Claims
- 1. A process for making a compound of the formula
- 2. The process of claim 1 wherein the copper halide salt is CuCl, CuBr, CuI, or CuCl2.
- 3. The process of claim 2 wherein the organic diamine compound is N,N,N′,N′-tetraethylethylene diamine, N,N,N′,N′-tetraethyl-1,3-propanediamine, N,N,N′,N′-tetraethylmethane diamine, N,N,N′,N′-tetramethyl-1,6-hexanediamine, N,N,N′,N′-tetramethyl-1,3-propanediamine, dipiperidinomethane, N,N,N′,N′-tetramethylethylene diamine or 1,4-diazabicyclo-(2,2,2)-octane.
- 4. The process of claim 3 wherein R2, R3, and R4 are each methyl or ethyl.
- 5. A compound of the formula
- 6. A compound of claim 5 wherein
R1 is methyl or isopropyl; R2 is H or methyl; R3 is methyl, isopropyl, or t-butyl; and R4 is methyl.
- 7. A compound of claim 6 wherein
R1 is isopropyl; R2 is H; R3 is isopropyl; and R4 is methyl.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser. No. 09/994,133, filed on Nov. 26, 2001, which is incorporated as a part hereof.
Continuations (1)
|
Number |
Date |
Country |
Parent |
09994133 |
Nov 2001 |
US |
Child |
10282469 |
Oct 2002 |
US |