Claims
- 1. A process for preparing a partially cured powdery polyarylene sulfide resin prior to molding said resin or applying said resin to a substrate, which comprises the steps of adding to a powdery, uncured virgin polyarylene sulfide resin at least one additive selected from the group consisting of non-hydrophobic silica and hydrophobic silica and mixtures thereof in a proportion of 0.05-0.6 parts by weight per 100 parts by weight of the resin and then heating and mixing the resin at temperatures in the range of a temperature just below the melting point of the resin down to a temperature lower by 80.degree. C. than said melting point so as to partially cure the resin and increase the melt viscosity thereof to a level suitable for use in molding.
- 2. A process according to claim 1, wherein the resin is polyphenylene sulfide.
- 3. A process according to claim 1, wherein the curing temperature ranges from a temperature just below the melting point down to a temperature lower by 10.degree.-70.degree. C. than the melting point.
- 4. A process according to claim 2, wherein the curing temperature ranges from a temperature just below the melting point down to a temperature lower by 10.degree.-70.degree. C. than the melting point.
- 5. A process according to claim 1, wherein the heating time ranges from 30 minutes to 10 hours.
Priority Claims (1)
Number |
Date |
Country |
Kind |
61-280894 |
Nov 1986 |
JPX |
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Parent Case Info
This is a continuation of application Ser. No. 125,417, filed Nov. 25, 1987, now abandoned.
US Referenced Citations (8)
Continuations (1)
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Number |
Date |
Country |
Parent |
125417 |
Nov 1987 |
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