Claims
- 1. A process of making a vinyl caprolactam (VCL)-based polymer by suspension polymerization of the monomers in water in the absence of an added protective colloid, said polymer contains at least 40% by wt. VCL, and the rest is vinyl pyrrolidone (VP) monomer and/or a linear, acylic N-vinylamide monomer, where M3 is N-vinyl formamide (NVF), N-vinylacetamide (NVA) or N-vinyl-N-methylacetamide (VIMA), at a polymerization temperature which is at least 15° C. higher than the cloud point of said polymer, by the steps of: (a) feeding over time a monomer pre-mix comprising VP and/or M3, and initiator, into a reaction vessel containing water as solvent heated to said polymerization temperature, thereby to generate in-situ copolymer which can function as a dispersing agent for said polymer during the polymerization, (b) thereafter feeding the VCL monomer, and the rest of the VP and/or M3 monomer, and initiator, into said vessel over a predetermined period, and (c) polymerizing said monomers with said dispersing copolymer therein to provide, upon cooling to room temperature, a clear, viscous aqueous polymer solution.
- 2. A process according to claim 1 where M3 is N-vinyl formamide (NVF), N-vinylacetamide (NVA) or N-vinyl-N-methylacetamide (VIMA).
- 3. A process according to claim 1 wherein the monomers are VCL and VIMA.
- 4. A process according to claim 1 wherein the monomers are VCL and NVF.
- 5. A process according to claim 1 wherein the monomers are VCL and NVA.
- 6. A process according to claim 1 wherein the monomers are VCL, VP and VIMA.
- 7. A suspension polymerization process according to claim 1 wherein the first monomer feed comprises a premix of VP and/or M3 which corresponds to about 2 to 25% the weight of the total monomers in the polymer composition.
- 8. A process according to claim 1 which is carried out at a polymerization temperature which is at least 35° C. higher than the cloud point of the polymer.
- 9. A process according to claim 1 which polymer contains at least 50% by wt. VCL.
CROSS-REFERENCE TO RELATED PATENT APPLICATION
[0001] This application is related to U.S. Ser. No. 09/346,213, filed Jul. 1, 1999, now U.S. Pat. No. 6,225,429, issued May 1, 2001.