Number | Name | Date | Kind |
---|---|---|---|
4782036 | Becker et al. | Nov 1988 | |
5182224 | Kim et al. | Jan 1993 | |
5200354 | Om et al. | Apr 1993 | |
5352622 | Chung | Oct 1994 | |
5482883 | Rajeevakumar | Jan 1996 | |
5616961 | Kohyama | Apr 1997 | |
5618751 | Golden et al. | Apr 1997 | |
5656535 | Ho et al. | Aug 1997 | |
5693568 | Liu et al. | Dec 1997 | |
5710061 | Cleeves | Jan 1998 | |
6057216 | Economikos et al. | May 2000 |
Number | Date | Country |
---|---|---|
735581 | Oct 1996 | EP |
791959 | Aug 1997 | EP |
306061 | Jun 1901 | TW |
Entry |
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IBM Technical Disclosure Bulletin vol. 27, No. 11, Apr. 1985. |
Isolation Trench Filling by M. Arienzo and R.D. Isaac. |