Claims
- 1. A method for manufacture of a sensor element assembly wherein sensor elements are provided on a plastic film formed of polyvinylidine difluoride (PVDF) so as to form a sensor arrangement, said sensor arrangement being accommodated in a retaining frame, comprising steps of:
- providing a plastic film formed of polyvinylidine difluoride (PVDF) as a band and providing metal at both sides of the plastic film band while leaving metal-free edge strips at both sides along a longitudinal direction of said band, providing metal-free strips which run in quasi-meander-like fashion on first and second sides of the band in a pattern and configuration desired for forming electrodes for a first sensor element and two further sensor elements, and cutting the band into individual films each having the first and two further sensor elements;
- manufacturing said retaining frame by providing two wires running off from supply reels and by providing first and second frame parts having channels, pegs, and holes for receiving the pegs, securing said wires in the channels to serve as connection lines from the sensor electrodes to an evaluation means, and providing a plurality of at least the first frame parts secured along the wires with spacings therebetween corresponding to a desired length of the wires such that when after they are cut, plug pins of an appropriate length are provided; and
- separating the first frame parts from one another by cutting the two wires at the length desired for the plug pins, placing the film with sensor elements thereon between the first and second frame parts and retaining them together by push-button connection.
- 2. A method according to claim 1 including the steps of metallizing said band in a silk-screening process and thus generating said quasi-meander-like strips.
- 3. A method according to claim 1 including the steps of metallizing said band by one of the processes selected-from the group consisting of vapor-deposition or by cathode sputtering of one of the metals selected from the group consisting of aluminum, zinc, tin, copper, silver, gold, or one of the metals of the platinum group, and generating said quasi-meander-like strips by one of the processes selected from the group consisting of electro-erosion, chemical etching, laser energy, or mechanical grinding.
- 4. A method according to claim 1 wherein after producing said band with the electrodes thereon, providing the electrodes as one of the elements copper or silver and passing the film through a vessel having hydrogen sulfide H.sub.2 S therein and converting a surface of said copper or silver layers into a respective sulfide CuS or Ag.sub.2 S.
- 5. A method according to claim 1 including the step of securing both the first and second frame parts to the two wires running off from the supply reels.
- 6. A method for manufacture of a sensor element assembly, comprising steps of:
- providing a band of plastic film and providing metal at both sides of the plastic film;
- providing metal-free strips which run in quasi-meander-like fashion on first and second sides of the band in a repeating pattern and configuration along the band so as to form a repeating pattern of electrodes for a first sensor element and two further sensor elements;
- dividing the band into individual films each having the first and two further sensor elements thereon;
- manufacturing a retaining frame for receiving the individual films by providing two wires running off from a supply source, by providing a plurality of first and second frame parts, and by mounting a plurality of said first frame parts in repeating fashion along the two wires;
- placing the individual films into the first frame parts;
- securing said second frame parts to the first frame parts; and
- cutting the two wires between the first frame parts so as to provide a plurality of sensor element assemblies.
Priority Claims (2)
Number |
Date |
Country |
Kind |
3532454 |
Sep 1985 |
DEX |
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36187321 |
Jun 1986 |
DEX |
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Parent Case Info
This is a division, of application Ser. No. 898,411, filed Aug. 20, 1986.
US Referenced Citations (4)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0023354 |
May 1983 |
EPX |
2930632 |
Mar 1982 |
DEX |
3028252 |
Mar 1982 |
DEX |
3216664 |
Nov 1983 |
DEX |
3230728 |
Feb 1984 |
DEX |
Non-Patent Literature Citations (1)
Entry |
Electronics, Jun. 16, 1982, 8032 Electronics International, vol. 55 (1982), No. 12, pp. 84 and 86. |
Divisions (1)
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Number |
Date |
Country |
Parent |
898441 |
Aug 1987 |
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