Ser. No. 07/754,158, filed Sep. 3, 1991, now U.S. Pat. No. 5,248,461, which is a continuation of application Ser. No. 07/464,026, filed Jan. 12, 1990, now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0283187 |
Sep 1988 |
EPX |
Continuations (2)
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Number |
Date |
Country |
Parent |
754158 |
Sep 1991 |
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Parent |
464026 |
Jan 1990 |
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